IP Library Granted Patent US 9,865,532
Granted Patent B2
US 9,865,532 · App. 15/229,556 · Granted Jan 9, 2018

Molded body and electrical device having a molded body for high voltage applications

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Quick Facts
Patent No.
US 9,865,532
App. No.
15/229,556
Granted
Jan 9, 2018
Kind
B2
Abstract

An electrical device comprising a ribbed molded body housing an electrical component is provided. The ribbed molded body includes at least one surface or portion having a plurality of ribs along at least a portion of the surface. The electrical component may be a passive or active electrical component. The electrical component may be connected to a lead frame and molded into the ribbed molded body.

Claims (39)

1. An electrical device for high voltage applications, comprising:

an electrical component connected to a first lead and a second lead;

an insulative molded body formed around the electrical component and portions of the first lead and the second lead, the molded body comprising a top surface, opposite bottom surface, front surface, opposite back surface, left side surface and opposite right side surface;

the first lead extending from the right side surface of the molded body, and the second lead extending from the left side surface of the molded body;

wherein at least a portion of the front surface, bottom surface and back surface of the molded body between the first lead and the second lead comprise a plurality ribs, and wherein at least one or more of the ribs extends contiguously along the front surface, bottom surface and back surface.

2. The electrical device of claim 1 , wherein each of the ribs has sloping sidewalls.

3. The electrical device of claim 1 , further comprising a third lead connected to the same side of the electrical component as the second lead.

4. The electrical device of claim 3 , wherein the front surface comprises non-ribbed portions, wherein the non-ribbed portions lie in a plane, and wherein the ribs of the front surface do not extend beyond the plane.

5. The electrical device of claim 4 , wherein the back surface comprises non-ribbed portions, wherein the non-ribbed portions lie in a plane, and wherein the ribs of the back surface do not extend beyond the plane.

6. The electrical device of claim 1 , wherein the front surface comprises a non-ribbed portion extending along a length of the front surface, and wherein the ribbed portion of the front surface extends along a length that is greater than the length of the non-ribbed portion.

7. The electrical device of claim 6 , wherein the back surface comprises a non-ribbed portion extending along a length of the back surface, and wherein the ribbed portion of the back surface extends along a length that is greater than the length of the non-ribbed portion.

8. The electrical device of claim 1 , wherein the top surface is generally flat.

9. The electrical device of claim 1 , wherein the electrical device is a passive component or an active component.

10. The electrical device of claim 9 , wherein the electrical device is a passive component comprising a resistor, an inductor, a capacitor or a chip divider.

11. The electrical device of claim 9 , wherein the electrical device is an active component comprising a diode, semiconductor, rectifier, transistor, or integrated circuit.

12. The electrical device of claim 1 , wherein the leads are turned along the first and second side surfaces and along at least portions of the bottom of the device to form a surface mount device.

13. The electrical device of claim 1 , wherein the molded body includes a first surface mount portion adjacent the right side surface, and a second surface mount portion adjacent the left side surface, and wherein the first and second surface mount portions do not include ribs.

14. The electrical device of claim 1 , wherein the electrical component is mounted on a lead frame comprising at least a first lead and a second lead.

15. The electrical device of claim 14 , wherein the molded body encases the electrical component and lead frame, leaving at least portions of the leads exposed.

16. The electrical device of claim 1 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

17. The electrical device of claim 1 , wherein the electrical component has at least two leads.

18. The electrical device of claim 1 , further comprising steps formed in the molded body adjacent at least at least two adjacent ribs.

19. A method of making an electrical device for high voltage applications, comprising the steps of:

connecting an electrical component to a lead frame comprising at least two leads;

molding an insulative ribbed molded body around the electrical component and portions of the lead frame, leaving portions of the at least two leads exposed, the ribbed molded body including a top surface, opposite bottom surface, front surface, opposite back surface, left side surface and opposite right side surface, each of the front surface, bottom surface and back surface comprising a portion including a plurality ribs, and wherein at least one or more of the ribs extend contiguously along the front surface, bottom surface, and back surface; and

forming the ends of the leads around the ribbed molded body.

20. The method of claim 19 , further comprising the step of marking a portion of the ribbed molded body.

21. The method of claim 20 , further comprising the step of trimming the lead frame.

22. The method of claim 21 , further comprising the step of testing the device.

23. The method of claim 22 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

24. A method of making an electrical device for high voltage applications, comprising the steps of:

connecting an electrical component to a lead frame comprising at least two leads;

applying a moisture barrier to a portion of the electrical component prior to molding the ribbed molded body around the electrical component;

molding an insulative ribbed molded body comprising at least a ribbed portion around the electrical component and portions of the lead frame, leaving portions of the at least two leads exposed; and

forming the ends of the leads around the ribbed molded body.

25. The method of claim 24 , further comprising the step of marking a portion of the ribbed molded body.

26. The method of claim 25 , further comprising the step of trimming the lead frame.

27. The method of claim 26 , further comprising the step of testing the device.

28. The method of claim 27 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

Assignments (3)
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2017
From: BLACKBURN, SCOTT
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 042464/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2016
From: GLENN, DARIN
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 039354/0374 →