IP Library Granted Patent US 10,243,140
Granted Patent B2
US 10,243,140 · App. 15/251,595 · Granted Mar 26, 2019

Manufacturing method of magnetoresistive element and vacuum processing apparatus

Inventors: Makoto Satake (Tokyo, JP); Masaki Yamada (Tokyo, JP); Kenetsu Yokogawa (Tokyo, JP)
Assignee: Hitachi High-Technologies Corporation
H01L43/12H01J37/32816H01L27/228H01L43/02H01L43/08
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Quick Facts
Patent No.
US 10,243,140
App. No.
15/251,595
Granted
Mar 26, 2019
Kind
B2
Abstract

The present invention is a manufacturing method for manufacturing a magnetoresistive element, including a first step for oxidizing or reducing a magnetic film constituting the magnetoresistive element and a metal oxidation film constituting the magnetoresistive element, and a second step performed after the first step, wherein in the second step, in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are oxidized, the oxidized magnetic film constituting the magnetoresistive element or the oxidized metal oxidation film constituting the magnetoresistive element is selectively reduced, and in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are reduced, the reduced magnetic film constituting the magnetoresistive element or the reduced metal oxidation film constituting the magnetoresistive element is selectively oxidized.

Claims (11)

1. A vacuum processing apparatus for manufacturing, in a vacuum state, a magnetoresistive element including a first magnetic film, a metal oxidation film disposed at an upper side of the first magnetic film, and a second magnetic film disposed at an upper side of the metal oxidation film, the vacuum processing apparatus comprising:

a first processing chamber for oxidizing or reducing the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element; and

a second processing chamber, wherein after the processing of the first processing chamber, in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are oxidized, the oxidized magnetic film constituting the magnetoresistive element or the oxidized metal oxidation film constituting the magnetoresistive element is selectively reduced, and in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are reduced, the reduced magnetic film constituting the magnetoresistive element or the reduced metal oxidation film constituting the magnetoresistive element is selectively oxidized, wherein

the first processing chamber and the second processing chamber are processing chambers in which processing is performed in a vacuum state.

2. The vacuum processing apparatus according to claim 1 , wherein the first processing chamber is a processing chamber in which oxidation processing is performed.

3. A vacuum processing apparatus for manufacturing, in a vacuum state, a magnetoresistive element including a first magnetic film, a metal oxidation film disposed at an upper side of the first magnetic film, and a second magnetic film disposed at an upper side of the metal oxidation film, the vacuum processing apparatus comprising a processing chamber that performs:

a first step for oxidizing or reducing a magnetic film constituting the magnetoresistive element and a metal oxidation film constituting the magnetoresistive element; and

a second step performed after the first step, wherein in the second step, in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are oxidized, the oxidized magnetic film constituting the magnetoresistive element or the oxidized metal oxidation film constituting the magnetoresistive element is selectively reduced, and in a case where the magnetic film constituting the magnetoresistive element and the metal oxidation film constituting the magnetoresistive element are reduced, the reduced magnetic film constituting the magnetoresistive element or the reduced metal oxidation film constituting the magnetoresistive element is selectively oxidized, wherein

the processing chamber is a processing chamber in which processing is performed in a vacuum state.

4. The vacuum processing apparatus according to claim 3 , wherein the processing chamber is independently arranged with a first gas introduction mechanism introducing an oxidation processing gas and a second gas introduction mechanism introducing a reduction processing gas.

5. The vacuum processing apparatus according to claim 4 , wherein the first gas introduction mechanism is provided with a mechanism for preventing the reduction processing gas from being mixed by passing a rare gas or a mixed gas of the rare gas and a nitrogen gas.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2016
From: SATAKE, MAKOTO; YAMADA, MASAKI; YOKOGAWA, KENETSU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 039586/0704 →
Priority Claims (1)
JP 2016-000030 · Jan 4, 2016 · national
Continuity (1)
Related Publication 20170194560A1 · Jul 6, 2017