Backend taping using fluid assisted fixation

1. A tape packaging apparatus comprising:

a transfer element for transferring a non-curable holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component;

a placing element for placing an electronic component into the at least one pocket, whereby the holding liquid acts to retain the electronic component within the recess at least one pocket;

a sealing tape application element for applying a sealing tape over the carrier tape to close the at least one pocket with the electronic component therein; and

a heater for heating the at least one closed pocket to evaporate the holding liquid out of the at least one closed pocket by permeation of the holding liquid through the carrier tape or the sealing tape or both.

2. The apparatus according to claim 1 , wherein the apparatus further comprises:

an indexing element configured to move the carrier tape through the apparatus, the indexing element being configured to present each pocket of the carrier tape to a holding liquid transfer element of the apparatus to transfer the holding liquid to the pocket and, subsequently, to a pick head to place an electronic component into the at least one pocket to contact the holding liquid placed therein by the holding liquid transfer element and, subsequently, to the sealing tape application element configured to apply of the sealing tape over the carrier tape.

3. The apparatus according to claim 1 , wherein the apparatus comprises a liquid dispensing head configured to align with the at least one pocket and dispense the holding liquid to provide for the transfer of the holding liquid into the at least one pocket of the carrier tape.

4. The apparatus according to claim 1 , wherein the apparatus comprises a pick and place head configured to provide for the placement of the electronic component into the at least one pocket.

5. The apparatus according to claim 1 , wherein the apparatus is configured to receive the carrier tape including an aperture located in the at least one pocket that extends through the carrier tape, the apparatus including a liquid tray configured to present the holding liquid to the carrier tape, the apparatus configured to dip the aperture of the at least one pocket into the holding liquid in the liquid tray thereby providing for the transfer of holding liquid into the pocket by capillary action through the aperture.

6. A method comprising:

transferring a non-curable holding liquid into at least one pocket of a carrier tape with a transfer element, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component;

placing an electronic component into the at least one pocket with a placing element, whereby the holding liquid acts to retain the electronic component within the pocket;

applying a sealing tape over the carrier tape with a sealing tape application element to close the pocket with the electronic component therein, and

heating the at least one closed pocket to evaporate the holding liquid out of the at least one closed pocket by permeation of the holding liquid through one or more of the carrier tape and sealing tape.

7. The method of claim 6 , in which the method includes transferring the holding liquid by one or more of a group comprising:

dispensing the holding liquid into the at least one pocket,

spraying the holding liquid into the at least one pocket,

applying the holding liquid to the electronic component which is transferred to the at least one pocket when the electronic component is placed therein,

jetting the holding liquid into the at least one pocket, and

dipping carrier tape into the holding liquid to provide for transfer of the holding liquid into the at least one pocket by capillary action.

8. The method of claim 6 , in which holding liquid is transferred to a base of the pocket.

9. The method of claim 6 , in which holding liquid is transferred to the pocket to only partially fill the pocket.

10. The method of claim 9 , in which holding liquid is transferred to the pocket to fill the pocket to less than 10% of the volume of the pocket.

11. The method of claim 6 , in which placing the electronic component comprises placing the electronic component directly onto the holding liquid present within the pocket.

12. The method of claim 6 , in which applying a sealing tape comprises placing the sealing tape over the carrier tape at a position that covers an open end of the at least one pocket and applying thermo-compression between the sealing tape and carrier tape.