Inspection apparatus and method using pattern matching
To provide means according to which template matching is performed successfully in an apparatus that performs inspection or measurement of a semiconductor pattern, which is formed on a wafer, even in a case in which a pattern for alignment, which is in design data, has been eliminated from an image in which an image of a practical pattern was captured using the apparatus, in which the brightness value contrast of a pattern is lower (more indistinct) than that of other locations, or in which a pattern is deformed and there is a discrepancy with the shape of a template (a pattern for alignment in the design data). An inspection apparatus according to the invention acquires a target retrieval image, and carries out template matching on the target retrieval image, and includes template input, means for inputting a plurality of templates, a plurality of matching candidate selection sections that select a matching candidate group by performing a matching process of the target retrieval image and the plurality of templates, a plurality of single template likelihood calculation process sections that calculate single template likelihoods for a plurality of matching candidate groups that are selected by the plurality of matching candidate selection sections, a multiple template assimilation likelihood calculation process section that calculates a multiple template assimilation likelihood for the matching candidate groups using a plurality of single template likelihoods that are calculated by the plurality of single template likelihood calculation process sections, and a highest assimilation likelihood matching candidate selection section that selects a matching candidate for which the multiple template assimilation on likelihood is the highest, from among the matching candidate groups, using the multiple template assimilation likelihoods that are calculated by the multiple template assimilation likelihood calculation process section.
1. An inspection apparatus that acquires a target retrieval image, and carries out template matching on the target retrieval image, the inspection apparatus comprising:
an image acquisition device that illuminates a wafer with an electron beam and captures the target retrieval image based on secondary electrons emitted from the wafer;
a user interface through which a user inputs a plurality of templates; and
an arithmetic processor programmed to
select a matching candidate group by performing a matching process of the target retrieval image and the plurality of templates;
calculate single template likelihoods for a plurality of selected matching candidate groups;
calculate a multiple template assimilation likelihood for the matching candidate groups using a plurality of the calculated single template likelihoods;
select a matching candidate for which the multiple template assimilation likelihood is either the highest or is a threshold value or greater, from among the matching candidate groups, using the calculated multiple template assimilation likelihoods; and
align a coordinate system of the wafer based on the selected matching candidate.
2. The inspection apparatus according to claim 1 ,
wherein the arithmetic processor outputs either a matching position or a highest assimilation likelihood.
3. The inspection apparatus according to claim 1 ,
wherein there are a plurality of target retrieval images.
4. The inspection apparatus according to claim 1 ,
wherein the single template likelihoods are calculated using a statistical quantity of a correlation value of a matching candidate within a matching candidate group.
5. An inspection method that acquires a target retrieval image in an inspection apparatus, and carries out template matching on the target retrieval image, the inspection method comprising:
illuminating a wafer with an electron beam and capturing the target retrieval image based on secondary electrons emitted from the wafer;
receiving a plurality of templates input by a user through a user interface;
selecting a matching candidate group by performing a matching process of the target retrieval image and the plurality of templates;
calculating single template likelihoods for a plurality of matching candidate groups that are selected;
calculating a multiple template assimilation likelihood for the matching candidate groups using a plurality of the calculated single template likelihoods; and
selecting a matching candidate for which the multiple template assimilation likelihood is either the highest or is a threshold value or greater, from among the matching candidate groups, using the calculated multiple template assimilation likelihoods; and
aligning a coordinate system of the wafer based on the selected matching candidate.
6. The inspection method according to claim 5 , further comprising:
outputting either a matching position or a highest assimilation likelihood.
7. The inspection method according to claim 5 , further comprising:
acquiring, by the image inspection apparatus, a plurality of the target retrieval images.
8. The inspection method according to claim 5 , further comprising:
calculating the single template likelihoods using a statistical quantity of a correlation value of a matching candidate within a matching candidate group.