Semiconductor device
A semiconductor device includes a semiconductor layer and a trench gate portion that extends toward a deep portion from a front surface of the semiconductor layer. The semiconductor layer includes an island region surrounded by the trench gate portion. A first side surface of the trench gate portion and a second side surface of the trench gate portion are in contact with the island region. A first conductivity type contact region that includes a first contact region that is in contact with the first side surface and a second contact region that is in contact with the second side surface is provided in the island region. Moreover, a second conductivity type contact region that is in contact with the trench gate portion at a position between the first contact region and the second contact region is provided in the island region.
1. A semiconductor device comprising a semiconductor layer and a trench gate portion that extends toward a deep portion from a front surface of the semiconductor layer,
wherein the semiconductor layer comprises:
a drift region which is of a first conductivity type;
a body region which is of a second conductivity type and is provided on a surface of the drift region;
a first conductivity type contact region that is provided in a portion of a surface layer of the body region, and is separated from the drift region by the body region; and
a second conductivity type contact region that is provided in another portion of the surface layer of the body region, and includes second conductivity type impurities of a higher concentration than that in the body region,
the semiconductor layer comprises an island region surrounded by the trench gate portion in a plan view,
the trench gate portion includes a first side surface that is in contact with the island region and a second side surface that is in contact with the island region and is different from the first side surface,
the first conductivity type contact region includes a first contact region that is in contact with the first side surface in the island region and a second contact region that is in contact with the second side surface in the island region, and
the second conductivity type contact region is in contact with the trench gate portion at a position between the first contact region and the second contact region.
2. The semiconductor device according to claim 1 , wherein
the first side surface of the trench gate portion and the second side surface of the trench gate portion are parallel to each other,
the trench gate portion further comprises a third side surface being in contact with the island region and extending between the first side surface and the second side surface,
the second conductivity type contact region is in contact with the first side surface in a range from a corner formed by the first side surface and the third side surface to the first contact region, and
the second conductivity type contact region is further in contact with the second side surface in a range from a corner formed by the second side surface and the third side surface to the second contact region.
3. The semiconductor device according to claim 2 , wherein the second conductivity type contact region is in contact with the corner formed by the first side surface and the third side surface and is in contact with the corner formed by the second side surface and the third side surface.
4. The semiconductor device according to claim 3 , wherein the second conductivity type contact region is not in contact with a portion of the third side surface.
5. The semiconductor device according to claim 4 , wherein an impurity concentration of the body region that is located in a gap between the second conductivity type contact region and the third side surface is lower than a peak impurity concentration of the body region.