Polyester polyols for reactive hot-melt adhesives
Semi-crystalline polyester polyols and their use in reactive hot-melt adhesives are disclosed. The polyols comprise recurring units of a C 2 -C 10 aliphatic diol, a C 8 -C 24 aliphatic dicarboxylic acid, and 1 to 20 wt. % of an aromatic dicarboxylic acid source, a polycarbonate, or a combination thereof. The polyols have a hydroxyl number within the range of 14 to 112 mg KOH/g. Reactive hot-melt adhesives from the polyols and composite structures produced using the adhesives are also disclosed. A minor proportion of aromatic dicarboxylic acid, polycarbonate content in the polyester polyol surprisingly improves the properties of reactive hot-melt adhesives when compared with a commercial hot-melt adhesive or an adhesive formulated using an all-aliphatic polyester polyol. The adhesives are useful for bonding a wide variety of substrates, including paper, wood, glass, ceramics, plastics, and metals.
1. A semi-crystalline polyester polyol comprising recurring units of:
(a) a C 2 -C 10 aliphatic diol;
(b) a C 8 -C 24 aliphatic dicarboxylic acid; and
(c) (i) an aromatic dicarboxylic acid source consisting of recycled polyethylene terephthalate,
(ii) bisphenol A polycarbonate, or
(iii) a combination of (i) and (ii);
wherein 5 to 15 wt. % of the recycled polyethylene terephthalate or the bisphenol A polycarbonate is used based on the combined amounts of components (b) and (c);
wherein the polyol has a hydroxyl number within the range of 14 to 112 mg KOH/g;
and wherein the polyol has a crystallization temperature within the range of −20° C. to 35° C. as measured by differential scanning calorimetry during a heating or cooling cycle at 10° C. per minute.
2. The polyol of claim 1 having a crystallization temperature within the range of −20° C. to 10° C.
3. The polyol of claim 1 wherein the aliphatic diol is selected from the group consisting of ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2-methyl-1,3-propanediol, neopentyl glycol, 1,5-pentanediol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, 3-methyl-1,5-pentanediol, 1,4-cyclohexanedi-methanol, 1,3-cyclohexanedimethanol, diethylene glycol, dipropylene glycol, triethylene glycol, 1,6-hexanediol, 1,8-octanediol, tripropylene glycol, tetraethylene glycol and mixtures thereof.
4. The polyol of claim 1 wherein the aliphatic diol is selected from the group consisting of 1,3-propanediol, 1,4-butanediol, and mixtures thereof.
5. The polyol of claim 1 wherein the aliphatic dicarboxylic acid is selected from the group consisting of suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, septadecanedioic acid, octadecanedioic acid, and mixtures thereof.
6. The polyol of claim 1 wherein the aliphatic dicarboxylic acid comprises at least 60 wt. % of azelaic acid.
7. The polyol of claim 1 wherein the aliphatic dicarboxylic acid is selected from the group consisting of azelaic acid, octadecanoic acid, and mixtures thereof, and the aliphatic diol is selected from the group consisting of 1,3-propanediol, 1,4-butanediol, and mixtures thereof.
8. The polyol of claim 1 having an average hydroxyl functionality within the range of 1.8 to 2.7.
9. A reactive hot-melt adhesive comprising a reaction product of:
(a) a polyisocyanate; and
(b) the semi-crystalline polyester polyol of claim 1 ;
wherein prior to curing, the adhesive has a free NCO content within the range of 0.5 to 8.0 wt. %.
10. The adhesive of claim 9 wherein the polyisocyanate is selected from the group consisting of MDI, polymeric MDIs, and hexamethylene diisocyanate.
11. The adhesive of claim 9 wherein the polyisocyanate is MDI.
12. The adhesive of claim 9 wherein prior to curing, the adhesive has a free NCO content within the range of 1.0 to 5.0 wt. %.
13. The adhesive of claim 9 further comprising an adhesion promoter selected from the group consisting of N-ethylaminoisobutyl trimethoxysilane, tris(3-(trimethoxysilyl)propyl)isocyanurate, 3-aminopropyltriethoxysilane, 3-isocyanato-propyl trimethoxysilane, 3-isocyanatopropyl triethoxysilane, and 3-glycidoxypropyl-methyldiethoxysilane.
14. The adhesive of claim 9 wherein the adhesion promoter is 3-aminopropyltriethoxysilane.
15. A composite structure comprising a wood, paper, glass, ceramic, plastic, or metal substrate and a cured hot-melt adhesive of claim 9 bonded to at least one surface of the substrate.
16. The composite structure of claim 15 wherein the substrate is selected from the group consisting of polyolefin, aluminum, polycarbonate, and polyvinylchloride.
17. A semi-crystalline polyester polyol comprising recurring units of:
(a) a C 2 -C 10 aliphatic diol;
(b) a C 8 -C 24 aliphatic dicarboxylic acid; and
(c) bisphenol A polycarbonate;
wherein 1 to 20 wt. % of the bisphenol A polycarbonate is used based on the combined amounts of components (b) and (c); and
wherein the polyol has a hydroxyl number within the range of 14 to 112 mg KOH/g.
18. The polyol of claim 17 having a crystallization temperature within the range of −20° C. to 35° C. as measured by differential scanning calorimetry during a heating or cooling cycle at 10° C. per minute.
19. The polyol of claim 17 having a crystallization temperature within the range of −20° C. to 10° C.
20. A reactive hot-melt adhesive comprising a reaction product of:
(a) a polyisocyanate; and
(b) the semi-crystalline polyester polyol of claim 17 ;
wherein prior to curing, the adhesive has a free NCO content within the range of 0.5 to 8.0 wt. %.