High speed X-ray microscope
A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.
1. A system for forming x-ray images, comprising:
a source of x-rays;
a movable mount for the source of x-rays;
a mount for holding an object
positioned such that x-rays from the source are aligned to illuminate an object held in the mount at an angle of incidence with respect to the object;
a scintillator that absorbs x-rays and emits visible photons;
an optical system that forms an image of the scintillator; and
a detector for converting the image of the emitted photons into electronic signals;
wherein the emission of x-rays occurs from a spot with a diameter greater than 10 micrometers formed by the collision of an electron beam with an anode; and
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 20;
wherein the mounted source of x-rays is configured to be positioned to change the angle of incidence of the x-rays with respect to the object.
2. The imaging system of claim 1 , wherein
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 100.
3. The imaging system of claim 1 , additionally comprising
a recorder for the electronic signals.
4. The imaging system of claim 1 , wherein
the scintillator comprises LuAG.
5. The imaging system of claim 1 , wherein
the scintillator has a thickness of less than 50 micrometers.
6. The imaging system of claim 1 , wherein
the detector for converting the image of the emitted photons into electronic signals comprises a charge-coupled device (CCD).
7. The imaging system of claim 3 , additionally comprising
a system controller that controls:
motion of the mount for the source of x-rays,
motion of the mount for holding an object, and
the recorder for the electronic signals corresponding to the image of the emitted photons.
8. The imaging system of claim 7 , wherein
the system controller also controls:
properties of the x-ray source selected from the group consisting of:
x-ray source angle, x-ray source power, x-ray source energy, and x-ray beam shape; and
properties of the optical system selected from the group consisting of:
optical system focusing, optical system magnification, and x-ray image collection.
9. The imaging system of claim 1 , wherein
an object is placed in the mount for holding an object.
10. The imaging system of claim 9 , wherein
the object is selected from the group consisting of:
a silicon interposer, a silicon dioxide interposer, an integrated circuit,
a printed circuit board, a 3D IC package, a 2.5D IC package, and
a multi-chip-module.
11. The imaging system of claim 9 , wherein
the object comprises through-silicon vias.
12. The imaging system of claim 9 , wherein
the object comprises solder bumps.
13. The imaging system of claim 9 , wherein
motion of the mount for the source of x-rays is controlled to change the angle of incidence the x-rays with respect to the object.
14. The imaging system of claim 1 , wherein
the optical system comprises a microscope objective.
15. A system for forming x-ray images, comprising:
a source of x-rays;
a movable mount for the source of x-rays;
a mount for holding an object
positioned such that x-rays from the source are aligned to illuminate an object held in the mount at an angle of incidence with respect to the object;
a scintillator that absorbs x-rays and emits visible photons;
an optical system that forms an image of the scintillator; and
a detector for converting the image of the emitted photons into electronic signals;
wherein an object is placed in the mount for holding an object;
and wherein the scintillator and the object is are separated by a distance of less than 1 mm;
and wherein the mounted source of x-rays is configured to be positioned to change the angle of incidence of the x-rays with respect to the object.
16. The imaging system of claim 15 , wherein
the scintillator assembly and the object are in contact.
17. The imaging system of claim 15 , wherein
the distance between the scintillator and the object is less than 100 micrometers.
18. The imaging system of claim 15 , wherein
the emission of x-rays occurs from a spot
formed by the collision of an electron beam with an anode; and
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 20.
19. The imaging system of claim 15 , wherein
the scintillator comprises LuAG.
20. The imaging system of claim 15 , wherein
the scintillator has a thickness of less than 50 micrometers.
21. The imaging system of claim 15 , wherein
the detector for converting the image of the emitted photons into electronic signals comprises a charge-coupled device (CCD).
22. The imaging system of claim 15 , additionally comprising:
a recorder for the electronic signals; and
a system controller that controls:
motion of the mount for the source of x-rays,
motion of the mount for holding an object, and
the recorder for the electronic signals corresponding to the image of the emitted photons.
23. The imaging system of claim 22 , wherein
the system controller also controls:
properties of the x-ray source selected from the group consisting of:
x-ray source angle, x-ray source power, x-ray source energy, and x-ray beam shape; and
properties of the optical system selected from the group consisting of:
optical system focusing, optical system magnification, and x-ray image collection.
24. The imaging system of claim 15 , wherein
the object is selected from the group consisting of
a silicon interposer, a silicon dioxide interposer, an integrated circuit,
a printed circuit board, a 3D IC package, a 2.5D IC package, and
a multi-chip-module.
25. The imaging system of claim 15 , wherein
the object comprises through-silicon vias.
26. The imaging system of claim 15 , wherein
the object comprises solder bumps.
27. The imaging system of claim 15 , wherein
motion of the mount for the source of x-rays is controlled to change the angle of incidence of the x-rays with respect to the object.
28. The imaging system of claim 15 , wherein
the optical system comprises a microscope objective.
29. The imaging system of claim 15 , wherein
the optical system has an optical axis; and additionally comprising
a source controller for adjusting the position of the source of x-rays such that the source spot of the x-ray emitter within the source of x-rays is not on the optical axis.
30. A method for conducting metrology of an object, comprising:
selecting an object for measurement;
forming at least one image of the object using a system comprising:
a source of x-rays;
a movable mount for the source of x-rays
a mount for holding an object;
a scintillator that absorbs x-rays and emits visible photons;
an optical system that forms an image of the scintillator;
detecting the image of the scintillator;
converting the detected image into electronic signals;
storing the electronic signals corresponding to the image;
analyzing the electronic signals corresponding to the image with a predetermined recipe;
determining at least one physical dimension for the object; and
displaying the at least one physical dimension.
31. A method for conducting inspection of an object, comprising:
selecting an object for inspection;
forming at least one image of the object using a system comprising:
a source of x-rays;
a movable mount for the source of x-rays
a mount for holding an object;
a scintillator that absorbs x-rays and emits visible photons;
an optical system that forms an image of the scintillator;
detecting the image of the scintillator;
converting the detected image into electronic signals;
storing the electronic signals corresponding to the image;
analyzing the electronic signals corresponding to the image with a predetermined recipe for identification of defects; and
displaying the results of the defect analysis.
32. A system for forming x-ray images, comprising:
a source of x-rays;
a movable mount for the source of x-rays;
an adjustable mount for positioning an object to be illuminated at an angle of incidence with respect to the object by x-rays from the x-ray source;
a scintillator that absorbs x-rays and emits visible photons;
an optical system that forms an image of the scintillator; and
a detector for converting the image of the emitted photons into electronic signals;
and wherein the optical system has an optical axis;
and additionally comprising
a controller for adjusting the position of the source of x-rays such that the source spot of the x-ray emitter within the source of x-rays is not on the optical axis of the optical system.
33. The imaging system of claim 32 , wherein
the emission of x-rays occurs from a spot formed by the collision of an electron beam with an anode; and
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 20.
34. The imaging system of claim 32 , wherein
the scintillator is has a thickness of less than 50 micrometers.
35. The imaging system of claim 32 , wherein
the angle of incidence of the x-rays with respect to the object is adjustable.
36. The imaging system of claim 32 , wherein
the optical system comprises a microscope objective.
37. A system for forming x-ray images, comprising:
a source of x-rays;
a scintillator that absorbs x-rays and emits visible or ultraviolet photons;
an optical imaging system that forms an image of the scintillator; and
a detector for converting the image of the emitted photons into electronic signals;
wherein
the emission of x-rays occurs from a spot with a diameter greater than 10 micrometers formed by the collision of an electron beam with an anode;
the resolution of the optical system is greater than 1 micrometer; and
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 2.
38. The imaging system of claim 37 , wherein
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 5.
39. The imaging system of claim 38 , wherein
the ratio of the spot size of the x-ray source and the resolution of the optical system is greater than 10.
40. The imaging system of claim 37 , wherein
the scintillator comprises LuAG.
41. The imaging system of claim 37 , wherein
the scintillator has a thickness of less than 50 micrometers.
42. The imaging system of claim 37 , wherein
the detector for converting the image of the emitted photons into electronic signals comprises a charge-coupled device (CCD).
43. The imaging system of claim 37 , wherein
an object to be examined is supported by the scintillator.
44. The imaging system of claim 37 , additionally comprising:
a support structure for an object; and
a system controller that controls
motion of the support structure for an object.
45. The imaging system of claim 44 , wherein
the system controller also controls:
properties of the x-ray source selected from the group consisting of:
x-ray source angle, x-ray source power, x-ray source energy, and x-ray beam shape; and
properties of the optical system selected from the group consisting of:
optical system focusing, optical system magnification, and x-ray image collection.
46. The imaging system of claim 37 , wherein
the optical imaging system comprises a microscope objective.
47. The imaging system of claim 37 , wherein
the optical imaging system comprises a fiber optic bundle.
48. The imaging system of claim 44 , wherein
an object is placed in the support structure for an object,
and is positioned such that x-rays from the source illuminate the object
at an angle of incidence with respect to the object.
49. The imaging system of claim 48 , wherein
the angle of incidence of the x-rays with respect to the object is adjustable.
50. The imaging system of claim 48 , wherein
the object is selected from the group consisting of:
a silicon interposer, a silicon dioxide interposer, an integrated circuit,
a printed circuit board, a 3D IC package, a 2.5D IC package, and
a multi-chip-module.
51. The imaging system of claim 48 , wherein
the object comprises through-silicon vias.
52. The imaging system of claim 48 , wherein
the object comprises solder bumps.
53. The imaging system of claim 37 , wherein
the optical system has an optical axis; and additionally comprising
a source controller for adjusting the position of the source of x-rays such that the source spot of the x-ray emitter within the source of x-rays is not on the optical axis.
54. The imaging system of claim 38 , wherein
the scintillator and the object is are separated by a distance of less than 1 mm.