Composition for heat-dissipation member, heat-dissipation member, and electronic device

1. A composition for a heat-dissipation member, comprising:

a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group;

a curing agent that cures the polymerizable liquid crystal compound; and

an inorganic filler formed of nitride;

wherein curing temperature is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase, and

the curing agent is at least one kind of diamine compound represented by formula (3-1) described below:

H 2 N—Z-(A-Z) m2 —NH 2   (3-1)

wherein, in formula (3-1) described above,

A is 1,4-cyclohexylene or 1,4-phenylene, and arbitrary hydrogen in the rings may be replaced by halogen or alkyl having 1 to 10 carbons;

Z each is a single bond or alkylene having 1 to 10 carbons; and

m2 is an integer from 1 to 7.

2. The composition for the heat-dissipation member according to claim 1 , wherein the polymerizable liquid crystal compound is at least one kind of compound represented by formula (1-1) described below:

R a1 —Z-(A-Z) m1 —R a1   (1-1)

wherein, in formula (1-1) described above,

R a1 each is a polymerizable group represented by any one of formulas (2-1) to (2-2) described below;

A is 1,4-cyclohexylene, 1,4-cyclohexenylene, 1,4-phenylene, naphthalene-2,6-diyl, tetrahydronaphthalene-2,6-diyl, fluorene-2,7-diyl, bicyclo[2.2.2]oct-1,4-diyl or bicyclo[3.1.0]hex-3,6-diyl, and

in the rings, arbitrary —CH 2 — may be replaced by —O—, arbitrary —CH═ may be replaced by —N═, and arbitrary hydrogen may be replaced by halogen, alkyl having 1 to 10 carbons or alkyl halide having 1 to 10 carbons, and

in the alkyl, arbitrary —CH 2 — may be replaced by —O—, —CO—, —COO— or —OCO—, and arbitrary —CH 2 CH 2 — may be replaced by —CH═CH— or —C≡C—;

Z each is a single bond or alkylene having 1 to 20 carbons, and

in the alkylene, arbitrary —CH 2 — may be replaced by —O—, —S—, —CO—, —COO— or —OCO—, arbitrary —CH 2 CH 2 — may be replaced by —CH—CH—, —CF—CF—, —CH═N—, —N═CH—, —N═N—, —N(O)═N— or —C≡C—, and arbitrary hydrogen may be replaced by halogen; and

m1 is an integer from 1 to 6:

wherein, in formulas (2-1) to (2-2), R b is hydrogen, halogen, —CF 3 or alkyl having 1 to 5 carbons, and q is 0 or 1.

3. The composition for the heat-dissipation member according to claim 2 , wherein, in formula (1-1) described above, A is 1,4-cyclohexylene, 1,4-cyclohexylene in which arbitrary hydrogen is replaced by halogen, 1,4-phenylene, 1,4-phenylene in which arbitrary hydrogen is replaced by halogen or a methyl group, fluorene-2,7-diyl, or fluorene-2,7-diyl in which arbitrary hydrogen is replaced by halogen or a methyl group.

4. The composition for the heat-dissipation member according to claim 3 , wherein, in formula (1-1), Z is a single bond, —(CH 2 ) a —, —O(CH 2 ) a —, —(CH 2 ) a O—, —O(CH 2 ) a O—, —CH═CH—, —C≡C—, —COO—, —OCO—, —CH═CH—COO—, —OCO—CH═CH—, —CH 2 CH 2 —COO—, —OCO—CH 2 CH 2 —, —CH═N—, —N═CH—, —N═N—, —OCF 2 — or —CF 2 O—, and a is an integer from 1 to 20.

5. The composition for the heat-dissipation member according to claim 1 , wherein the inorganic filler is at least one selected from boron nitride, aluminum nitride and silicon nitride.

6. The composition for the heat-dissipation member according to claim 1 , wherein the inorganic filler is a filler subjected to treatment with a coupling agent, or a filler subjected to coupling treatment and then surface modification with the polymerizable liquid crystal compound.

7. A heat-dissipation member, obtained by curing the composition for the heat-dissipation member according to claim 1 after applying alignment treatment thereto, and containing 20 to 95% by weight of the inorganic filler.

8. Electronic equipment, comprising:

the heat-dissipation member according to claim 7 ; and

an electronic device having a heating unit;

wherein the heat-dissipation member is arranged in the electronic device in such a manner that the heat-dissipation member is brought into contact with the heating unit.