Method for manufacturing display device and method for manufacturing electronic device
Provided is a method for manufacturing a highly reliable display device. The method includes steps of providing a first layer, a first insulating layer, an electrode, and a second insulating layer over a first surface of a first substrate; removing a part of the second insulating layer to provide a first opening; providing a display element and a second layer over the second insulating layer; providing a third layer and a third insulating layer over a second surface of a second substrate; removing part of the third layer and part of the third insulating layer to provide a second opening; overlapping the first substrate and the second substrate with a bonding layer positioned therebetween such that the first surface and the second surface face each other and the first opening and the second opening have an overlap region; separating the first substrate and the first layer from the first insulating layer; providing a third substrate such that the first insulating layer and the third substrate overlap with each other; separating the second substrate, part of the bonding layer, part of the second layer, and the third layer from the third insulating layer; and providing a fourth substrate such that the third insulating layer and the fourth substrate overlap with each other.
1. A method for manufacturing a display device comprising a display region, comprising first to seventh processes,
wherein the first process comprises:
a step of providing a first layer over a first surface of a first substrate;
a step of providing a first insulating layer over the first layer;
a step of providing an electrode over the first insulating layer;
a step of providing a second insulating layer over the electrode;
a step of removing a part of the second insulating layer to provide a first opening; and
a step of providing a display element and a second layer over the second insulating layer,
wherein the second process comprises:
a step of providing a third layer over a second surface of a second substrate;
a step of providing a third insulating layer over the third layer; and
a step of removing a part of the third layer and a part of the third insulating layer to provide a second opening,
wherein the third process comprises a step of overlapping the first substrate and the second substrate with a bonding layer positioned therebetween such that the first surface and the second surface face each other and the first opening and the second opening have an overlap region,
wherein the fourth process comprises a step of separating the first substrate and the first layer from the first insulating layer,
wherein the fifth process comprises a step of providing a third substrate such that the first insulating layer and the third substrate overlap with each other,
wherein the sixth process comprises a step of separating the second substrate and the third layer from the third insulating layer,
wherein the seventh process comprises a step of providing a fourth substrate such that the third insulating layer and the fourth substrate overlap with each other,
wherein in the first process, the electrode and the second layer are provided at least partly in contact with each other,
wherein in the second process, a top surface shape of the second opening is a polygon having a first corner portion and a second corner portion, and an angle of each of the first corner portion and the second corner portion is larger than or equal to 30° and smaller than or equal to 150°,
wherein in the third process, the bonding layer comprises a first region overlapping with the second opening, and the second layer comprises a second region overlapping with the second opening,
wherein in the fourth process, at least a part of the first region of the bonding layer, at least a part of the second region of the second layer, and the second substrate are separated from the first substrate,
wherein in the sixth process, separation of the second substrate proceeds in a same direction as separation of at least the part of the first region of the bonding layer and at least the part of the second region of the second layer which starts at an end portion of the first corner portion and terminates at an end portion of the second corner portion, and wherein in the sixth process, at least a part of the electrode is exposed.
2. The method for manufacturing a display device, according to claim 1 ,
wherein in the second process, a top surface shape of the second opening is a parallelogram or hexagon having the first corner portion and the second corner portion, and
wherein in the sixth process, separation of the second substrate proceeds in a direction substantially parallel to a long side of the top surface shape of the second opening.
3. The method for manufacturing a display device, according to claim 1 ,
wherein the second layer is a stacked layer of an EL layer and a conductive layer.
4. The method for manufacturing a display device, according to claim 1 ,
wherein each of the first substrate and the second substrate is a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, a semiconductor substrate, or a plastic substrate.
5. The method for manufacturing a display device, according to claim 1 ,
wherein the third substrate and the fourth substrate have flexibility.
6. The method for manufacturing a display device, according to claim 1 ,
wherein each of the first layer and the third layer comprises tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, ruthenium, rhodium, palladium, osmium, iridium, or silicon.
7. The method for manufacturing a display device, according to claim 1 ,
wherein the display element is a light-emitting element.
8. A method for manufacturing an electronic device comprising a display device and a battery, a touch sensor, or a housing,
wherein the display device is manufactured by the method according to claim 1 .