Heat sink for semiconductor modules
View Patent ↗A thermal interface includes a first thermal interface material (TIM) layer and a lid disposed on the first TIM layer. A second TIM layer is disposed on a surface of the lid opposite the first TIM layer. The second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction. A heat sink disposed on a surface of the second TIM layer opposite the lid.
1. A thermal interface, comprising:
a first thermal interface material (TIM) layer;
a lid disposed on the first TIM layer;
a second TIM layer disposed on a surface of the lid opposite the first TIM layer, wherein the second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction; and
a heat sink disposed on a surface of the second TIM layer opposite the lid,
wherein the second TIM layer has substantially a same width as a width of an active area of the heat sink.
2. The thermal interface of claim 1 , wherein the second TIM layer is about 50% as wide as a width of the lid in at least one direction.
3. The thermal interface of claim 1 , wherein the heat sink is a rigid heat sink, or a compliant heat sink.
4. The thermal interface of claim 1 , wherein the heat sink is an air cooled heat sink, or a liquid cooled heat sink.
5. The thermal interface of claim 1 , wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.
6. A thermal interface, comprising:
a first thermal interface material (TIM) layer;
a lid disposed on the first TIM layer;
a second TIM layer disposed on a surface of the lid opposite the first TIM layer;
a heat sink disposed on a surface of the second TIM layer opposite the lid,
wherein the heat sink comprises a first projection in contact with the surface of the lid at a first outer edge of the lid,
wherein the first projection forms a first recess between the first projection and the second TIM layer,
wherein the heat sink comprises a second projection in contact with the surface of the lid at a second outer edge of the lid opposite the first outer edge,
wherein the second projection forms a second recess between the second projection and the second TIM layer, and
wherein the second TIM layer has substantially a same width as a width of an active area of the heat sink.
7. The thermal interface of claim 6 , wherein the second TIM layer is from about 75% to about 25% as wide as a width of the lid.
8. The thermal interface of claim 7 , wherein the second TIM layer is about 50% as wide as a width of the lid.
9. The thermal interface of claim 6 , wherein at least one of the first and second projections comprises a same thermal interface material as a thermal interface material included in the second TIM layer.
10. The thermal interface of claim 6 , wherein the heat sink is a rigid heat sink.
11. The thermal interface of claim 6 , wherein the heat sink is a compliant heat sink.
12. The thermal interface of claim 6 , wherein the heat sink is an air cooled heat sink.
13. The thermal interface of claim 6 , wherein the heat sink is a liquid cooled heat sink.
14. The thermal interface of claim 6 , wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.
15. A semiconductor device, comprising;
a substrate;
a semiconductor chip disposed on the substrate; and
a thermal interface disposed on a surface of the semiconductor chip opposite the substrate,
wherein the thermal interface comprises:
a first thermal interface material (TIM) layer disposed on the surface of the semiconductor chip opposite the substrate;
a lid disposed on the first TIM layer;
a second TIM layer disposed on a surface of the lid opposite the first TIM layer, wherein the second TIM layer is from about 75% to about 25% as wide as a width of an upper surface of the lid, wherein the second TIM layer is about 50% as wide as a width of the lid in at least one direction; and
a heat sink disposed on a surface of the second TIM layer opposite the lid.
16. The thermal interface of claim 15 , wherein the heat sink is a rigid heat sink or a compliant heat sink.
17. The thermal interface of claim 15 , wherein the heat sink is an air cooled heat sink or a liquid cooled heat sink.
18. The thermal interface of claim 15 , wherein a thermal interface material included in the second TIM layer is loaded at an operating pressure of from about 75 psi to about 150 psi.