PAI-based coating compositions
A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from a mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.
1. A coating compound generated by a process comprising:
mixing a first solvent, the first solvent being N-formyl morpholine (NFM), with a second solvent, to form a first solution;
dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution;
precipitation a PAI compound from a mixture of methyl ethyl ketone (MEK) and the first solution; and
dissolving the PAI compound in a second solution to generate the coating compound, the second solution including one or more of:
N-butyl pyrrolidone (NBP),
ethylene glycol, or
a solution of an a) amine, b) one or more solvents, and c) water.
2. The coating compound of claim 1 , wherein the second solvent is MEK.
3. The coating compound of claim 1 , further comprising generating a film from the coating compound.
4. The coating compound of claim 1 , wherein the second solution includes NBP.
5. The coating compound of claim 4 , wherein the second solution is further formed with one or more organic co-solvents.
6. The coating compound of claim 1 , wherein the process further comprises applying the coating compound in an electronic applications as a single or multilayer film including a conductive ink.
7. The coating compound of claim 1 , wherein the process further comprises applying the coating compound as an additive for an automotive coating application.
8. The coating compound of claim 1 , wherein the process further comprises applying the coating compound by spraying, brushing, dipping, rolling, misting, or other technique as a binder in an application including one or pipes, pots, pans, rubber rollers and nonstick cookware applications alone or in combination with polyethersulfones, polyetherimides, polyimides, or combinations thereof.
9. The coating compound of claim 1 , wherein the process further comprises applying the coating compound for corrosion-resistance for a metal substrate or other substrate.
10. The coating compound of claim 1 , wherein the process further comprises applying the coating compound in pre-treatment of another polymer film, wherein the another polymer film includes a polyester film, a polyamide film, a polyimide film, a polyetherimide, or a polyether sulfone film, or combinations thereof.
11. The coating compound of claim 1 , wherein the process further comprises applying the coating compound as an adhesive to plastic or metallic film materials.
12. The coating compound of claim 1 , wherein the process further comprises applying the coating compound as an additive to improve performance of inks.
13. The coating compound of claim 1 , wherein the process further comprises applying the coating compound in an industrial spray coating in a metallic or plastic thermal spray coating systems.
14. The coating compound of claim 1 , wherein the process further comprises applying the coating compound in wire enamels and enamels in container coating applications.
15. The coating compound of claim 1 , wherein the process further comprises applying the coating compound is applied in non-treated or heat treated fibers, wherein the fibers are coated from a film utilizing the coating compound.
16. The coating compound of claim 1 , wherein the process further comprises applying the coating compound to a polyimide film surface.