IP Library › Granted Patent US 10,544,341
Granted Patent B2
US 10,544,341 · App. 15/307,763 · Granted Jan 28, 2020

Thermally conductive polymer composition and thermally conductive molded object

Inventors: Kenichi Fujikawa (Osaka, JP); Yoshiharu Hatakeyama (Osaka, JP); Miho Yamaguchi (Osaka, JP); Yuji Yamagishi (Fukui, JP); Akihiro Oohashi (Fukui, JP)
Assignees: NITTO DENKO CORPORATION; NITTO SHINKO CORPORATION
C09K5/14C08K3/22C08K3/28C08K2003/2227C08K2003/282C08K2201/001
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Quick Facts
Patent No.
US 10,544,341
App. No.
15/307,763
Granted
Jan 28, 2020
Kind
B2
Abstract

The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.

Claims (14)

1. A thermal conductive molded article comprising a thermal conductive polymer composition comprising:

thermal conductive inorganic particles; and an electrically insulating polymer,

wherein the thermal conductive inorganic particles comprise a first component containing boron nitride particles in an aggregated state and a second component which is a component other than the first component,

the second component includes aluminum nitride particles or aluminum oxide particles,

a content of the second component in the thermal conductive inorganic particles is from 5 to 55 vol %,

the thermal conductive inorganic particles of the second component have a volume average particle diameter of 15 μm or more, and

the thermal conductive inorganic particles satisfy all requirements of the following (1) to (3):

(1) to contain particles having a particle diameter of 10 μm to 400 μm in an amount of 80 vol % or more,

(2) to contain particles having a particle diameter of 20 μm to 400 μm in an amount of 60 vol % or more, and

(3) to contain particles having a particle diameter of 30 μm to 400 μm in an amount of 40 vol % or more

wherein a part or the whole of the thermal conductive molded article is formed of the thermal conductive polymer composition, and

a porosity of the part or the whole formed of the thermal conductive polymer composition is 3% or less.

2. The thermal conductive molded article according to claim 1 , wherein a thermosetting resin is contained as the electrically insulating polymer.

3. The thermal conductive molded article according to claim 1 , which is a thermal conductive sheet obtained by molding the thermal conductive polymer composition into a sheet shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2016
From: FUJIKAWA, KENICHI; HATAKEYAMA, YOSHIHARU; YAMAGUCHI, MIHO; YAMAGISHI, YUJI; OOHASHI, AKIHIRO
To: NITTO DENKO CORPORATION; NITTO SHINKO CORPORATION
Reel/Frame 040163/0586 →
Priority Claims (1)
JP 2014-093649 · Apr 30, 2014 · national
Continuity (1)
Related Publication 20170081579A1 · Mar 23, 2017