IP Library Granted Patent US 10,535,502
Granted Patent B2
US 10,535,502 · App. 15/198,969 · Granted Jan 14, 2020

Symmetric plasma process chamber

Inventors: James D. Carducci (Sunnyvale, CA); Hamid Tavassoli (Cupertino, CA); Ajit Balakrishna (Sunnyvale, CA); Zhigang Chen (Campbell, CA); Andrew Nguyen (San Jose, CA); Douglas A. Buchberger, Jr. (Livermore, CA); Kartik Ramaswamy (San Jose, CA); Shahid Rauf (Pleasanton, CA); Kenneth S. Collins (San Jose, CA)
Assignee: Applied Materials, Inc.
H01J37/3244H01J37/32082H01J37/32091H01J37/32495H01J37/32541H01J37/32568H01J37/32724H01J37/32733H01J37/32743H01J37/32834H05H1/46H01J2237/3321H01J2237/3323H01J2237/3344
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Quick Facts
Patent No.
US 10,535,502
App. No.
15/198,969
Granted
Jan 14, 2020
Kind
B2
Abstract

Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.

Claims (30)

1. A plasma processing apparatus, comprising:

a lid assembly and a chamber body enclosing a processing region; and

a substrate support assembly disposed in the chamber body, wherein the lid assembly comprises:

an upper electrode having one or more fluid inlets and one or more fluid outlets;

a plurality of conductive fittings, wherein one of the conductive fittings is coupled to one of the one or more fluid inlets and another one of the conductive fittings is coupled to one of the one or more fluid outlets; and

a plurality of conductive plugs coupled to the upper electrode, wherein the plurality of conductive plugs each isolated and standing-alone from the fluid inlets, outlets or fluid channels formed in the upper electrode and the fluid inlets, outlets or fluid channels bypassing the conductive plugs, wherein the conductive fittings and the conductive plugs are arranged symmetrically about a central axis of the substrate support assembly.

2. The plasma processing apparatus of claim 1 , wherein the conductive plugs and the conductive fittings are comprised of the same material.

3. The plasma processing apparatus of claim 1 , wherein the conductive plugs have substantially the same size and shape as the conductive fittings.

4. The plasma processing apparatus of claim 1 , wherein the conductive plugs and the conductive fittings together define a polar array centered about the central axis of the substrate support assembly.

5. The plasma processing apparatus of claim 1 , wherein the upper electrode comprises a showerhead plate and a heat transfer plate, wherein the heat transfer plate has a plurality of fluid channels disposed therein that are in fluid communication with the one or more fluid inlets and the one or more fluid outlets.

6. The plasma processing apparatus of claim 5 , wherein the showerhead plate has a central manifold configured to distribute processing gas into the processing region and one or more outer manifolds configured to distribute processing gas into the processing region.

7. The plasma processing apparatus of claim 6 , wherein the lid assembly further comprises a ring manifold coupled to the one or more outer manifolds via a plurality of gas tubes arranged symmetrically about the central axis of the substrate support assembly.

8. The plasma processing apparatus of claim 1 , further comprising:

a first actuation device comprising a motor, and coupled to the substrate support assembly and configured to vertically move the substrate support assembly; and

a second actuation device comprising a second motor, and coupled to the substrate support assembly and configured to move a plurality of substrate support pins disposed within the substrate support assembly.

9. A lid assembly for a plasma processing apparatus, comprising:

an upper electrode having one or more fluid inlets and one or more fluid outlets;

a plurality of conductive fittings, wherein one of the conductive fittings is coupled to one of the one or more fluid inlets and another one of the conductive fittings is coupled to one of the one or more fluid outlets; and

a plurality of conductive plugs coupled to the upper electrode, wherein the plurality of conductive plugs each isolated and stand-alone from the fluid inlets, outlets or fluid channels formed in the upper electrode and the fluid inlets, outlets or fluid channels bypassing the conductive plugs, wherein the conductive fittings and the conductive plugs are arranged symmetrically about a central axis of the upper electrode.

10. The lid assembly of claim 9 , wherein the upper electrode comprises a showerhead plate and a heat transfer plate, and wherein the heat transfer plate has a plurality of fluid channels disposed therein that are in fluid communication with the one or more fluid inlets and the one or more fluid outlets.

11. The lid assembly of claim 9 , wherein the conductive plugs and the conductive fittings are comprised of the same material.

12. The lid assembly of claim 9 , wherein the conductive plugs have substantially the same size and shape as the conductive fittings.

13. The lid assembly of claim 9 , wherein the conductive plugs and the conductive fittings together define a polar array centered about the central axis of the upper electrode.

14. A plasma processing apparatus, comprising:

a lid assembly and a chamber body enclosing a processing region;

a substrate support assembly disposed in the chamber body, wherein the lid assembly comprises:

an upper electrode having one or more fluid inlets and one or more fluid outlets;

a plurality of conductive fittings, wherein one of the conductive fittings is coupled to one of the one or more fluid inlets and another one of the conductive fittings is coupled to one of the one or more fluid outlets; and

a plurality of conductive plugs coupled to the upper electrode, wherein the plurality of conductive plugs each isolated and standing-alone from the fluid inlets, outlets or fluid channels formed in the upper electrode and the fluid inlets, outlets or fluid channels bypassing the conductive plugs, wherein the conductive fittings and the conductive plugs are arranged symmetrically about a central axis of the substrate support assembly; and

an exhaust assembly defining an evacuation region within the chamber body, wherein the chamber body includes a plurality of passages symmetrically disposed about the central axis of the substrate support assembly and fluidly connecting the processing region with the evacuation region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2016
From: CARDUCCI, JAMES D.; TAVASSOLI, HAMID; BALAKRISHNA, AJIT; CHEN, ZHIGANG; NGUYEN, ANDREW; BUCHBERGER, DOUGLAS A., JR.; RAMASWAMY, KARTIK; RAUF, SHAHID; COLLINS, KENNETH S.
To: APPLIED MATERIALS, INC.
Reel/Frame 039125/0439 →
Continuity (3)
Continuation 13629267 · Sep 27, 2012
Provisional Application 61543565 · Oct 5, 2011
Related Publication 20160314936A1 · Oct 27, 2016
Cited By (14)
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