Reducing or eliminating nanopipe defects in III-nitride structures
Embodiments of the invention include a III-nitride light emitting layer disposed between an n-type region and a p-type region, a III-nitride layer including a nanopipe defect, and a nanopipe terminating layer disposed between the III-nitride light emitting layer and the III-nitride layer comprising a nanopipe defect. The nanopipe terminates in the nanopipe terminating layer.
1. A device comprising:
a III-nitride light emitting layer disposed between an n-type region and a p-type region; and
a III-nitride layer doped with an acceptor having a concentration that increases linearly across the III-nitride layer such that a concentration of acceptor is higher in a portion of the III-nitride layer doped with an acceptor closer to the light emitting layer than in a portion of the III-nitride layer doped with an acceptor further from the light emitting layer, the III-nitride layer doped with an acceptor being positioned such that the n-type region is disposed between the III-nitride layer doped with an acceptor and the light emitting layer.
2. The device of claim 1 further comprising a layer comprising a nanopipe defect, wherein the III-nitride layer doped with an acceptor is in contact with the layer comprising the nanopipe defect and disposed between the layer comprising the nanopipe defect and the light emitting layer, wherein the nanopipe defect terminates in the III-nitride layer doped with an acceptor.
3. The device of claim 1 wherein the acceptor is magnesium.
4. The device of claim 3 where the III-nitride layer doped with an acceptor is electrically connected in common with the n-type region.
5. The device of claim 1 wherein the III-nitride layer doped with an acceptor is a first magnesium-doped layer, the device further comprising a second magnesium doped layer disposed between the first magnesium-doped layer and the light emitting layer.
6. The device of claim 5 wherein the first magnesium-doped layer is doped to a lower magnesium concentration than the second magnesium-doped layer.
7. The device of claim 1 further comprising a layer comprising one of aluminum or indium disposed between the III-nitride layer doped with an acceptor and the III-nitride light emitting layer.
8. The device of claim 1 wherein the III-nitride light emitting layer is spaced at least 1 micron from the III-nitride layer doped with an acceptor.
9. The device of claim 1 further comprising a layer comprising a nanopipe defect.
10. A device comprising:
a III-nitride light emitting layer disposed between an n-type region and a p-type region; and
a III-nitride layer doped with an acceptor, the III-nitride layer comprising a stack of sublayers, the acceptor having a concentration that is linearly graded across the III-nitride layer such that each sublayer has a higher acceptor concentration than a previous sublayer and such that the concentration of acceptor is higher in a portion of the III-nitride layer doped with an acceptor closer to the light emitting layer than in a portion of the III-nitride layer doped with an acceptor further from the light emitting layer, the III-nitride layer doped with an acceptor being positioned such that the n-type region is disposed between the III-nitride layer doped with an acceptor and the light emitting layer.
11. The device of claim 10 further comprising a layer comprising a nanopipe defect, such that the III-nitride layer doped with an acceptor is in contact with the layer comprising the nanopipe defect and is disposed between the layer comprising a nanopipe defect and the light emitting layer, wherein the nanopipe defect terminates in the III-nitride layer doped with an acceptor.
12. The device of claim 10 wherein the acceptor is magnesium.
13. The device of claim 12 where the III-nitride layer doped with an acceptor is electrically connected in common with then-type region.
14. The device of claim 10 wherein the III-nitride layer doped with an acceptor is a first magnesium-doped layer, the device further comprising a second magnesium doped layer disposed between the first magnesium-doped layer and the light emitting layer.
15. The device of claim 14 wherein the first magnesium doped layer is doped to a lower magnesium concentration than the second magnesium-doped layer.
16. The device of claim 10 further comprising a layer comprising one of aluminum or indium aluminum disposed between the III-nitride layer doped with an acceptor and the III-nitride light emitting layer.
17. The device of claim 10 wherein the III-nitride light emitting layer is spaced at least 1 micron from the III-nitride layer doped with an acceptor.
18. The device of claim 10 wherein a concentration of acceptor is higher in a sublayer of the III-nitride layer doped with an acceptor closer to the light emitting layer than in a sublayer of the III-nitride layer doped with an acceptor further from the light emitting layer.