IP Library Granted Patent US 10,195,697
Granted Patent B2
US 10,195,697 · App. 15/248,196 · Granted Feb 5, 2019

Palladium (Pd)-coated copper wire for ball bonding

Inventors: Hiroyuki Amano (Saga-ken, JP); Somei Yarita (Saga-ken, JP); Yusuke Sakita (Saga-ken, JP); Yuki Antoku (Saga-ken, JP); Wei Chen (Saga-ken, JP)
Assignee: TANAKA DENSHI KOGYO K.K.
B23K35/0227B21C1/02B23K35/302B32B15/018C22C5/02C22C5/04C22C9/00C22C9/06C22F1/08C22F1/14C23C14/165C23C14/35C23C26/00C25D3/50H01L2224/05624H01L2224/45H01L2224/45015H01L2224/45147H01L2224/45565H01L2224/45664H01L2924/00011H01L2924/10253
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Quick Facts
Patent No.
US 10,195,697
App. No.
15/248,196
Granted
Feb 5, 2019
Kind
B2
Abstract

A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.

Claims (21)

1. A palladium coated copper wire for ball bonding, comprising:

a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and

a palladium drawn coated layer of an eutectoid of sulfur or phosphorus coated on the core,

wherein the copper wire has a diameter of 10 to 25 μm, and

the palladium drawn coated layer contains the sulfur or the phosphorus in an amount of 30-700 mass ppm.

2. The palladium coated copper wire according to claim 1 , further comprising a gold drawn coated layer coated on the palladium drawn coated layer.

3. The palladium coated copper wire according to claim 1 , wherein the copper alloy contains 0.1 to 1.5% by mass of platinum or nickel.

4. The palladium coated copper wire according to claim 1 , wherein the palladium drawn coated layer has a theoretical film thickness of 30 nm or more and 300 nm or less.

5. The palladium coated copper wire according to claim 1 , wherein the palladium drawn coated layer is a drawn layer of a plating precipitate from a wet plating bath.

6. A palladium coated copper wire for ball bonding, comprising:

a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and

a palladium drawn coated layer coated on the core,

wherein the copper wire has a diameter of 10 to 25 μm,

the palladium drawn coated layer contains sulfur, phosphorus, boron or carbon, and

30 to 300 mass ppm of the sulfur is contained in the palladium drawn coated layer.

7. A palladium coated copper wire for ball bonding, comprising:

a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and

a palladium drawn coated layer coated on the core,

wherein the copper wire has a diameter of 10 to 25 μm,

the palladium drawn coated layer contains sulfur, phosphorus, boron or carbon, and

the palladium drawn coated layer has a sulfur concentrated portion on an outer surface side, and a portion where sulfur is equal to or less than a detection limit on a core side.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 039552 FRAME: 0622. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 13, 2016
From: AMANO, HIROYUKI; YARITA, SOMEI; SAKITA, YUSUKE; ANTOKU, YUKI; CHEN, WEI
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 040015/0231 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2016
From: AMANO, HIROYUKI; YARITA, SOMEI; SAKITA, YUSUKE; ANTOKU, YUKI; CHEN, WEI
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 039552/0622 →
Priority Claims (1)
JP 2015-172778 · Sep 2, 2015 · national
Continuity (1)
Related Publication 20170057020A1 · Mar 2, 2017