IP Library Granted Patent US 10,033,845
Granted Patent B2
US 10,033,845 · App. 15/231,897 · Granted Jul 24, 2018

Contact structure and contact device, and electronic device including the same

Inventors: Jeong Seok Park (Gyeonggi-do, KR); Jong Chul Choi (Gyeonggi-do, KR)
Assignee: Samsung Electronics Co., Ltd.
H04M1/0277H05K1/0215H04M1/0274
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,033,845
App. No.
15/231,897
Granted
Jul 24, 2018
Kind
B2
Abstract

An electronic device may include a housing a housing comprising a first surface and an second surface generally parallel to the first surface, the second surface including an opening extending to the first surface, the first and second surface being spaced apart from one another along an axis; a first conductive member being coupled to the first surface; a second conductive member spaced apart substantially from the first conductive member along the axis; and a conductive dome structure disposed between at least a part of the first conductive member and at least a part of the second conductive member and forming an electric path between the first conductive member and the second conductive member.

Claims (28)

1. A contact structure for an electric connection of a mobile electronic device having a printed circuit board (PCB) having a conductive pattern formed on the PCB, the contact structure comprising:

a plate-type central body having a center part which is raised higher than a peripheral part, the central body curved with a certain curvature from the peripheral part to the center part; and

at least one lead extending outwards from an edge of the central body,

wherein the lead is disposed so as to electrically contact the conductive pattern formed on the PCB,

wherein a fixing part exposes at least a part of the central body while surrounding the lead or the lead and at least a part of the edge of the central body, and

wherein an adhesive layer is disposed on a surface of the fixing part, the adhesive part surrounding the lead or the lead and at least a part of the edge of the central body.

2. The contact structure of claim 1 , wherein the leads are arranged at edge areas of the central body so as to be symmetrical with each other with respect to an axis extending through a center of the central body.

3. The contact structure of claim 1 , further comprising a protrusion protruding upwards from a center of the central body.

4. The contact structure of claim 1 , wherein the central body comprises:

first edge areas which further protrude outwards than adjacent edge areas; and

second edge areas which protrude less than the first edge areas and connect ends of the further protruding edge areas in a circular shape.

5. A contact device for an electric connection of a mobile electronic device having a printed circuit board (PCB), the contact device comprising:

a contact structure having a plate-type central body including a center part which is raised higher than a peripheral part, the central body curved with a certain curvature from the peripheral part to the center part, and at least one lead extending outwards from an edge of the central body; and

a fixing part which exposes at least a part of the central body while surrounding the lead or the lead and at least a part of the edge of the central body, wherein an adhesive layer is disposed on a surface of the fixing part, the adhesive part surrounding the lead or the lead and at least a part of the edge of the central body.

6. The contact device of claim 5 , further comprising a protective layer facing the adhesive layer of the fixing part.

7. The contact device of claim 5 , wherein the lead is disposed so as to electrically contact a conductive pattern formed on the PCB.

8. The contact device of claim 5 , further comprising a protrusion protruding upwards from a center of the central body.

9. A mobile electronic device comprising:

a contact device having a contact structure including a plate-type central body having a center part;

a peripheral part, the center part being raised higher than a peripheral part, the central body curved with a certain curvature from the peripheral part to the center part;

at least one lead extending outwards from an edge of the central body;

a fixing part which exposes at least a part of the central body while surrounding at least one of the lead and at least a part of the edge of the central body, an adhesive layer being disposed on a surface of the fixing part, the adhesive layer surrounding at least one of the lead and at least a part of the edge of the central body; and

a printed circuit board (PCB) to which the fixing part is bonded and which electrically contacts the contact structure.

10. The mobile electronic device of claim 9 , wherein the PCB comprises a conductive pattern, the conductive pattern electrically contacts the contact structure.

11. The mobile electronic device of claim 10 , wherein the conductive pattern comprises at least one of a grounding terminal and an antenna connection terminal of the PCB.

12. The mobile electronic device of claim 9 , further comprising at least one of:

a bracket to which the PCB is fixed and which electrically contacts the contact structure; and

a protrusion protruding upwards from a center of the central body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2016
From: PARK, JEONG SEOK; CHOI, JONG CHUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 039380/0066 →
Priority Claims (1)
KR 10-2015-0117710 · Aug 21, 2015 · national
Continuity (1)
Related Publication 20170055353A1 · Feb 23, 2017