System and fabrication method of piezoelectric stack that reduces driving voltage and clamping effect
A system and method provides a piezoelectric stack arrangement for reduced driving voltage while maintaining a driving level for active piezoelectric materials. A stack arrangement of d 36 shear mode <011>single crystals of both air X-cut and Y-cut ±1:45° (±20°) arrangement are bonded with discrete conductive pillars to form a shear crystal stack. The bonding area between the neighboring crystal parts is minimized. The bonding pillars are positioned at less than a total surface are of the single crystal forming the stack. The stack fabrication is facilitated with a precision assembly system, where crystal parts are placed to desired locations on an assembly fixture for alignment following the preset operation steps. With the reduced clamping effect from bonding due to lower surface coverage of the discrete conductive pillars, such a piezoelectric d 36 shear crystal stack exhibits a reduced driving voltage while maintaining a driving level and substantial and surprisingly improved performance.
1. A piezoelectric system, comprising:
at least a first PMN-PT d 36 structured crystal element, having a crystal composition represented by the formula:
x*ABO 3 −y*PbTiO 3 −(1-x-y)*Pb(Mg 1/3 Nb 2/3 )O 3
wherein, x is defined as molar % 0 to 0.50;
y is defined as molar % 0 to 0.50;
A represents Lead (Pb) or Bismuth (Bi), and
B is represented by the one or more dopant clients selected from:
Zr
Hf
Sn
In
Sc
Tm
Nb
Ta
Zn
Yb
La
Sb
Bi
Ma
Ga
Ce
Ni
W
Cu
Fe
K
Na
Li
Ba
said at least first crystal element having a cutting direction of one of a X-cut arrangement wherein said X-cut arrangement is a zxt+45° (±20°) cut arrangement and a Y-cut arrangement, wherein said Y-cut arrangement is a zxt-45°(±20°) cut arrangement;
said at least first crystal element prepared by poling along a <011> pseudo-cubic axis of said crystal element and having a poled-bead side and a poled-tail side of said at least first crystal element.
2. The piezoelectric system, according to claim 1 , further comprising:
a conductive electrode coating on a pair of Z surfaces of said at least first crystal element on said poled-head side and said poled-tail side; and
at least one conductive lead on said first crystal element.
3. The piezoelectric system, according to claim 2 , further comprising:
at least a second said crystal element in a stack arrangement with said at least first crystal element;
said second crystal clement being the other of said one of said X-cut and said Y-cut arrangement;
at least a second respective conductive lead on said at least second crystal element;
a plurality of discrete conductive adhesive pillars bonding respective opposing sides said crystal elements together and providing a conductive connection between opposed said conductive electrode coating; and
said conductive lead bonded between respective first and second crystal elements.
4. The piezoelectric system, according to claim 3 , wherein:
a combined total surface area coverage of said discrete conductive adhesive pillars is less than 80% of a surface area of a respective said side of said crystal elements.
5. The piezoelectric system, according to claim 4 , wherein:
said combined total surface area coverage of said discrete conductive adhesive pillars is less than 40% of said surface area of a respective said side of said crystal elements.
6. The piezoelectric system, according to claim 5 , wherein:
said combined total surface area coverage of said discrete conductive adhesive pillars is less than 20% of said surface area of a respective said side of said crystal elements.
7. The piezoelectric system, according to claim 4 , further comprising:
a rigid conductive shim spacing first and second crystal elements in said stack; and
said conductive shim conductively bonded to opposed conductive electrode coatings of said first and second crystal elements.
8. The piezoelectric system, according to claim 3 , wherein:
said stack arrangement further comprises at least crystal elements;
said crystal elements in said stack arrangement being selected in an alternating X-cut then Y-cut arrangement;
each said crystal element in said stack arrangement having a respective conductive lead; and
each said crystal element being bonded in said stack by said discrete conductive adhesive pillars.
9. The piezoelectric system, according to claim 3 , wherein:
said stack arrangement further comprises at least eight crystal elements;
said crystal elements in said stack arrangement being selected in an alternating X-cut then Y-cut arrangement;
each said crystal clement in said stack arrangement leaving a respective conductive lead; and
each said crystal element being bonded in said stack by said discrete conductive adhesive pillars.
10. The piezoelectric system, according to claim 8 , wherein:
each respective pair of said crystal elements in said stack arrangement being arranged in a poled-head side to poled-tail side orientation.
11. The piezoelectric system,according to claim 8 , wherein:
each respective pair of said crystal elements in said stack arrangement being arranged in an alternating poled-head side to poled-tail side pair orientation and poled-tail side to poled-head side pair orientation.
12. The piezoelectric system, according to claim 9 , wherein:
each respective pair of said crystal elements in said stack arrangement being arranged in a poled-head side to poled-tail side orientation.
13. The piezoelectric system, according to claim 9 , wherein:
each respective pair of said crystal elements in said stack arrangement being arranged in an alternating poled-head side to poled-tail side pair orientation and poled-tail side to poled-head side pair orientation.
14. The piezoelectric system, according to claim 3 , further comprising;
conductive connectors conductively joining respective said conductive leads of said respective at least first crystal element and said at least second crystal element;
a driving circuit operative for driving said piezoelectric system; and
said conductive connectors operatively connecting respective said crystal elements to said driving circuit.
15. The piezoelectric system, according to claim 10 , further comprising:
conductive connectors conductively joining respective said conductive leads of said respective at least alternating X-cut then Y-cut crystal elements;
a driving circuit operative for driving said piezoelectric system; and
said conductive connectors operatively connecting respective said crystal elements to said driving circuit.
16. The piezoelectric system, according to claim 11 , further comprising:
conductive connectors conductively joining respective said conductive leads of said respective at least alternating X-cut then Y-cut crystal elements;
a driving circuit operative for driving said piezoelectric system; and
said conductive connectors operatively connecting respective said crystal elements to said driving circuit.
17. The piezoelectric system, according to claim 12 , further comprising:
conductive connectors conductively joining respective said conductive leads of said respective at least alternating X-cut then Y-cut crystal elements;
a driving circuit operative for driving said piezoelectric system; and
said conductive connectors operatively connecting respective said crystal elements to said driving circuit.
18. The piezoelectric system, according to claim 13 , further comprising:
conductive connectors conductively joining respective said conductive leads of said respective at least alternating X-cut then Y-cut crystal elements;
a driving circuit operative for driving said piezociectric system; and said conductive connectors operatively connecting respective said crystal elements to said driving circuit.
19. A transducer system, comprising:
a head piece and a tail piece movable relative to each other;
at least two opposed crystal element stack arrangements spacing said head piece from said tail piece in a first orientation;
at least two opposed crystal element stack arrangement spacing said head piece from said tail piece in a second orientation;
said first orientation and said second orientation being perpendicular to each other and operative to secure said tail piece to said head piece during a use of said transducer; and
each said stack arrangement constructed as said stack arrangement in the piezoelectric system according to claim 3 .
20. A process for the preparation of a piezoelectric system, comprising the steps of:
mechanically at least a first PMN-PT d 36 structured crystal element, having a crystal composition represented by the formula:
x*ABO 3 −y*PbTiO 3 −(1-x-y)*Pb(Mg 1/3 Nb 2/3 )O 3
wherein, x is defined as molar % 0 to 0.50;
y is defined as molar % 0 to 0.50;
A represents Lead (Pb) or Bismuth (Bi), and
B is represented by the one or more dopant elements selected from:
Zr
Hf
Sn
In
Sc
Tm
Nb
Ta
Zn
Yb
Lu
Sb
Bi
Ma
Ga
Ce
Ni
W
Cu
Fe
K
Na
Li
Ba
cutting, said at least first crystal element having in a cutting direction of one of a X-cut arrangement wherein said X-cut arrangement is a zxt+45° (±20°) cut arrangement and a Y-cut arrangement, wherein said Y-cut arrangement is a zxt−45°(±20°) cut arrangement;
coating a conductive electrode coating on a pair of Z surfaces of said at least first crystal element;
preparing said at least first crystal element by poling along a <011> pseudo-cubic axis of said crystal element under up to 1500V/mm and defining a poled-head side and a poled-tail side of said at least first crystal element;
applying a plurality of discrete conductive adhesive pillars to less than a total surface are of said crystal element; and
applying a conductive lead on said first crystal element.
21. The process for the preparation of a piezoelectric system, according to claim 20 , further comprising the steps of:
preparing at least a second crystal clement as said first crystal element;
selecting, said second crystal element to be the other said cutting direction of said first crystal element creating an X-cut and Y-cut pattern;
positioning said second crystal element on said first crystal element forming a stack arrangement therewith;
said step of positioning including a step of orienting said second crystal element relative to said first crystal element in one of a poled-head side to poled-tail side or poled head-side to poled head-side according to a desired driving level of said stack arrangement; and
joining said first crystal element to said second crystal element by bonding said crystal elements with said discrete conductive adhesive pillars.
22. The process for the preparation of a piezoelectric system, according to claim 21 , further comprising the steps of:
preparing at least a third and a fourth crystal element as said first crystal element;
selecting said third and fourth crystal elements to be the other said cutting direction of said first crystal element and said second crystal element creating an X-cut to Y-cut pattern;
positioning said first to fourth crystal elements together forming said stack arrangement therewith;
said step of positioning including a step of orienting respective ones of said crystal element relative to adjacent crystal element in one of a poled-head side to poled-tail side or poled head-side to poled head-side according to a desired driving level of said stack arrangement; and
joining each respective said elements together by bonding said crystal elements with said discrete conductive adhesive pillars.
23. The process for preparation of a piezoelectric system, according to claim 22 , further comprising the steps of:
providing an assembly fixture operative to secure said stack arrangement during said step of joining; and
positioning each respective said crystal element in said assembly prior to said step of joining, whereby each assembly fixture maintains an respective alignment of said crystal elements during said step of joining.