Light-emitting device, integrated light-emitting device, and light-emitting module
A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.
1. A light-emitting device comprising:
a base including a conductive wiring;
a light-emitting diode mounted on the base and configured to emit light;
a dielectric multilayer film that is located on and in direct contact with an upper surface of the light-emitting diode, but does not cover lateral surfaces of the light-emitting diode; and
an encapsulant covering the light-emitting diode and the dielectric multilayer film,
wherein a ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5
wherein the dielectric multilayer film is configured such that, in a graph showing a curve indicative of reflectance vs. wavelength for light emitted from the light-emitting diode that is perpendicularly incident on the dielectric multilayer film, said curve includes:
a first portion that extends from a first wavelength to a second wavelength greater than the first wavelength, wherein a trough in the curve is located at the second wavelength, and wherein the first portion of the curve includes a first peak at a maximum reflectance of the dielectric multilayer film,
a second portion that extends from the second wavelength to a third wavelength greater than the second wavelength, wherein the second portion of the curve includes a second peak lower than the first peak; and
wherein the light-emitting diode is configured such that an emission peak wavelength of the light-emitting diode is between the first wavelength and the second wavelength.
2. The light-emitting device according to claim 1 , wherein the encapsulant has an upper surface with a convex curved shape.
3. The light-emitting device according to claim 1 , wherein a light transmissivity of the dielectric multilayer film for the light emitted from the light-emitting diode has incident-angle dependence.
4. The light-emitting device according to claim 1 , wherein a light transmissivity of the dielectric multilayer film for the light emitted from the light-emitting diode increases as an absolute value of an incident angle of the light emitted from the light-emitting diode increases.
5. The light-emitting device according to claim 1 , wherein:
in the curve indicative of reflectance vs. wavelength for light perpendicularly incident on the dielectric multilayer film, a region on a longer wavelength side of the emission peak wavelength is wider than a region on a shorter wavelength side of the emission peak wavelength.
6. The light-emitting device according to claim 1 , wherein 30% or more of total light emitted from the light-emitting device is emitted in a direction at an elevation angle of less than 20° relative to an upper surface of the base.
7. The light-emitting device according to claim 1 , wherein 40% or more of total light emitted from the light-emitting device is emitted in a direction at an elevation angle of less than 20° relative to an upper surface of the base.
8. The light-emitting device according to claim 1 , wherein the ratio (H/W) of a height (H) of the encapsulant to a width (W) of the bottom surface of the encapsulant is 0.3 or less.
9. The light-emitting device according to claim 1 , wherein the light-emitting diode is mounted in a flip-chip manner.
10. An integrated light-emitting device comprising:
a plurality of the light-emitting devices according to claim 1 ,
wherein at least one light reflective member is disposed between adjacent ones of the light-emitting devices.
11. The integrated light-emitting device according to claim 10 , wherein the light reflective member has a height that is 0.3 times or less than a distance between the adjacent light-emitting devices.
12. The integrated light-emitting device according to claim 10 , wherein the light reflective member has a height 0.2 times or less a distance between the adjacent light-emitting devices.
13. A light-emitting module comprising:
the light-emitting device according to claim 1 ; and
a wavelength conversion member located at a light extraction surface side of the light-emitting device, the wave length conversion member being configured to absorb part of the light emitted from the light-emitting diode and to convert the absorbed light to light with a wavelength different from an emission wavelength of the light-emitting diode.
14. A light-emitting module comprising:
the integrated light-emitting device according claim 10 ; and
a wavelength conversion member located at a light extraction surface side of the integrated light-emitting device, the wavelength conversion member being configured to absorb part of light from the light-emitting diode and to convert absorbed light to light with a wavelength different from an emission wavelength of the light-emitting diode.
15. The light-emitting device according to claim 1 , wherein, the dielectric multilayer film has a light transmissivity of approximately 10% for light that is emitted from the light-emitting diode at an incident angle in a range of −30° to 30° relative to a direction perpendicular to the upper surface of the light emitting element.
16. The light-emitting device according to claim 15 , wherein the light transmissivity of the dielectric multilayer film for the light emitted from the light-emitting diode increases as an absolute value of the incident angle of the light emitted from the light-emitting diode increases.