IP Library Granted Patent US 10,056,570
Granted Patent B2
US 10,056,570 · App. 15/273,518 · Granted Aug 21, 2018

Image pickup device and electronic apparatus

Inventor: Yohei Hirose (Tokyo, JP)
Assignee: Sony Semiconductor Solutions Corporation
H01L51/445H01L27/307H01L51/441H01L51/448H01L2251/301H01L2251/303Y02E10/549
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Quick Facts
Patent No.
US 10,056,570
App. No.
15/273,518
Granted
Aug 21, 2018
Kind
B2
Abstract

An image pickup device includes: a first electrode film; an organic photoelectric conversion film; a second electrode film; and a metal wiring film electrically connected to the second electrode film, the first electrode film, the organic photoelectric conversion film, and the second electrode film all provided on a substrate in this order, and the metal wiring film coating an entire side of the organic photoelectric conversion film.

Claims (26)

1. An image pickup device comprising:

a plurality of first electrode films formed on a substrate;

a continuous organic photoelectric conversion film configured to convert light into electrical charge, wherein the organic photoelectric conversion film is substantially parallel to the substrate and is formed above the plurality of first electrode films;

a continuous second electrode film substantially parallel to the substrate;

a photodiode disposed in the substrate;

a metal wiring film electrically connected to the second electrode film; and

a film coating at least one of a side surface of the organic photoelectric conversion film and a side surface of the second electrode film, wherein the plurality of first electrode films, the organic photoelectric conversion film, and the second electrode film are provided above the substrate in this order, and wherein a portion of the film is between a portion of the metal wiring film and a portion of the organic photoelectric conversion film.

2. The image pickup device according to claim 1 , wherein the metal wiring film is made of W, Al, Ti, Mo, Ta, Cu, an alloy containing one or more thereof, or a material containing one or more thereof and Si.

3. The image pickup device according to claim 1 , wherein the film is a silicon nitride film, a silicon nitrogen oxide film, an aluminum oxide film, or a stacked film containing two or more thereof.

4. The image pickup device according to claim 1 , wherein the film includes a first film and a second film, the first film coating an upper surface of the second electrode film, and the second film coating the organic photoelectric conversion film and the first film.

5. The image pickup device according to claim 1 , wherein the film has one or more openings positioned opposite the second electrode film, and the metal wiring film makes contact with the second electrode film via the one or more openings.

6. The image pickup device according to claim 1 , wherein the plurality of first electrode films correspond to a plurality of pixel electrodes provided in respective pixels, and the metal wiring film coats an entire side of the film.

7. An electronic apparatus comprising:

an image pickup device including:

a plurality of first electrode films formed on a substrate,

a continuous organic photoelectric conversion film configured to convert light into electrical charge, wherein the organic photoelectric conversion film is substantially parallel to the substrate and is formed above the plurality of first electrode films,

a continuous second electrode film substantially parallel to the substrate,

a photodiode disposed in the substrate,

a metal wiring film electrically connected to the second electrode film, and

a film coating at least one of a side surface of the organic photoelectric conversion film and a side surface of the second electrode film, wherein the plurality of first electrode films, the organic photoelectric conversion film, and the second electrode film are provided above the substrate in this order, and wherein a portion of the film is between a portion of the metal wiring film and a portion of the organic photoelectric conversion film; and

a lens configured to cause external light to enter the image pickup device.

8. The electronic apparatus according to claim 7 , wherein the metal wiring film is made of W, Al, Ti, Mo, Ta, Cu, an alloy containing one or more thereof, or a material containing one or more thereof and Si.

9. The electronic apparatus according to claim 7 , wherein the film is a silicon nitride film, a silicon nitrogen oxide film, an aluminum oxide film, or a stacked film containing two or more thereof.

10. The electronic apparatus according to claim 7 , wherein the film includes a first film and a second film, the first film coating an upper surface of the second electrode film, and the second film coating the organic photoelectric conversion film and the first film.

11. The electronic apparatus according to claim 7 , wherein the film has one or more openings positioned opposite the second electrode film, and the metal wiring film makes contact with the second electrode film via the one or more openings.

12. The image pickup device according to claim 7 , wherein the plurality of first electrode films correspond to a plurality of pixel electrodes provided in respective pixels, and the metal wiring film coats an entire side of the film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2017
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 043293/0649 →
Priority Claims (1)
JP 2013-138262 · Jul 1, 2013 · national
Continuity (3)
Continuation 14942715 · Nov 16, 2015
Continuation 14313488 · Jun 24, 2014
Related Publication 20170012229A1 · Jan 12, 2017
Cited By (1)
US 12,249,675