Apparatus and method for evaluating semiconductor device
An apparatus for evaluating a semiconductor device includes: a chuck stage; an insulating substrate; a plurality of probes; a temperature adjustment unit; an evaluation/control unit; and a probe position/temperature inspection device including an inspection plate, a thermo-chromic material, a photographing unit, and an image processing unit. The photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate. The image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.
1. An apparatus for evaluating a semiconductor device comprising:
a chuck stage for fixing a semiconductor device;
an insulating substrate;
a plurality of probes fixed to the insulating substrate;
a temperature adjustment unit adjusting temperatures of the plurality of probes;
an evaluation/control unit causing a current to flow into the semiconductor device through the plurality of probes to evaluate an electric characteristic of the semiconductor device; and
a probe position/temperature inspection device including an inspection plate, a thermo-chromic material disposed on an upper surface or a lower surface of the inspection plate, a photographing unit, and an image processing unit,
wherein the photographing unit photographs a color-change image of the thermo-chromic material in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate, and
the image processing unit performs image processing to the color-change image to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes.
2. The apparatus for evaluating a semiconductor device of claim 1 , wherein the thermo-chromic material is disposed on the lower surface of the inspection plate.
3. The apparatus for evaluating a semiconductor device of claim 1 , wherein the thermo-chromic material is disposed on the upper surface of the inspection plate and the photographing unit is disposed on the insulating substrate.
4. The apparatus for evaluating a semiconductor device of claim 1 , further comprising an illumination unit irradiating light on the thermo-chromic material.
5. The apparatus for evaluating a semiconductor device of claim 1 , further comprising an anti-reflection film on a photographing surface of the thermo-chromic material.
6. The apparatus for evaluating a semiconductor device of claim 1 , further comprising an anti-reflection coat on a photographing surface of the thermo-chromic material.
7. The apparatus for evaluating a semiconductor device of claim 1 , further comprising a protecting member disposed on the upper surface of the inspection plate and having a hardness lower than that of the distal end portions of the plurality of probes.
8. The apparatus for evaluating a semiconductor device of claim 1 , further comprising a cooler cooling the inspection plate.
9. The apparatus for evaluating a semiconductor device of claim 8 , wherein the cooler includes a peltiert element disposed on the inspection plate.
10. The apparatus for evaluating a semiconductor device of claim 1 , further comprising a heater heating the inspection plate.
11. The apparatus for evaluating a semiconductor device of claim 1 , wherein the inspection plate is made of a metal material.
12. The apparatus for evaluating a semiconductor device of claim 1 , wherein the inspection plate is made of a ceramics material.
13. The apparatus for evaluating a semiconductor device of claim 1 , wherein the inspection plate is made of a thermal anisotropic material.
14. A method for evaluating a semiconductor device comprising:
heating a plurality of probes fixed to an insulating substrate by a temperature adjustment unit;
photographing a color-change image of a thermo-chromic material disposed on an upper surface or a lower surface of the inspection plate with a photographing unit in a state in which distal end portions of the plurality of probes are pressed against the upper surface of the inspection plate;
performing image processing to the color-change image by the image processing unit to calculate in-plane positions and temperatures of the distal end portions of the plurality of probes; and
when the in-plane positions or the temperatures of the plurality of probes are normal, bringing the distal end portions of the plurality of probes into contact with electrodes of a semiconductor device and causing a current into the semiconductor device through the plurality of probes by an evaluation/control unit to evaluate an electric characteristic of the semiconductor device.
15. The method for evaluating a semiconductor device of claim 14 , further comprising, after separating the distal end portions of the plurality of heated probes from the inspection plate, cooling the inspection plate by a cooler.