Multilayer electronic component
A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.
1. A multilayer electronic component comprising an element body having an internal electrode layer and a dielectric layer, both of which are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction, wherein
a pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer,
a pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer,
a main component of the insulating layer is constituted by glass containing Si at 25 wt % or more,
the external electrode includes glass containing at least Si,
the external electrode covers an end portion in the second axial direction of the insulating layer in the side surface,
a diffusing layer is present at least at a bonding portion of the insulating layer with the external electrode in the side surface, and
a gradient of a concentration of Si is present in the diffusing layer along a direction perpendicular to the bonding portion.
2. The multilayer electronic component according to claim 1 , wherein
a pair of main surfaces facing each other in the third axis direction of the element body is respectively equipped with the insulating layer,
the external electrode covers an end portion in the second axial direction of the insulating layer in the main surface, and
the diffusing layer is present at least at a bonding portion of the insulating layer with the external electrode in the main surface.
3. The multilayer electronic component according to claim 1 , wherein
dD/dGD is 0.003 to 0.3, where
dD denotes a thickness of the diffusing layer along a direction perpendicular to the bonding portion and
dGD denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dD.
4. The multilayer electronic component according to claim 2 , wherein
dD/dGD is 0.003 to 0.3, where
dD denotes a thickness of the diffusing layer along a direction perpendicular to the bonding portion and
dGD denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dD.
5. The multilayer electronic component according to claim 1 , wherein
GSi/TSi satisfies 1.0<GSi/TSi≦15.0, where
GSi denotes an average weight ratio of Si contained in the glass of the insulating layer and
TSi denotes an average weight ratio of Si contained in the glass of the external electrode.
6. The multilayer electronic component according to claim 2 , wherein
GSi/TSi satisfies 1.0<GSi/TSi≦15.0, where
GSi denotes an average weight ratio of Si contained in the glass of the insulating layer and
TSi denotes an average weight ratio of Si contained in the glass of the external electrode.
7. The multilayer electronic component according to claim 3 , wherein
GSi/TSi satisfies 1.0<GSi/TSi≦15.0, where
GSi denotes an average weight ratio of Si contained in the glass of the insulating layer and
TSi denotes an average weight ratio of Si contained in the glass of the external electrode.
8. The multilayer electronic component according to claim 4 , wherein
GSi/TSi satisfies 1.0<GSi/TSi≦15.0, where
GSi denotes an average weight ratio of Si contained in the glass of the insulating layer and
TSi denotes an average weight ratio of Si contained in the glass of the external electrode.
9. The multilayer electronic component according to claim 5 , wherein
an aggregated portion having glass aggregated is present on the external electrode side of the bonding portion,
0.2<dT1/dGT1 is satisfied in any cutting plane parallel to the first axis and the second axis, where
dT1 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT1 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT1, and
2≦nA1 is satisfied, where
nA1 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the side surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
10. The multilayer electronic component according to claim 6 , wherein
an aggregated portion having glass aggregated is present on the external electrode side of the bonding portion,
0.2<dT1/dGT1 is satisfied in any cutting plane parallel to the first axis and the second axis, where
dT1 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT1 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT1, and
2≦nA1 is satisfied, where
nA1 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the side surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
11. The multilayer electronic component according to claim 7 , wherein
an aggregated portion having glass aggregated is present on the external electrode side of the bonding portion,
0.2<dT1/dGT1 is satisfied in any cutting plane parallel to the first axis and the second axis, where
dT1 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT1 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT1, and
2≦nA1 is satisfied, where
nA1 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the side surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
12. The multilayer electronic component according to claim 8 , wherein
an aggregated portion having glass aggregated is present on the external electrode side of the bonding portion,
0.2<dT1/dGT1 is satisfied in any cutting plane parallel to the first axis and the second axis, where
dT1 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT1 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT1, and
2≦nA1 is satisfied, where
nA1 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the side surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
13. The multilayer electronic component according to claim 9 , wherein
0.2<dT3/dGT3 is satisfied in any cutting plane parallel to the second axis and the third axis, where
dT3 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT3 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT3, and
2≦nA3 is satisfied, where
nA3 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the main surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
14. The multilayer electronic component according to claim 10 , wherein
0.2<dT3/dGT3 is satisfied in any cutting plane parallel to the second axis and the third axis, where
dT3 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT3 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT3, and
2≦nA3 is satisfied, where
nA3 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the main surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
15. The multilayer electronic component according to claim 11 , wherein
0.2<dT3/dGT3 is satisfied in any cutting plane parallel to the second axis and the third axis, where
dT3 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT3 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT3, and
2≦nA3 is satisfied, where
nA3 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the main surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.
16. The multilayer electronic component according to claim 12 , wherein
0.2<dT3/dGT3 is satisfied in any cutting plane parallel to the second axis and the third axis, where
dT3 denotes a maximum thickness of the aggregated portion along a direction perpendicular to the bonding portion and
dGT3 denotes a thickness of the insulating layer present on an inner side in a direction perpendicular to the bonding portion of a site corresponding to the thickness dT3, and
2≦nA3 is satisfied, where
nA3 denotes the number of interface aggregation present in a region from an end to 100 μm in the second axis direction of the external electrode of the main surface, wherein
the interface aggregation denotes the aggregated portion in contact with the insulating layer.