Metal oxide TFT with improved source/drain contacts and reliability
A method including providing a substrate with a gate, a layer of gate insulator material adjacent the gate, and a layer of metal oxide semiconductor material positioned on the gate insulator opposite the gate, forming a selectively patterned etch stop passivation layer and heating at elevated temperature in an oxygen-containing or nitrogen-containing or inert ambience to selectively increase the carrier concentration in regions of the metal oxide semiconductor not covered by the etch stop layer, on which overlying and spaced apart source/drain metals are formed. Subsequently heating the transistor in an oxygen-containing or nitrogen-containing or inert ambience to further improve the source/drain contacts and adjust the threshold voltage to a desired level. Providing additional passivation layer(s) on top of the transistor with electric insulation and barrier property to moisture and chemicals in the surrounding environment.
1. A stable metal oxide semiconductor thin film transistor with ohmic source/drain contacts and high reliability comprising:
a substrate with a gate, a layer of gate insulator adjacent the gate, and a layer of metal oxide semiconductor material positioned on the layer of gate insulator opposite the gate; and,
a patterned etch stop passivation layer on selected portions of the layer of metal oxide semiconductor material defining not covered source/drain areas, the carrier concentration in the source/drain areas of the metal oxide semiconductor not covered by the etch stop layer being increased by heating together with all underlying layers at elevated temperature in an oxygen-containing or nitrogen-containing or inert ambience;
overlying and spaced apart source/drain metals formed on the source/drain areas, respectively, to make ohmic contact in a thin film transistor configuration;
the thin film transistor on the substrate being heated in an oxygen-containing or nitrogen-containing or inert ambience to further improve the source/drain contacts and adjust the threshold voltage to desired level; and
additional passivation layer(s) positioned on top of the thin film transistor with electric insulation and barrier property to moisture and chemicals in the surrounding environment.
2. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the substrate is a glass, stainless steel or plastic sheet.
3. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the substrate is one of rigid or flexible.
4. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the gate metal layer or source/drain metal layer comprises at least one of Mo, Al, Cu, Ti, Nd, or their combinations in stack or in alloy blend.
5. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the gate insulator layer comprises at least one of SiN x :H, SiO x :H, SiON x :H, Al 2 O 3 :H, HfO 2 :H, ZrO 2 :H, or their combinations in stack or in composite/blend form.
6. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the transistor is incorporated into thin film circuit applications including active matrix displays, image sensor arrays, touch sensor arrays, proximity sensing arrays, biosensor arrays, chemical sensor arrays and electronic arrays with multiple functionalities based on combinations above.
7. A stable metal oxide semiconductor thin film transistor as claimed in claim 6 , wherein the active matrix displays are active matrix liquid crystal displays, active matrix organic light emitting displays, active matrix inorganic light emitting displays, active matrix electrophoretic displays.
8. A stable metal oxide semiconductor thin film transistor as claimed in claim 6 , wherein the image sensor array is an X-ray image array.
9. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the layer of metal oxide semiconductor material includes a single layer of metal oxide semiconductor material with a carrier concentration in a range of 10 12 -10 18 electrons/cm 3 .
10. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the layer of metal oxide semiconductor material includes a dual overlying sub-layer of metal oxide semiconductor material with a carrier concentration in a range of 10 17 -10 19 electrons/cm 3 in the sub-layer adjacent to the layer of gate insulator and a carrier concentration <10 17 electrons/cm 3 in the sub-layer adjacent an upper surface of the sub-layer.
11. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the layer of metal oxide semiconductor material includes a multiple sub-layer of metal oxide semiconductor material with a carrier concentration in a range of 10 17 -10 19 electrons/cm 3 in a first sub-layer adjacent to the layer of gate insulator and a carrier concentration <10 17 electrons/cm 3 in an upper sub-layer in contact with the passivation layer.
12. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the patterned etch stop passivation layer is an inorganic insulator.
13. A stable metal oxide semiconductor thin film transistor as claimed in claim 12 , wherein the inorganic insulator is selected from one of SiO 2 , SiON, Al 2 O 3 , Ta 2 O 5 , TiO 2 , MgO, B 2 O 3 , ZrO 2 , Y 2 O 3 , HfO 2 , V 2 O 5 , Nb 2 O 5 , La 2 O 3 , Sc 2 O 3 , and combinations thereof.
14. A stable metal oxide semiconductor thin film transistor as claimed in claim 1 , wherein the source/drain metal contacts include a low work function metal portion and a high work function barrier metal portion, the work function of the low work function metal being one of equal to and lower than a work function of the metal oxide semiconductor active layer, and the work function of the high work function barrier metal being one of equal to and greater than the work function of the metal oxide semiconductor active layer, the low work function metal portion being positioned on the metal oxide semiconductor active layer, and the high work function barrier metal portion being positioned on the low work function metal portion.
15. A stable metal oxide semiconductor thin film transistor as claimed in claim 14 , wherein the low work function metal includes one of Al, Mg, Ti, Ta, Zn, In, V, Hf, Y or an alloy comprising them.
16. A stable metal oxide semiconductor thin film transistor as claimed in claim 14 , wherein the high work function barrier metal includes one of Mo, W, Au, Pt, Ag, Cu, Cr, Ni or an alloy comprising them.
17. A stable metal oxide semiconductor thin film transistor as claimed in claim 14 , wherein the additional passivation layer(s) positioned on top of the thin film transistor comprises at least one of SiN x , SiO x N y , AlN, Al 2 O 3 , SiAlON, TaO x , TiO 2 , organic material including one of polyimide, PMMA, PMGI, polysilane, polysiloxane, spin-on-glass, SAM, surface promoters or commercially available photoresists used as planarization layer or bank layer used in display field, or their combinations in stack or in composite/blend form.