IP Library › Granted Patent US 10,141,481
Granted Patent B2
US 10,141,481 · App. 15/301,543 · Granted Nov 27, 2018

Color-converting substrate of light-emitting diode and method for producing same

Inventors: Ki Yeon Lee (Chungcheongnam-do, KR); Jhee Mann Kim (Chungcheongnam-do, KR); Hyung Soo Moon (Chungcheongnam-do, KR); Yoon Seuk Oh (Chungcheongnam-do, KR); Choon Bong Yang (Chungcheongnam-do, KR)
Assignee: Corning Precision Materials Co., Ltd.
H01L33/50H01L25/0753H01L33/06H01L33/502H01L33/52H01L33/56H01L2924/0002H01L2933/005H01L2933/0041
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Quick Facts
Patent No.
US 10,141,481
App. No.
15/301,543
Granted
Nov 27, 2018
Kind
B2
Abstract

The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing same, the color-conversion substrate of a light-emitting diode comprising: a first substrate arranged on a light-emitting diode; a second substrate disposed facing the first substrate; a first sealing material disposed on the upper surface of the first substrate so as to section a grooved accommodating space having the first substrate as the bottom surface thereof; QDs filling the accommodating space; and a second sealing material, disposed between the second substrate and the first sealing material, having a shape corresponding to the first sealing material, wherein the second sealing material is made of material having a comparatively higher laser absorption rate in the infrared region than that of the first sealing material.

Claims (13)

1. A color conversion substrate for a light-emitting diode comprising:

a first substrate disposed over the light-emitting diode;

a second substrate facing the first substrate;

a first sealant disposed on a top surface of the first substrate, the first sealant defining a recess-shaped accommodation space having the top surface of the first substrate as a bottom surface thereof;

a quantum dot accommodated in the accommodation space; and

a second sealant disposed between the second substrate and the first sealant, wherein a shape of the second sealant is substantially similar to a shape of the first sealant,

wherein the second sealant contacts the first sealant, and

wherein the second sealant comprises a material having a greater ability to absorb infrared laser light than that of the first sealant.

2. The color conversion substrate according to claim 1 , wherein each of the first substrate and the second substrate comprises a glass substrate, and each of the first sealant and the second sealant comprises a glass frit.

3. The color conversion substrate according to claim 2 , wherein a softening point of the glass frit of the first sealant is lower than a softening point of the first substrate.

4. The color conversion substrate according to claim 3 , wherein a softening point of the glass frit of the second sealant is lower than a softening point of the glass frit of the first sealant.

5. The color conversion substrate according to claim 1 , wherein a composition of the second sealant comprises, by weight, 2 to 10% of a black pigment.

6. The color conversion substrate according to claim 1 , wherein a height of the first sealant formed on the top surface of the first substrate ranges from 300 to 500 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2016
From: LEE, KI YEON; KIM, JHEE MANN; MOON, HYUNG SOO; OH, YOON SEUK; YANG, CHOON BONG
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 039951/0150 →
Priority Claims (1)
KR 10-2014-0040300 · Apr 4, 2014 · national
Continuity (1)
Related Publication 20170040511A1 · Feb 9, 2017