Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
A method of fabricating LEDs from a wafer comprising a substrate and epitaxial layers and having a substrate side and a epitaxial side, said method comprising: (a) applying a laser beam across at least one of said substrate side or said epitaxial side of said wafer to define at least one laser-scribed recess having a laser-machined surface; and (b) singulating said wafer along said laser-scribed recess to form singulated LEDs, said singulated LEDs having a top surface, a bottom surface, and a plurality of sidewalls, at least one of said sidewalls comprising at least a first portion comprising at least a portion of said laser-machined surface.
1. A method of fabricating LEDs from a wafer comprising a substrate having a surface, said method comprising:
applying a laser beam across said surface to define at least one laser-scribed recess having a laser-machined surface; and
singulating said wafer along said laser-scribed recess to form singulated LEDs, said singulated LEDs having a top surface, a bottom surface, and a plurality of sidewalls, at least one of said sidewalls comprising at least a first portion and a second portion, said first portion comprising at least a portion of said laser-machined surface, wherein said laser-machined surface is characterized by being non-perpendicular to said top surface.
2. The method of claim 1 , wherein said second portion is essentially orthogonal to said top surface, and said first and second portions are non-planar.
3. The method of claim 1 , wherein said first and second textures are different and said first texture comprises terraces.
4. The method of claim 1 , wherein said first and second textures are different and said second texture comprises vertical striations.
5. The method of claim 1 , wherein said first and second textures are different and said second portion is orthogonal to said top surface.
6. The method of claim 1 , wherein first portion is defined along a non-crystallographic plane of said substrate, and second portion is defined along a crystallographic plane of said substrate.
7. The method of claim 1 , wherein each of said sidewalls comprises said first portion and said second portion.
8. The method of claim 1 , wherein said recess is a continuous groove.
9. The method of claim 1 , wherein said recess comprises a plurality of non-continuous recesses.
10. The method of claim 1 , wherein applying said laser beam comprises making a plurality of passes on said wafer to define said at least one laser-scribed recess.
11. The method of claim 1 , wherein said laser beam is non-uniform in power across its beam to shape said laser-machined surface.
12. The method of claim 1 , wherein said laser-machine surface is flat, curved, or comprises multiple facets.
13. The method of claim 12 , wherein said laser-machined surface has multiple facets.
14. The method of claim 1 , wherein the bottom surface of the singulated LEDs has a triangular shape.
15. The method of claim 1 , further comprising chemical etching after said applying.
16. The method of claim 15 , wherein said chemical etching comprises etching using at least one of KOH solutions, HIE solutions, or EDTA solutions.
17. The method of claim 1 , further comprising roughening to impart surface roughness to said top surface of said singulated LEDs.
18. The method of claim 1 , wherein the substrate is a bulk GaN substrate.
19. The method of claim 1 , wherein both said first texture is different from said second texture, and said wherein first and second textures have rough features with an average vertical size between 100 nm and 10 μm.