Methods and system for controlling a surface profile of a wafer

1. A method for controlling a surface profile of a wafer sliced from an ingot with a wire saw, the method comprising:

measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;

storing the measured amount of displacement of the sidewall as displacement data;

determining a pressure profile for adjusting a position of the sidewall based on the stored displacement data of the sidewall; and

applying pressure to the sidewall with a mechanical actuator according to the determined pressure profile to control the position of the sidewall.

2. The method of claim 1 , wherein measuring an amount of displacement of a sidewall comprises measuring a relative amount of displacement of the sidewall relative to another portion of the wire saw frame.

3. The method of claim 1 further comprising fine tuning a position of the wire guide comprising:

measuring a relative amount of displacement between the wire guide and the sidewall to generate wire guide displacement data; and

controlling the position of the wire guide based on the wire guide displacement data.

4. The method of claim 3 , wherein the mechanical actuator is a first mechanical actuator, and wherein controlling the position of the wire guide comprises:

connecting a second mechanical actuator to the bearing of a wire guide; and

axially displacing the bearing relative to the frame of the wire saw with the second mechanical actuator.

5. The method of claim 1 further comprising:

measuring a relative amount of displacement between an ingot holder and a saw head assembly of the wire saw; and

storing the measured relative amount of displacement as ingot displacement data, wherein determining a pressure profile for adjusting a position of the sidewall is further based on the stored ingot displacement data.

6. The method of claim 1 , wherein measuring an amount of displacement of a sidewall comprises measuring an absolute amount of displacement of the sidewall relative to an external spatial reference system.

7. The method of claim 1 , wherein measuring an amount of displacement of a sidewall comprises measuring the relative amount of displacement between the bearing and the sidewall.

8. A method for controlling a surface profile of a wafer during a cutting operation of an ingot, the method comprising:

initiating the cutting operation on the ingot using a wire saw to produce the wafer;

measuring, in real-time during the cutting operation, an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;

determining, in real-time during the cutting operation, an amount of pressure for adjusting a position of the sidewall based on the measured amount of displacement of the sidewall; and

applying, in real-time during the cutting operation, the determined amount of pressure to the sidewall with a mechanical actuator, wherein the application of the determined amount of pressure facilitates counteracting the measured amount of displacement of the sidewall.

9. The method of claim 8 further comprising measuring in real-time during the cutting operation, a relative amount of displacement between a saw head assembly of the wire saw and the sidewall, wherein determining the amount of pressure for adjusting the position of the sidewall is further based on the measured relative amount of displacement of the saw head assembly.

10. The method of claim 8 further comprising fine tuning a position of the wire guide in real-time during the cutting operation comprising:

measuring, in real-time during the cutting operation, a relative amount of displacement between the wire guide and the sidewall; and

applying, in real-time during the cutting operation, an amount of pressure to the wire guide to facilitate counteracting the measured amount of displacement of the wire guide.

11. The method of claim 10 , wherein the mechanical actuator is a first mechanical actuator, and wherein applying, in real-time during the cutting operation, an amount of pressure to the wire guide comprises:

connecting a second mechanical actuator to the bearing of a wire guide; and

operating the second mechanical actuator to axially displace the bearing relative to the frame of the wire saw.

12. The method of claim 8 wherein measuring, in real-time during the cutting operation, an amount of displacement of a sidewall comprises measuring a relative amount of displacement of the sidewall relative to another portion of the wire saw frame.

13. A system for controlling a surface profile of a wafer sliced from an ingot with a wire saw, the system comprising:

a sensor for measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;

a mechanical actuator connected to the sidewall; and

a computing device connected in communication to the sensor and the mechanical actuator, the computing device comprising a memory and a processor, the processor configured to:

store, in the memory, the measured amount of displacement of the sidewall as displacement data;

determine a pressure profile for adjusting a position of the sidewall based on the stored displacement data of the sidewall; and

transmit a control signal to the mechanical actuator to apply pressure to the sidewall with the mechanical actuator according to the determined pressure profile to control the position of the sidewall.

14. The system of claim 13 further comprising a saw head assembly and a saw head assembly sensor for measuring a relative amount of displacement between the saw head assembly and the sidewall.

15. The system of claim 14 , wherein the processor is further configured to store the measured relative amount of displacement as saw head assembly displacement data, wherein determining the pressure profile for adjusting the position of the sidewall is further based on the saw head assembly displacement data.

16. The system of claim 13 further comprising:

a wire guide sensor for measuring a relative amount of displacement between the wire guide and the sidewall to generate wire guide displacement data; and

a bearing mechanical actuator connected to the bearing of a wire guide.

17. The system of claim 16 , wherein the processor is further configured to transmit a control signal to the bearing mechanical actuator to control the position of the wire guide based on the wire guide displacement data.

18. The system of claim 13 , wherein the sensor is connected to the bearing for measuring a relative amount of displacement between an inner race and an outer race of the bearing.

19. The system of claim 13 , wherein the sensor is connected to the bearing for measuring a relative amount of displacement between an inner shaft of the bearing and the sidewall.

20. The system of claim 13 , wherein the sensor is connected to the sidewall for measuring an absolute amount of displacement of the sidewall relative to an external spatial reference system.

21. The system of claim 13 in combination with a wire saw including a frame, a sidewall, a wire guide, and a wire web.

22. The method of claim 1 , wherein the mechanical actuator comprises at least one of an air piston, a hydraulic actuator, and an electro-mechanical actuator.