Method of manufacturing an organic light emitting display panel
An organic light emitting display panel includes a base substrate, a pixel defining layer disposed on the base substrate, a light emitting structure disposed in an opening of the pixel defining layer, and a mirror pattern disposed on an upper surface of the pixel defining layer. The pixel defining layer defines the opening and includes the upper surface that is in parallel with a surface of the base substrate and a side surface that is connected to the upper surface. The mirror pattern makes contact with the pixel defining layer, and entirely covers the upper surface of the pixel defining layer.
1. A method of manufacturing an organic light emitting display panel, comprising:
forming a thin film transistor on a base substrate;
forming a preliminary pixel defining layer on the base substrate on which the thin film transistor is formed;
forming a pixel defining layer by patterning the preliminary pixel defining layer using a mask, the pixel defining layer defining an opening and comprising an upper surface that is in parallel with a surface of the base substrate and a side surface that is connected to the upper surface;
forming a mirror layer on the pixel defining layer;
forming a mirror pattern by patterning the mirror layer using the mask that is used for forming the preliminary pixel defining layer, the mirror pattern making contact with the pixel defining layer and entirely covering the upper surface of the pixel defining layer; and
forming a light emitting structure in the opening of the pixel defining layer.
2. The method of claim 1 , wherein forming the pixel defining layer comprises:
forming a photoresist layer on the preliminary pixel defining layer;
exposing the photoresist layer using the mask; and
developing the photoresist layer to form the pixel defining layer.
3. The method of claim 2 , wherein forming the mirror pattern comprises:
forming a photoresist layer on the mirror layer;
exposing the photoresist layer using the mask;
developing the photoresist layer to form a photoresist pattern; and
dry or wet etching the mirror layer using the photoresist pattern as an etch barrier to form the mirror pattern.
4. The method of claim 3 , wherein in exposing the photoresist layer, size of the photoresist pattern is precisely controlled by adjusting an exposure condition of the photoresist layer.
5. The method of claim 1 , further comprising:
forming a first electrode on the thin film transistor; and
forming a second electrode on the mirror pattern, the light emitting structure and the pixel defining layer, and
wherein the mirror pattern makes contact with the second electrode.
6. The method of claim 1 , wherein the mirror pattern has a shape that is the same as the pixel defining layer in a plan view.
7. The method of claim 1 , wherein the mirror pattern further covers a portion of the side surface of the pixel defining layer.
8. The method of claim 1 , wherein the mirror pattern covers only the upper surface of the pixel defining layer.
9. The method of claim 1 , wherein the light emitting structure is spaced apart from the mirror pattern.
10. A method of manufacturing an organic light emitting display panel, comprising:
forming a thin film transistor on a base substrate;
forming a preliminary pixel defining layer on the base substrate on which the thin film transistor is formed;
forming a mirror layer on the preliminary pixel defining layer;
forming a pixel defining layer and a mirror pattern by patterning the mirror layer and the preliminary pixel defining layer using a mask, the pixel defining layer defining an opening and comprising an upper surface that is in parallel with a surface of the base substrate and a side surface that is connected to the upper surface, the mirror pattern being disposed on an upper surface of the pixel defining layer; and
forming a light emitting structure in the opening of the pixel defining layer.
11. The method of claim 10 , wherein the preliminary pixel defining layer comprises non-photosensitive material.