IP Library Granted Patent US 9,614,061
Granted Patent B2
US 9,614,061 · App. 15/188,998 · Granted Apr 4, 2017

Semiconductor device having fin structure that includes dummy fins

Inventor: En-Chiuan Liou (Tainan, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L29/6681H01L21/28518H01L21/76895H01L21/823431H01L29/161H01L29/165H01L29/24H01L29/267H01L29/41791H01L29/66795H01L29/785H01L29/7845H01L29/7848H01L29/7853H01L29/7854H01L29/7856H01L2029/7858
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Quick Facts
Patent No.
US 9,614,061
App. No.
15/188,998
Granted
Apr 4, 2017
Kind
B2
Abstract

A semiconductor device includes: a substrate, a fin-shaped structure on the substrate, and a dummy fin-shaped structure on the substrate and adjacent to the fin-shaped structure. Preferably, the fin-shaped structure includes a gate structure thereon and a first epitaxial layer adjacent to two sides of the gate structure, and the dummy fin-shaped structure includes a second epitaxial layer thereon. A contact plug is disposed on the first epitaxial layer and the second epitaxial layer. In addition, the dummy fin-shaped structure includes a curve, in which the curve is omega shaped.

Claims (5)

1. A semiconductor device, comprising:

a substrate;

a fin-shaped structure on the substrate; and

a dummy fin-shaped structure on the substrate and adjacent to the fin-shaped structure, wherein the fin-shaped structure and the dummy fin-shaped structure comprise same material and the dummy fin-shaped structure comprises a curve.

2. The semiconductor device of claim 1 , wherein the curve is omega shaped.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2016
From: LIOU, EN-CHIUAN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 038978/0611 →
Priority Claims (1)
TW 103142048 A · Dec 3, 2014 · national
Continuity (2)
Continuation 14588989 · Jan 5, 2015
Related Publication 20160300923A1 · Oct 13, 2016