IP Library Granted Patent US 9,859,164
Granted Patent B1
US 9,859,164 · App. 15/294,792 · Granted Jan 2, 2018

Method for manufacturing fins

Inventors: Ming-Shiou Hsieh (Chiayi County, TW); Chun-Yao Yang (Kaohsiung, TW); Shi-You Liu (Kaohsiung, TW); Rong-Sin Lin (Taichung, TW); Han-Ting Yen (Yunlin County, TW); Neng-Hui Yang (Hsinchu, TW); Tsai-Yu Wen (Tainan, TW); Ching-I Li (Tainan, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L21/823431H01L21/02115H01L21/02271H01L21/265H01L21/324H01L21/823468H01L21/823481
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Quick Facts
Patent No.
US 9,859,164
App. No.
15/294,792
Granted
Jan 2, 2018
Kind
B1
Abstract

A method for manufacturing fins includes following steps. A substrate including a plurality of fins formed thereon is provided. At least an ion implantation is performed to the fins. A thermal process is performed after the ion implantation. An insulating layer is formed on the substrate, and the fins are embedded in the insulating layer. Thereafter, a portion of the insulating layer is removed to form an isolation structure on the substrate, and the fins are exposed from a top surface of the isolation structure. The insulating layer is formed after the ion implantation and the thermal process. Or, the isolation structure is formed before the ion implantation, or between the ion implantation and the thermal process.

Claims (23)

1. A method for manufacturing fins comprising:

providing a substrate comprising a plurality of fins formed thereon;

forming an insulating layer on the substrate, and the fins being embedded in the insulating layer;

performing at least an ion implantation to the fins;

removing a portion of the insulating layer to form an isolation structure on the substrate, and the fins being exposed from a top surface of the isolation structure;

performing a thermal process after forming the isolation structure; and

forming a protecting layer on the fins before forming the insulating layer, wherein a part of the protecting layer is formed on sidewalls of the fins.

2. The method for manufacturing the fins according to claim 1 , further comprising:

forming at least a mandrel pattern on the substrate;

forming a plurality of spacer patterns on sidewalls of the mandrel pattern on the substrate;

etching the substrate through the spacer pattern to form the fins; and

removing portions of the fins.

3. The method for manufacturing the fins according to claim 1 , wherein the protecting layer comprises an oxide multilayer.

4. The method for manufacturing the fins according to claim 1 , wherein the insulating layer is formed by a FCVD.

5. The method for manufacturing the fins according to claim 1 , wherein the ion implantation is performed after forming the isolation structure and before the thermal process.

6. The method for manufacturing the fins according to claim 1 , wherein the ion implantation is performed before forming the isolation structure.

7. The method for manufacturing the fins according to claim 6 , wherein the step of removing the portion of the insulating layer to form the isolation structure further comprises:

performing a planarization process such that a top surface of the insulating layer and top surfaces of the fins are coplanar; and

performing an etching back process to form the isolation structure and to expose the fins.

8. The method for manufacturing the fins according to claim 7 , wherein the ion implantation is performed after the planarization process and before the etching back process.

9. The method for manufacturing the fins according to claim 1 , further comprising performing a co-implant after the ion implantation and before the thermal process.

10. The method for manufacturing the fins according to claim 9 , wherein the co-implant comprises carbon.

11. The method for manufacturing the fins according to claim 10 , wherein a concentration of carbon in the co-implant is smaller than 1E14.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2016
From: HSIEH, MING-SHIOU; YANG, CHUN-YAO; LIU, SHI-YOU; LIN, RONG-SIN; YEN, HAN-TING; YANG, NENG-HUI; WEN, TSAI-YU; LI, CHING-I
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 040026/0216 →