Semiconductor wafer support ring for heat treatment

1. A support ring for supporting a semiconductor wafer in a boat of a vertical furnace used in processing of the semiconductor wafer, the support ring comprising:

a semicircular segment having an upper surface, a lower surface opposite the upper surface, a radial inner wall, and a radial outer wall;

slots in the upper surface of the semicircular segment; and

pins extending above the upper surface, each pin located partially within a corresponding slot of the slots,

wherein the pins are configured to support the semiconductor wafer such that the semiconductor wafer does not contact the upper surface of the semicircular segment,

wherein the pins are located along an arc having a radius that is equal to two thirds of a radius of the semiconductor wafer, the radial inner wall defining an inner radius and the outer radial wall defining an outer radius, and wherein the radius of the arc is greater than the inner radius and less than the outer radius,

wherein each slot defines an opening dimensioned larger than a corresponding pin such that the pins are movable horizontally relative to the semicircular segment within the slots.

2. The support ring of claim 1 , wherein the support ring is made of silicon carbide and the pins are made of quartz.

3. The support ring of claim 1 , in combination with a vertical furnace for annealing semiconductor wafers, the vertical furnace including a chamber, a heating element adjacent the chamber for heating the chamber and a wafer boat for holding the support ring and the semiconductor wafers within the chamber during annealing of the semiconductor wafer.