Semiconductor device and associated methods
A semiconductor device comprising: a die-source-terminal, a die-drain-terminal and a die-gate-terminal; a semiconductor-die; an insulated-gate-depletion-mode-transistor provided on the semiconductor-die, the insulated-gate-depletion-mode-transistor comprising a depletion-source-terminal, a depletion-drain-terminal and a depletion-gate-terminal, wherein the depletion-drain-terminal is coupled to the die-drain-terminal and the depletion-gate-terminal is coupled to the die-source-terminal; an enhancement-mode-transistor comprising an enhancement-source-terminal, an enhancement-drain-terminal and an enhancement-gate-terminal, wherein the enhancement-source-terminal is coupled to the die-source-terminal, the enhancement-gate-terminal is coupled to the die-gate-terminal and the enhancement-drain-terminal is coupled to the depletion-source-terminal; and a clamp-circuit coupled between the depletion-source-terminal and the depletion-gate-terminal.
1. A semiconductor device comprising:
a die-source-terminal, a die-drain-terminal and a die-gate-terminal;
a semiconductor-die;
an insulated-gate-depletion-mode-transistor provided on the semiconductor-die, the insulated-gate-depletion-mode-transistor comprising a depletion-source-terminal, a depletion-drain-terminal and a depletion-gate-terminal, wherein the depletion-drain-terminal is coupled to the die-drain-terminal and the depletion-gate-terminal is coupled to the die-source-terminal;
an enhancement-mode-transistor comprising an enhancement-source-terminal, an enhancement-drain-terminal and an enhancement-gate-terminal, wherein the enhancement-source-terminal is coupled to the die-source-terminal, the enhancement-gate-terminal is coupled to the die-gate-terminal and the enhancement-drain-terminal is coupled to the depletion-source-terminal; and
a clamp-circuit coupled between the depletion-source-terminal and the depletion-gate-terminal, wherein the clamp-circuit comprises a diode circuit, and wherein the diode circuit has an anode coupled to the depletion-source-terminal and a cathode coupled to the depletion-gate-terminal.
2. The semiconductor device of claim 1 , wherein the clamp-circuit is provided on the semiconductor-die.
3. The semiconductor device of claim 1 , wherein the insulated-gate-depletion-mode-transistor comprises a High Electron Mobility Transistor.
4. The semiconductor device of claim 1 , wherein the insulated-gate-depletion-mode-transistor comprises a Gallium Nitride Field Effect Transistor or a Silicon Carbide Field Effect Transistor.
5. The semiconductor device of claim 1 , wherein the clamp circuit is configured to limit the voltage between the depletion-source-terminal and the depletion-gate-terminal to a predetermined threshold voltage.
6. The semiconductor device of claim 5 , wherein the predetermined threshold voltage is less than the breakdown voltage of the insulation of the depletion-gate-terminal.
7. The semiconductor device of claim 1 , wherein the diode circuit comprises a Schottky diode.
8. The semiconductor device of claim 1 , wherein the clamp circuit has a conduction threshold voltage that is less than a source-to-drain breakdown voltage of the enhancement-mode-transistor or an avalanche threshold voltage of the enhancement-mode-transistor.
9. The semiconductor device of claim 1 , wherein the clamp circuit has a conduction threshold voltage that is higher than an absolute value of a threshold voltage of the insulated-gate-depletion-mode-transistor.
10. The semiconductor device of claim 1 , wherein the insulated-gate-depletion-mode-transistor is provided on a first integrated circuit and the clamp-circuit is provided on the first integrated circuit.
11. The semiconductor device of claim 1 , wherein the enhancement-mode-transistor is a Silicon Metal Oxide Semiconductor Field Effect Transistor.
12. A power switch or a switched mode power supply comprising the semiconductor device of claim 1 .
13. An integrated circuit comprising the semiconductor device of claim 1 .
14. A method of providing a semiconductor device, comprising: providing a die-source-terminal, a die-drain-terminal and a die-gate-terminal; providing a semiconductor-die;
providing an insulated-gate-depletion-mode-transistor on the semiconductor-die, the insulated-gate-depletion-mode-transistor comprising a depletion-source-terminal, a depletion-drain-terminal and a depletion-gate-terminal, wherein the depletion-drain-terminal is coupled to the die-drain-terminal and the depletion-gate-terminal is coupled to the die-source-terminal;
providing an enhancement-mode-transistor, the enhancement-mode-transistor comprising an enhancement-source-terminal, an enhancement-drain-terminal and an enhancement-gate-terminal, wherein the enhancement-source-terminal is coupled to the die-source-terminal, the enhancement-gate-terminal is coupled to the die-gate-terminal and the enhancement-drain-terminal is coupled to the depletion-source-terminal; and
providing a clamp-circuit coupled between the depletion-source-terminal and the depletion-gate-terminal, wherein the clamp-circuit comprises a diode circuit, and wherein the diode circuit has an anode coupled to the depletion-source-terminal and a cathode coupled to the depletion-gate-terminal.