Transfer-free method for forming graphene layer
The present invention relates to a transfer-free method for forming a graphene layer, in which a high-quality graphene layer having excellent crystallinity can be easily formed over a large area at low temperature by a transfer-free process so that it can be applied directly to a base substrate, which is used in a transparent electrode, a semiconductor device or the like, without requiring a separate transfer process, and to an electrical device comprising a graphene layer formed by the method. More specifically, the transfer-free method for forming a graphene layer comprises the steps of: depositing a Ti layer having a thickness of 3-20 m on a base substrate by sputtering; and growing graphene on the deposited Ti layer by chemical vapor deposition.
1. A method for manufacturing an electrical device, the method comprising the steps of:
(A) modifying a surface of a base substrate by sputtering titanium (Ti) on the surface to form a Ti layer on the surface, wherein the Ti layer has a thickness of 3-20 nm; and
(B) growing a graphene layer, by chemical vapor deposition, on the Ti layer formed on the surface,
wherein the electrical device comprises the base substrate, the Ti layer, and the graphene layer.
2. The method of claim 1 , wherein the base substrate is made of a material comprising glass, SiO 2 , a synthetic polymer containing an oxygen atom, or any combination thereof.
3. The method of claim 1 , wherein the step (B) comprises growing graphene by chemical vapor deposition under a condition in which a temperature of the substrate is 150° C. to 900° C.
4. The method of claim 3 , wherein the step (B) comprises growing graphene by chemical vapor deposition under a condition in which a temperature of the substrate is 150° C. to 400° C.
5. The method of claim 4 , wherein a working pressure in the step (B) is 10 mTorr or lower.
6. The method of claim 1 , further comprising, before growing the graphene layer, treating the Ti layer with hydrogen gas.
7. The method of claim 1 , wherein a reactive gas which is used in the chemical vapor deposition comprises a mixture of hydrogen gas and one or more carbon sources selected from the group consisting of methane, ethane, propane, acetylene, methanol, ethanol and propanol.