IP Library Granted Patent US 9,875,920
Granted Patent B1
US 9,875,920 · App. 15/270,419 · Granted Jan 23, 2018

Substrate processing apparatus

Inventor: Yasuhiro Mizuguchi (Toyama, JP)
Assignee: HITACHI KOKUSAI ELECTRIC, INC.
H01L21/6719C23C16/4412C23C16/455C23C16/52H01L21/67017H01L21/67196H01L21/67253H01L21/67271H01L21/67288
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Quick Facts
Patent No.
US 9,875,920
App. No.
15/270,419
Granted
Jan 23, 2018
Kind
B1
Abstract

A substrate processing apparatus includes: a plurality of modules configured to process a substrate; a transfer chamber adjoining the modules; a transfer part configured to transfer the substrate to one of the modules; a reception part configured to receive process information of the substrate; a detection part configured to detect quality information of the respective modules; a table in which the process information corresponds to the quality information; a memory part configured to store the table; and a controller configured to compare the process information received by the reception part with the quality information detected by the detection part using the table, configured to select one of the modules corresponding to the process information, and configured to instruct the transfer part to transfer the substrate to the selected module.

Claims (24)

1. A substrate processing apparatus, comprising:

a plurality of modules configured to process a substrate;

a transfer chamber adjoining the modules;

a transfer part configured to transfer the substrate to one of the modules;

a reception part configured to receive process information of the substrate;

a plurality of sensors, which is attached to the modules, configured to detect quality information of the respective modules, the quality information including quality information of components of the respective modules;

a table in which a plurality of predetermined process information items are in a direct relationship with a plurality of predetermined quality information items;

a memory part configured to store the table; and

prior to processing the substrate, a controller configured to select, from the plurality of the predetermined quality information items in the table, a quality information item based on the received process information, configured to compare the selected quality information item with the detected quality information, configured to select one of the modules corresponding to the received process information based on a result of the comparison, and configured to instruct the transfer part to transfer the substrate to the selected module prior to processing the substrate.

2. The apparatus of claim 1 , wherein each of the modules includes a plurality of reactors, and the predetermined quality information items include common component quality information items, which are quality information items for common components of the reactors, and reactor quality information items, which are quality information items for components of each of the reactors.

3. The apparatus of claim 2 , wherein the memory part is configured to further store a plurality of process recipes, and the controller is configured to select one of the process recipes according to the selected quality information item.

4. The apparatus of claim 2 , wherein the predetermined quality information items have a plurality of levels, and the controller is configured to, when selecting one of the modules, determine whether the selected quality information item meets a level required in the received process information.

5. The apparatus of claim 2 , wherein the plurality of sensors is configured to detect, as the quality information, an operation time of a component constituting each of the modules or a cumulative processed wafer number in each of the modules.

6. The apparatus of claim 2 , wherein each of the modules includes a gas supply system configured to supply a gas to the reactors and an exhaust system configured to exhaust the gas from the reactors, and the plurality of sensors is configured to, when detecting an operation time of each of the modules, detect an operation time of the gas supply system or the exhaust system.

7. The apparatus of claim 1 , wherein the memory part is configured to further store a plurality of process recipes, and the controller is configured to select one of the process recipes according to the selected quality information item.

8. The apparatus of claim 7 , wherein the predetermined quality information items have a plurality of levels, and the controller is configured to, when selecting one of the modules, determine whether the selected quality information item meets a level required in the received process information.

9. The apparatus of claim 7 , wherein the plurality of sensors is configured to detect, as the quality information, an operation time of a component constituting each of the modules or a cumulative processed wafer number in each of the modules.

10. The apparatus of claim 1 , wherein the predetermined quality information items have a plurality of levels, and the controller is configured to, when selecting one of the modules, determine whether the selected quality information item meets a level required in the received process information.

11. The apparatus of claim 10 , wherein the plurality of sensors is configured to detect, as the quality information, an operation time of a component constituting each of the modules or a cumulative processed wafer number in each of the modules.

12. The apparatus of claim 1 , wherein the plurality of sensors is configured to detect, as the quality information, an operation time of a component constituting each of the modules or a cumulative processed wafer number in each of the modules.

13. The apparatus of claim 1 , wherein each of the modules includes a plurality of reactors configured to process the substrate, a gas supply system configured to supply a gas to the reactors and an exhaust system configured to exhaust the gas from the reactors, and the plurality of sensors is configured to, when detecting an operation time of each of the modules, detect an operation time of the gas supply system or the exhaust system.

14. The apparatus of claim 2 , wherein the common components includes a component shared by the plurality of reactors.

15. The apparatus of claim 3 , wherein the controller is configured to, if the substrate is loaded into and processed in each of the plurality of reactors, select one of the process recipes to set the plurality of reactors to be under a same condition.

16. The apparatus of claim 3 , wherein the controller is configured to, if the substrate is loaded into at least one first reactor of the plurality of reactors and is not loaded into at least one second reactor of the plurality of reactors, select different process recipes, from the stored process recipes, for the at least one first reactor and the at least one second reactor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2016
From: MIZUGUCHI, YASUHIRO
To: HITACHI KOKUSAI ELECTRIC INC
Reel/Frame 039802/0247 →
Priority Claims (1)
JP 2016-143329 · Jul 21, 2016 · national