Resistively heated shape memory polymer device
A resistively heated shape memory polymer device is made by providing a rod, sheet or substrate that includes a resistive medium. The rod, sheet or substrate is coated with a first shape memory polymer providing a coated intermediate unit. The coated intermediate unit is in turn coated with a conductive material providing a second intermediate unit. The second coated intermediate unit is in turn coated with an outer shape memory polymer. The rod, sheet or substrate is exposed and an electrical lead is attached to the rod, sheet or substrate. The conductive material is exposed and an electrical lead is attached to the conductive material.
1. An apparatus comprising:
a conductive substrate including a resistive medium;
a first shape memory polymer (SMP) coating the conductive substrate;
a first conductive material member coating the first SMP coated conductive substrate;
a second SMP coating the first conductive material member coated first SMP coated conductive substrate; and
first and second electrical leads;
wherein a portion of the conductive substrate is exposed and a portion of the first conductive material member is exposed;
wherein the first electrical lead is coupled to the exposed portion of the conductive substrate and the second electrical lead is coupled to the exposed portion of the first conductive material member;
wherein (a) the first SMP directly contacts the first conductive material member; (b) the conductive substrate directly contacts the first SMP, and (c) the first conductive material member directly contacts the second SMP.
2. The apparatus of claim 1 wherein the resistive medium includes a solid conductive material.
3. The apparatus of claim 1 wherein the resistive medium includes a composite that contains conductive particles.
4. The apparatus of claim 3 wherein the conductive particles include carbon black.
5. The apparatus of claim 3 wherein the conductive particles include carbon nanotubes.
6. The apparatus of claim 3 wherein the conductive particles include metallic fillers.
7. The apparatus of claim 1 wherein the conductive substrate includes conductive particles.
8. The apparatus of claim 1 wherein the second SMP coated first conductive material member coated first SMP coated conductive substrate is shaped as a basket.
9. The apparatus of claim 1 , wherein the conductive substrate includes a conductive sheet.
10. The apparatus of claim 1 , wherein the first SMP has a primary shape and a secondary shape and the first SMP transitions from the secondary shape to the primary shape when the first SMP is heated above its glass transition temperature.
11. An apparatus comprising:
a conductive substrate including a resistive medium;
a first shape memory polymer (SMP) coating the conductive substrate;
a conductive material coating the first SMP coated conductive substrate;
a second SMP coating the conductive material coated first SMP coated conductive substrate; and
first and second electrical leads;
wherein the second SMP coated conductive material coated first SMP coated conductive substrate is shaped as a basket;
wherein a portion of the conductive substrate is exposed and a portion of the conductive material is exposed;
wherein the first electrical lead is coupled to the exposed portion of the conductive substrate and the second electrical lead is coupled to the exposed portion of the conductive material.
12. The apparatus of claim 11 wherein the resistive medium is a solid conductive material.
13. The apparatus of claim 11 wherein the resistive medium is a composite that contains conductive particles.
14. The apparatus of claim 13 wherein the conductive particles include carbon black.
15. The apparatus of claim 13 wherein the conductive particles include carbon nanotubes.
16. The apparatus of claim 13 wherein the conductive particles include metallic fillers.
17. The apparatus of claim 11 wherein the conductive substrate includes conductive particles.
18. The apparatus of claim 11 , wherein the conductive substrate includes a conductive sheet.
19. The apparatus of claim 11 , wherein the conductive substrate directly contacts the first SMP and the conductive material directly contacts the second SMP.
20. The apparatus of claim 11 , wherein the first SMP directly contacts the conductive material.