IP Library Assignment 041002/0454
Patent Assignment
Reel/Frame 041002/0454

Assignment of Assignor's Interest

Recorded: 2017-01-13 Pages: 7
Assignor
NXP B.V.
Executed: 2017-01-11
Assignee
NEXPERIA B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Properties (25)
A Semiconductor Device Having a Plurality of Source Lines Being Laid in Both X and Y Directions
Patent: 9,570,605 →
Application: 15/150,225 →
Semiconductor Device and Lead Frame Therefor
Application: 15/180,072 →
Publication: US 2017/0358514
Semiconductor Device with Protected Sidewalls and Methods of Manufacturing Thereof
Patent: 9,806,034 →
Application: 15/183,940 →
Method of Making a Plurality of Semiconductor Devices
Patent: 9,859,184 →
Application: 15/196,982 →
Publication: US 2017/0033029
Circuitry with Voltage Limiting and Capactive Enhancement
Patent: 9,941,265 →
Application: 15/200,308 →
Publication: US 2018/0006015
Electronic Device and Method of Making Same
Application: 15/229,133 →
Publication: US 2017/0053855
Semiconductor Device and Associated Methods
Application: 15/233,785 →
Publication: US 2017/0062419
Semiconductor Device and a Method of Making a Semiconductor Device
Application: 15/233,834 →
Publication: US 2017/0077291
Semiconductor Device
Application: 15/253,563 →
Publication: US 2017/0092761
Wafer Level Semiconductor Device with Wettable Flanks
Application: 15/259,063 →
Publication: US 2018/0068920
Inductive Coupling for Electrostatic Discharge
Application: 15/259,415 →
Publication: US 2018/0069396
Powermos
Patent: 9,985,092 →
Application: 15/263,675 →
Publication: US 2018/0076279
Backend Taping Using Fluid Assisted Fixation
Application: 15/283,876 →
Publication: US 2017/0162419
Electrostatic Discharge Protection Device
Application: 15/284,576 →
Publication: US 2017/0117267
Trenchmos
Application: 15/285,351 →
Publication: US 2018/0097105
Reversible Semiconductor Die
Application: 15/286,444 →
Publication: US 2018/0096916
Leadframe-Less Surface Mount Semiconductor Device
Application: 15/287,584 →
Publication: US 2018/0102287
Semiconductor Device and a Method of Making a Semiconductor Device
Application: 15/336,763 →
Publication: US 2017/0133303
Semiconductor Device and Method of Making a Semiconductor Device
Patent: 9,947,632 →
Application: 15/336,774 →
Publication: US 2017/0133335
Semiconductor Device and Method of Making a Semiconductor Device
Application: 15/342,285 →
Publication: US 2017/0148697
Gallium Nitride/ Aluminum Gallium Nitride Semiconductor Device and Method of Making a Gallium Nitride/ Aluminum Gallium Nitride Semiconductor Device
Application: 15/356,509 →
Publication: US 2017/0154988
Semiconductor Device and Method of Making a Semiconductor Device with Passivation Layers Providing Tuned Resistance
Application: 15/356,519 →
Publication: US 2017/0170089
Semiconductor Substrate with Electrically Isolating Dielectric Partition
Application: 15/356,527 →
Publication: US 2017/0170122
Semiconductor Device and Method of Making a Semiconductor Device
Patent: 9,929,263 →
Application: 15/374,267 →
Publication: US 2017/0194473
Apparatus and Associated Method
Application: 15/377,816 →
Publication: US 2017/0207215
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 9, 2016
From: PEAKE, STEVEN THOMAS
To: NXP B.V.
Reel/Frame 038645/0297 →
Assignment of Assignor's Interest Jun 12, 2016
From: YEUNG, SHUN TIK; UMALI, POMPEO V.; LEUNG, CHI HO; LAM, KAN WAE
To: NXP B.V.
Reel/Frame 038891/0412 →
Assignment of Assignor's Interest Jun 16, 2016
From: FUNKE, HANS-JUERGEN; SPROGIES, TOBIAS; BRENNER, ROLF; WEBER, RUDIGER
To: NXP B.V.
Reel/Frame 038929/0663 →
Assignment of Assignor's Interest Jun 29, 2016
From: RITTER, HANS-MARTIN; BURMEISTER, FRANK
To: NXP B.V.
Reel/Frame 039044/0668 →
Assignment of Assignor's Interest Aug 5, 2016
From: LAM, KAN WAE; YEUNG, SHUN TIK; UMALI, POMPEO V.; LEUNG, CHI HO
To: NXP B.V.
Reel/Frame 039348/0788 →
Assignment of Assignor's Interest Aug 9, 2016
From: RUTTER, PHILIP; SONSKY, JAN; WYNNE, BARRY; LAI, YAN
To: NXP B.V.
Reel/Frame 039378/0472 →
Assignment of Assignor's Interest Aug 10, 2016
From: PEAKE, STEVEN THOMAS; RUTTER, PHILIP; ROGERS, CHRIS
To: NXP B.V.
Reel/Frame 039399/0024 →
Assignment of Assignor's Interest Aug 10, 2016
From: ROSE, MATTHIAS; SONSKY, JAN
To: NXP B.V.
Reel/Frame 039398/0756 →
Assignment of Assignor's Interest Aug 31, 2016
From: HOLLAND, STEFFEN; HABENICHT, SOENKE
To: NXP B.V.
Reel/Frame 039607/0067 →
Assignment of Assignor's Interest Sep 8, 2016
From: LEUNG, CHI HO; UMALI, POMPEO V.; YEUNG, SHUN TIK; LAM, KAN WAE
To: NXP B.V.
Reel/Frame 039665/0114 →
Assignment of Assignor's Interest Sep 13, 2016
From: PEAKE, STEVEN THOMAS
To: NXP B.V.
Reel/Frame 039717/0420 →
Assignment of Assignor's Interest Oct 3, 2016
From: VAN BLOKLAND, BOUDEWIJN; KOK, TOM
To: NXP B.V.
Reel/Frame 039923/0603 →
Assignment of Assignor's Interest Oct 4, 2016
From: PEAKE, STEVEN THOMAS
To: NXP B.V.
Reel/Frame 040225/0367 →
Assignment of Assignor's Interest Oct 4, 2016
From: DE RAAD, GIJS JAN; DOMINGUES, SUZANA; HORSTINK, HARRIE MARTINUS MARIA
To: NXP B.V.
Reel/Frame 039927/0429 →
Assignment of Assignor's Interest Oct 6, 2016
From: SANTOS, EUGENE PUMANES; UMALI, POMPEO V.
To: NXP B.V.
Reel/Frame 039961/0896 →
Assignment of Assignor's Interest Oct 6, 2016
From: LAM, KAN WAE; MARIA HORSTINK, HARRIE MARTINUS; WALCZYK, SVEN; LEUNG, CHI HO
To: NXP B.V.
Reel/Frame 039961/0852 →
Assignment of Assignor's Interest Oct 21, 2016
From: SCHUETT, JENNIFER; RITTER, HANS-MARTIN; NOTERMANS, GODFRIED HENRICUS JOSEPHUS
To: NXP B.V.
Reel/Frame 040082/0654 →
Assignment of Assignor's Interest Oct 27, 2016
From: CROON, JEROEN; TAK, COENRAAD CORNELIS
To: NXP B.V.
Reel/Frame 040508/0257 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 041002 Frame: 0454. Assignor(S) Hereby Confirms the Assignment. Feb 27, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 045468/0791 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 004100 Frame 0454. Assignor(S) Hereby Confirms the Assignment of Assignors Interest. Mar 2, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 045488/0106 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 041002 Frame: 0454. Assignor(S) Hereby Confirms the Assignment. Apr 2, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 045816/0219 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 041002 Frame: 0454. Assignor(S) Hereby Confirms the Assignment. Apr 9, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 046545/0592 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 041002 Frame 0454. Assignor(S) Hereby Confirms the Assignment of Assignors Interest. Apr 27, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 046034/0413 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded at Reel: 041002 Frame: 0454. Assignor(S) Hereby Confirms the Assignment. May 16, 2018
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 047052/0276 →
Change of Address Jul 19, 2018
From: NEXPERIA B.V.
To: NEXPERIA B.V.
Reel/Frame 047569/0752 →