Method for forming vertical Schottky contact FET

1. A method of forming a semiconductor structure, said method comprising:

providing a structure on a surface of a substrate, said structure comprising a semiconductor channel material structure extending vertically upwards from a surface of a silicon germanium alloy layer, wherein a dielectric cap is located on a topmost surface of said semiconductor channel material structure, a bottom spacer is located on each side of said semiconductor channel material structure and in direct contact with said silicon germanium alloy layer, and a top spacer is located on each side of said semiconductor channel material structure and is spaced apart from said bottom spacer;

forming a gate structure on each side of said semiconductor channel material structure, wherein each gate structure comprises a gate dielectric material portion directly contacting an exposed sidewall surface of said semiconductor channel material structure;

forming a middle-of-the-line (MOL) dielectric material adjacent said gate structures and said semiconductor channel material structure;

removing said dielectric cap to expose said topmost surface of said semiconductor channel material structure;

recessing said semiconductor channel material structure to provide a semiconductor channel region;

forming a contact opening in said MOL dielectric material that exposes another surface of said silicon germanium alloy layer;

removing said silicon germanium alloy layer to provide a cavity; and

forming a conductive material in said contact opening, said cavity and atop said semiconductor channel region, wherein said conductive material in said contact opening and said cavity provides a bottom Schottky contact source/drain region containing a vertically extending portion and a base portion, and wherein said conductive material formed atop said semiconductor channel region forms a top Schottky contact source/drain region.

2. The method of claim 1 , wherein said vertically extending portion of said bottom Schottky contact source/drain structure has a topmost surface that is coplanar with a topmost surface of said top Schottky contact source/drain structure and a topmost surface of said MOL dielectric material.

3. The method of claim 1 , further comprising forming a gate contact structure contacting a surface of said gate structure.

4. The method of claim 1 , wherein said substrate comprises a bulk semiconductor substrate, a first semiconductor material layer of a first conductivity type located on a surface of said bulk semiconductor substrate, a second semiconductor material layer of a second conductivity type different from said first conductivity type located on a surface of said first semiconductor material layer, and wherein said silicon germanium alloy layer directly contacts a surface of said second semiconductor material layer.

5. The method of claim 1 , wherein said substrate comprises a handle substrate and an insulator layer, and wherein said silicon germanium alloy layer directly contacts a surface of said second semiconductor material layer.

6. The method of claim 1 , wherein said removing said silicon germanium alloy layer comprises utilizing an HCl gas.

7. The method of claim 1 , wherein said top Schottky contact source/drain structure has sidewall surfaces that are vertically aligned to sidewall surfaces of said semiconductor channel region.

8. The method of claim 1 , wherein each of said gate structures further comprises a work function metal portion and a gate conductor portion.

9. The method of claim 1 , wherein said semiconductor channel material structure comprises a semiconductor material that differs in composition from said silicon germanium alloy layer.

10. The method of claim 1 , wherein a vertical sidewall spacer is formed on sidewall surfaces of said dielectric cap and an upper portion of sidewall surfaces of said semiconductor channel material structure prior to forming said gate structure.