Gate planarity for FinFET using dummy polish stop
A method for forming a semiconductor device includes depositing a dielectric layer over fins formed in a semiconductor substrate. The dielectric layer includes a screen layer over tops of the fins. An etch stop feature is formed on the screen layer. The etch stop feature is patterned down to the screen layer in regions across the device. A dummy gate material formed over the fins is planarized down to the etch stop feature, a dielectric fill between gate structures patterned from the dummy gate material is planarized down to the etch stop feature and a gate conductor is planarized to the etch stop feature.
1. A semiconductor device, comprising:
fins formed in a semiconductor substrate and buried in a dielectric layer recessed to form a shallow trench isolation region;
a screen layer providing a thickness over tops of the fins and lateral faces of the fins;
gate structures formed over the fins; and
at least one etch stop feature formed on the screen layer to be above a fin height, wherein the etch stop feature does not run over the fins, the at least one etch stop feature including a base layer and an etch stop layer formed on the base layer, the at least one etch stop feature including a height to ensure the gate structures formed for the device have a minimum gate height after gate formation processing.
2. The device as recited in claim 1 , wherein the etch stop layer includes a nitride material.
3. The device as recited in claim 1 , wherein the base layer includes polysilicon or amorphous silicon employed to form electrical elements from the base layer.
4. The device as recited in claim 1 , wherein the at least one etch stop feature includes a plurality of etch stop features disposed in a plurality of regions on the device.
5. The device as recited in claim 4 , wherein the plurality of regions on the device includes regions on the device where gates are not active.
6. The device as recited in claim 1 , further comprising a dielectric fill planarized down to the etch stop feature between gate structures.
7. The device as recited in claim 1 , wherein the etch stop feature includes multiple layers including different materials.
8. The device as recited in claim 1 , wherein the gate structures include spacers formed on sidewalls of the gate structures.
9. The device as recited in claim 1 , wherein the base layer is employed to form a fuse.
10. The device as recited in claim 1 , wherein the base layer is employed to form a capacitor.
11. The device as recited in claim 1 , wherein the base layer is employed to form a resistor.
12. The device as recited in claim 1 , wherein the base layer includes a metal silicide.