High-voltage metal-oxide-semiconductor transistor and fabrication method thereof
A high-voltage MOS transistor includes a semiconductor substrate, a gate oxide layer on the semiconductor substrate, a gate on the gate oxide layer, a spacer covering a sidewall of the gate, a source on one side of the gate, and a drain on the other side of the gate. The gate includes at least a first discrete segment and a second discrete segment. The first discrete segment is not in direct contact with the second discrete segment. The spacer fills into a gap between the first discrete segment and the second discrete segment.
1. A high-voltage MOS transistor, comprising:
a semiconductor substrate;
a gate oxide layer on the semiconductor substrate;
a gate on the gate oxide layer, wherein the gate comprises at least a first discrete segment and a second discrete segment, and wherein the first discrete segment is not in direct contact with the second discrete segment, wherein the first discrete segment and the second discrete segment are electrically connected together through a metal layer and two separated contact plugs physically apart from each other, and wherein the first discrete segment and the second discrete segment are substantially coplanar;
a spacer covering a sidewall of the gate and filling into a gap between the first discrete segment and the second discrete segment;
a source in the semiconductor substrate and on one side of the gate; and
a drain in the semiconductor substrate and on the other side of the gate.
2. The high-voltage MOS transistor according to claim 1 , wherein the gate is a metal gate.
3. The high-voltage MOS transistor according to claim 1 , wherein a channel region is disposed between the source and the drain.
4. The high-voltage MOS transistor according to claim 3 , wherein the first discrete segment and the second discrete segment are disposed directly on the channel region.
5. The high-voltage MOS transistor according to claim 4 , wherein the gap is disposed directly on the channel region.
6. The high-voltage MOS transistor according to claim 5 , wherein the gap is completely filled with the spacer.
7. The high-voltage MOS transistor according to claim 3 , wherein the semiconductor substrate has a first conductivity type.
8. The high-voltage MOS transistor according to claim 7 , wherein an ion well having the first conductivity type is disposed in the semiconductor substrate.
9. The high-voltage MOS transistor according to claim 8 , wherein the source S comprises a first drift well having a second conductivity type in the ion well, and the first drift well is partially overlapped with the gate, and wherein the drain D comprises a second drift well having the second conductivity type in the ion well, and the second drift well is partially overlapped with the gate, and wherein the channel region is situated between the first drift well and the second drift well.
10. The high-voltage MOS transistor according to claim 9 , wherein the high-voltage MOS transistor is a filed drift MOS transistor, and wherein at least a first shallow trench isolation (STI) region is disposed in the first drift well, and a second STI region is disposed in the second drift well.
11. The high-voltage MOS transistor according to claim 9 , wherein the high-voltage MOS transistor is a double diffused drain MOS transistor.
12. The high-voltage MOS transistor according to claim 1 , wherein a length of the first discrete segment or the second discrete segment is not greater than a predetermined value, wherein the predetermined value is 2 μm.
13. The high-voltage MOS transistor according to claim 1 , wherein the first discrete segment and the second discrete segment have a rectangular shape.
14. The high-voltage MOS transistor according to claim 1 , wherein the first discrete segment and the second discrete segment have a shape other than rectangular shape.