Method and structure to fabricate a nanoporous membrane

1. A method of forming a semiconductor structure, said method comprising:

providing an opening extending partially into a semiconductor substrate;

forming a self-assembled heteroepitaxial oxide nanocomposite film in said opening, said self-assembled heteroepitaxial oxide nanocomposite film comprising alternating layers of a first metal oxide having a first melting point and a second metal oxide having a second melting point that differs from the first melting point;

performing a first thermal treatment to form initial pores in said self-assembled heteroepitaxial oxide nanocomposite film;

performing an etch to expose a bottommost surface of the self-assembled heteroepitaxial oxide nanocomposite film having said initial pores; and

performing a second thermal treatment to convert the self-assembled heteroepitaxial oxide nanocomposite film having the initial pores into a nanoporous membrane.

2. The method of claim 1 , further comprising forming an epitaxial buffer layer on an exposed portion of the semiconductor substrate within the opening prior to forming said self-assembled heteroepitaxial oxide nanocomposite film.

3. The method of claim 1 , wherein said first thermal treatment removes portions of each layer of said second metal oxide to provide said initial pores.

4. The method of claim 3 , wherein said second thermal treatment removes remaining portions of each layer of said second metal oxide to provide said nanoporous membrane comprising spaced apart layers of said first metal oxide.

5. The method of claim 1 , wherein said first thermal treatment are selected from UV exposure, and annealing.

6. The method of claim 1 , wherein an amorphous silicon layer is formed on exposed surfaces of said semiconductor substrate and said self-assembled heteroepitaxial oxide nanocomposite film having said initial pores.

7. The method of claim 1 , further comprising:

forming a metal or metal alloy via structure in said semiconductor substrate and on both sides of said opening containing said self-assembled heteroepitaxial oxide nanocomposite film having said initial pores; and

thinning said semiconductor substrate after performing said second thermal treatment to expose a surface of each metal of metal alloy via structure.

8. The method of claim 7 , further comprising bonding a semiconductor wafer comprising complementary metal oxide semiconductor (CMOS) circuits to a surface of said semiconductor substrate opposite a surface including said nanoporous membrane.

9. The method of claim 8 , wherein said semiconductor wafer includes metal or metal alloy via structures extending entirely through said semiconductor wafer and located adjacent said CMOS circuitry.

10. The method of claim 9 , wherein said metal or metal alloy via structures of said semiconductor wafer are in direct contact with said metal or metal alloy via structures present in said semiconductor substrate.