IP Library › Granted Patent US 9,787,062
Granted Patent B2
US 9,787,062 · App. 15/209,973 · Granted Oct 10, 2017

Vertical cavity surface emitting laser array and method for manufacturing vertical cavity surface emitting laser array

Inventors: Takashi Kondo (Kanagawa, JP); Akemi Murakami (Kanagawa, JP); Naoki Jogan (Kanagawa, JP); Junichiro Hayakawa (Kanagawa, JP); Jun Sakurai (Kanagawa, JP)
Assignee: FUJI XEROX CO., LTD.
H01S5/423H01S5/0425H01S5/02276H01S5/18313H01S5/3432
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Quick Facts
Patent No.
US 9,787,062
App. No.
15/209,973
Granted
Oct 10, 2017
Kind
B2
Abstract

A vertical cavity surface emitting laser array includes a contact layer formed on a substrate; mesa structures formed on the contact layer, each mesa structure including a first semiconductor multilayer reflector of a first conductivity type, an active region on the first semiconductor multilayer reflector, and a second semiconductor multilayer reflector of a second conductivity type on the active region; a first metal layer formed on the contact layer around the mesa structures, a portion of the first metal layer serving as an electrode pad of the first conductivity type; an insulating film formed on the first metal layer; and a second metal layer formed on the insulating film, a portion of the second metal layer serving as an electrode pad of the second conductivity type. The mesa structures are electrically connected in parallel.

Claims (31)

1. A vertical cavity surface emitting laser array comprising:

a contact layer formed on a substrate;

a plurality of mesa structures formed on the contact layer, each mesa structure including

a first semiconductor multilayer reflector of a first conductivity type,

an active region on the first semiconductor multilayer reflector, and

a second semiconductor multilayer reflector of a second conductivity type on the active region,

a first metal layer formed on the contact layer around the mesa structures, a portion of the first metal layer serving as an electrode pad of the first conductivity type;

an insulating film formed on the first metal layer; and

a second metal layer formed on the insulating film, a portion of the second metal layer serving as an electrode pad of the second conductivity type,

wherein the mesa structures are electrically connected in parallel.

2. The vertical cavity surface emitting laser array according to claim 1 , wherein the electrode pad of the second conductivity type is formed on a multilayer body including the first metal layer formed on the contact layer and the insulating film formed on the first metal layer.

3. The vertical cavity surface emitting laser array according to claim 1 , wherein the electrode pad of the second conductivity type is formed on the insulating film formed directly on the contact layer.

4. The vertical cavity surface emitting laser array according to claim 1 , wherein the first metal layer and the second metal layer are each formed of a single continuous metal layer.

5. The vertical cavity surface emitting laser array according to claim 1 , wherein the electrode pad of the first conductivity type and the electrode pad of the second conductivity type each have an area large enough to enable a plurality of bonding wires to be connected thereto.

6. The vertical cavity surface emitting laser array according to claim 1 , wherein the electrode pad of the first conductivity type and the electrode pad of the second conductivity type each have a width that is substantially equal to a width of the substrate.

7. The vertical cavity surface emitting laser array according to claim 1 , wherein a size of the first metal layer and a size of the second metal layer are substantially equal in a region in which the mesa structures are formed.

8. The vertical cavity surface emitting laser array according to claim 1 , wherein the first metal layer covers at least portions of side surfaces of the first semiconductor multilayer reflectors.

9. The vertical cavity surface emitting laser array according to claim 1 , wherein the second metal layer covers entireties of side surfaces of the mesa structures with the insulating film interposed therebetween.

10. The vertical cavity surface emitting laser array according to claim 1 , wherein each mesa structure includes a first mesa including the second semiconductor multilayer reflector and the active region, and a second mesa including the first semiconductor multilayer reflector and having an external shape larger than an external shape of the first mesa.

11. The vertical cavity surface emitting laser array according to claim 10 , wherein the first metal layer covers side surfaces of the first semiconductor multilayer reflectors and portions of top surfaces of the first semiconductor multilayer reflectors.

12. A vertical cavity surface emitting laser array comprising:

a plurality of light emitting portions having mesa structures;

a first metal layer formed on a bottom surface around the mesa structures, a portion of the first metal layer serving as an electrode pad of a first conductivity type;

an insulating film formed on the first metal layer; and

a second metal layer formed on the insulating film, a portion of the second metal layer serving as an electrode pad of a second conductivity type,

wherein the mesa structures are electrically connected in parallel.

13. A method for manufacturing a vertical cavity surface emitting laser array comprising:

etching semiconductor layers so that a contact layer is exposed to form mesa structures of the semiconductor layers, the semiconductor layers being formed on a substrate and including the contact layer, first semiconductor multilayer reflectors of a first conductivity type, active regions, and second semiconductor multilayer reflectors of a second conductivity type;

forming a first metal layer that covers a region including the contact layer around the mesa structures, a portion of the first metal layer serving as an electrode pad of the first conductivity type;

forming an insulating film on the first metal layer in a region excluding top surfaces of the mesa structures; and

forming a second metal layer on the insulating film in a region including portions of the top surfaces of the mesa structures, a portion of the second metal layer serving as an electrode pad of the second conductivity type.

Assignments (2)
CHANGE OF NAME Recorded Aug 12, 2021
From: FUJI XEROX CO., LTD.
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 058287/0056 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2016
From: KONDO, TAKASHI; MURAKAMI, AKEMI; JOGAN, NAOKI; HAYAKAWA, JUNICHIRO; SAKURAI, JUN
To: FUJI XEROX CO., LTD.
Reel/Frame 039158/0076 →
Priority Claims (1)
JP 2015-173992 · Sep 3, 2015 · national
Continuity (1)
Related Publication 20170070027A1 · Mar 9, 2017