Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening

1. An electronic device, comprising:

a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face; and

a substrate, wherein the semiconductor chip is disposed above a first major surface of the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element, and wherein the substrate includes a ring-like structure defining a perimeter of the substrate opening, the ring-like structure being spaced from remaining portions of the substrate.

2. The electronic device according to claim 1 , further comprising

an encapsulation material covering the second main face, the side faces, and a portion of the first main face, the encapsulation material comprising an encapsulation material opening above the first main face, the encapsulation material opening at least partially overlapping with the substrate opening.

3. The electronic device according to claim 2 , wherein

at least a part of a wall of the encapsulation material opening is exposed to the outside.

4. The electronic device according to claim 2 , wherein

a ring-like structure of an adhesive or a glue is disposed at an entire wall of the opening.

5. The electronic device of claim 2 , wherein the ring-like structure is spaced from the remaining portions of the substrate by the encapsulation material.

6. The electronic device according to claim 1 , wherein

the semiconductor chip comprises at least one contact pad at the first main face, the contact pad being connected with a contact area of the substrate.

7. The electronic device according to claim 6 , wherein

the contact pad is connected to the contact area via a through-connection formed in an encapsulation material.

8. The electronic device according to claim 7 , wherein

the through-connection is formed by a copper pillar or a copper bump.

9. The electronic device according to claim 1 , wherein

the sensor element comprises a pressure sensor including at least a capacitive pressure sensor.

10. The electronic device of claim 1 , wherein the ring-like structure extends from the first major surface to a position short of contact with the first main face of the semiconductor chip.

11. The electronic device of claim 10 , wherein the ring-like structure is electrically isolated from the remaining portion of the substrate.

12. The electronic device of claim 1 , wherein the ring-like structure extends from the first major surface to a position of contact with the first main face of the semiconductor chip.

13. The electronic device of claim 1 , the first major surface of the substrate facing the semiconductor chip, the first major surface of the substrate including a first major surface of the ring-like structure and a first major surface of the remaining portions of the substrate.

14. The electronic device of claim 13 , the remaining portion of the substrate comprising contact portions.

15. An electronic device, comprising:

a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face; and

a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element, wherein a ring-like structure of an adhesive or a glue is disposed at an entire wall of the opening, and wherein the adhesive or glue comprises an anisotropic electrical conductivity and is originally non-conductive but becomes conductive upon the exertion of pressure.

16. The electronic device according to claim 15 , wherein

a contact pad connected to a contact area via a through-connection formed in the adhesive or glue.

17. An electronic device, comprising:

a semiconductor chip comprising a first main face comprising a MEMS structure disposed thereon; and

a substrate, wherein the semiconductor chip is mounted on the substrate in a flip-chip configuration, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to or from the MEMS structure, and wherein the substrate includes a ring-like structure defining a perimeter of the substrate opening, the ring-like structure being spaced from remaining portions of the substrate.

18. The electronic device according to claim 17 , further comprising

an encapsulation material embedding the semiconductor chip, the encapsulation material comprising an opening adjacent to the MEMS structure so that the MEMS structure is exposed to the outside.

19. The electronic device according to claim 17 , wherein

the opening comprises a circular or rectangular cross-section.

20. The electronic device according to claim 17 , wherein

the MEMS structure comprises a pressure sensor including at least a capacitive pressure sensor.

21. A method for fabricating an electronic device, comprising:

providing a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face;

providing a substrate, the substrate having a first major surface and comprising a ring-like structure defining a perimeter of a substrate opening, the ring-like structure being spaced from remaining portions of the substrate; and

disposing the semiconductor chip above the substrate so that the first main face of the semiconductor chip faces the first major surface of the substrate and the substrate opening is situated below the sensor element or actuator element, thereby permitting passage of signals to the sensor element or from the actuator element, the ring-like structure protruding from the first major surface toward the first main face of the semiconductor chip.

22. The method according to claim 21 , further comprising

applying an encapsulation material to the semiconductor chip in such a way that the encapsulation material covers the second main face, the side faces and a portion of the first main face, wherein the encapsulation material comprises an opening adjacent to the sensor element so that the sensor element is exposed to the outside.

23. The method according to claim 22 , wherein

applying the encapsulation material is performed in such a way that at least a part of a wall of the opening is exposed to the outside.

24. The method according to claim 22 , wherein

during applying the encapsulation material a blocking member with spatial dimensions of the desired opening is placed in a position of the desired opening.

25. The method of claim 22 , wherein

before applying the encapsulation material a ring-like structure of a non-metallic and non-photoresist material is applied at the first main face, the ring-like structure surrounding the sensor element.

26. A method for fabricating an electronic device, comprising:

providing a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face;

providing a substrate, the substrate having a first major surface and comprising a ring-like structure defining a perimeter of a substrate opening;

disposing the semiconductor chip above the substrate so that the first main face of the semiconductor chip faces the first major surface of the substrate and the substrate opening is situated below the sensor element or actuator element, thereby permitting passage of signals to the sensor element or from the actuator element, the ring-like structure protruding from the first major surface toward the first main face of the semiconductor chip; and

applying an encapsulation material to the semiconductor chip in such a way that the encapsulation material covers the second main face, the side faces and a portion of the first main face, wherein the encapsulation material comprises an opening adjacent to the sensor element so that the sensor element is exposed to the outside, wherein applying the encapsulation material comprises film-assisted molding.