IP Library Granted Patent US 10,631,409
Granted Patent B2
US 10,631,409 · App. 15/231,438 · Granted Apr 21, 2020

Electrical assemblies for downhole use

Inventors: Rocco Difoggio (Houston, TX); Otto N. Fanini (Houston, TX); Paul G. Cairns (Houston, TX); Brian D. Breaux (Houston, TX); Benjamin Todd (Cypress, TX)
Assignee: BAKER HUGHES, A GE COMPANY, LLC
H05K1/181B23K1/0056E21B47/011E21B49/00H05K1/113H05K3/325H05K3/341B23K26/18B33Y10/00G01V3/18H05K2201/1059H05K2201/10151H05K2201/10257H05K2201/10295H05K2201/10401H05K2201/10628H05K2203/107
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Quick Facts
Patent No.
US 10,631,409
App. No.
15/231,438
Granted
Apr 21, 2020
Kind
B2
Abstract

Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.

Claims (6)

1. A method for manufacturing a downhole circuit board for use in well logging in a hot environment, the method comprising:

forming an electrical assembly including attaching an electrical component to a printed circuit board by applying light from a laser to a light absorbent graphene-composite solder to produce heat sufficient to melt the graphene-composite solder.

2. The method of claim 1 wherein the solder comprises a metal.

3. The method of claim 1 wherein the light has a wavelength of less than 450 nanometers.

4. The method of claim 1 wherein the light is produced at a first wavelength, the method further comprising applying light from a second laser to a flux material of the circuit board, wherein the light from the second laser has a second wavelength different than the first wavelength, and controlling the laser separately from the second laser.

5. The method of claim 1 wherein the electrical assembly is configured for use in a downhole well logging tool.

Assignments (2)
CHANGE OF NAME Recorded Feb 26, 2020
From: BAKER HUGHES INCORPORATED
To: BAKER HUGHES, A GE COMPANY, LLC
Reel/Frame 052020/0282 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2016
From: DIFOGGIO, ROCCO; FANINI, OTTO N.; CAIRNS, PAUL GERARD; BREAUX, BRIAN D.; TODD, BENJAMIN
To: BAKER HUGHES INCORPORATED
Reel/Frame 039813/0617 →
Continuity (1)
Related Publication 20180042111A1 · Feb 8, 2018