Integrated circuits having transistors with high holding voltage and methods of producing the same
Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a substrate and a source in electrical communication with the substrate. A drain is also in electrical communication with the substrate. A gate overlies the substrate between the source and the drain, wherein a channel is defined within the substrate directly underlying the gate, and where a Schottky portion of the substrate is positioned between the channel and the source.
1. An integrated circuit comprising:
a substrate;
a source in electrical communication with the substrate;
a drain in electrical communication with the substrate;
a gate overlying the substrate between the source and the drain, wherein a channel is defined within the substrate directly underlying the gate, and wherein a Schottky portion of the substrate is positioned between the channel and the source;
a base well defined within the substrate, wherein the channel is defined within the base well; and
a ground contact electrically connected to the base well.
2. The integrated circuit of claim 1 wherein the Schottky portion of the substrate is from about 0.1 to about 0.5 microns.
3. The integrated circuit of claim 1 wherein the Schottky portion of the substrate is defined within the base well.
4. The integrated circuit of claim 1 further comprising:
a source contact in electrical communication with the source; and
a Schottky contact in electrical communication with the Schottky portion, wherein the source contact and the Schottky contact are in electrical communication.
5. The integrated circuit of claim 1 further comprising:
two spacers adjacent to the gate, wherein the gate and the two spacers directly overlie the channel.
6. The integrated circuit of claim 1 wherein:
the substrate comprises a planar surface, and the gate overlies the planar surface.
7. The integrated circuit of claim 1 further comprising:
a Schottky contact in electrical communication with the Schottky portion.
8. The integrated circuit of claim 1 wherein the source comprises N type conductivity determining impurities and the drain comprises N type conductivity determining impurities.
9. The integrated circuit of claim 1 further comprising:
a first pin electrically connected to the source;
a second pin electrically connected to the drain.
10. The integrated circuit of claim 9 wherein the first pin is selected from a power pin, a ground pin, and a signal pin.
11. The integrated circuit of claim 10 wherein the second pin is selected from the power pin, the ground pin, and the signal pin, and wherein the first pin and the second pin are different from each other.
12. An integrated circuit comprising:
a substrate;
a source in electrical communication with the substrate;
a drain in electrical communication with the substrate; a gate overlying the substrate between the source and the drain, wherein a channel is defined within the substrate directly underlying the gate, and wherein a Schottky portion of the substrate is positioned between the channel and the source;
wherein the source comprises N type conductivity determining impurities and the drain comprises N type conductivity determining impurities; and
a first pin; and a second pin, wherein the first pin and the second pin are electrically connected by an ESD transistor, wherein the ESD transistor comprises the source, the drain, and the gate.
13. The integrated circuit of claim 12 further comprising:
a base well defined within the substrate, wherein the channel is defined within the base well.
14. The integrated circuit of claim 13 further comprising a ground region in electrical communication with the base well.
15. The integrated circuit of claim 12 wherein the Schottky portion has a Schottky length of from about 0.1 to about 0.5 microns.
16. A method of producing an integrated circuit comprising:
forming a gate overlying a substrate, wherein a channel is defined within the substrate directly underlying the gate;
forming a source and a drain within the substrate on opposite sides of the gate, wherein a Schottky portion of the substrate is positioned between the gate and the source; and
forming a Schottky contact in electrical communication with the Schottky portion.
17. The integrated circuit of claim 16 further comprising:
forming a base well in the substrate, wherein the channel is defined within the base well.
18. The integrated circuit of claim 16 further comprising forming a source contact in electrical communication with the source, wherein the source contact and the Schottky contact are in electrical communication.
19. The integrated circuit of claim 17 further comprising forming a ground region within the substrate, wherein the ground region is in electrical communication with the base well.