Hydrogen-releasing film
The objective of the present invention is to provide a hydrogen-releasing film, a composite hydrogen-releasing film and a hydrogen-releasing laminated film that are not prone to embrittlement in the usage environmental temperatures of electrochemical elements. The hydrogen-releasing film containing an alloy, wherein the alloy is a Pd—Au alloy, and the Au content in the Pd—Au alloy is 15 mol % or more.
1. A hydrogen-releasing film containing an alloy, wherein the alloy is a Pd—Au alloy consisting of Pd and Au, and the Au content in the Pd—Au alloy is 30 to 55 mol %.
2. The hydrogen-releasing film according to claim 1 , wherein the film thickness t and the film area s satisfy the following expression 1:
t/s< 41.1 m −1 <Expression 1>
3. A composite hydrogen-releasing film, comprising the hydrogen-releasing film according to claim 1 on one surface or both surfaces of a metal layer.
4. A hydrogen-releasing laminated film, comprising a support on one surface or both surfaces of the hydrogen-releasing film according to claim 1 .
5. The hydrogen-releasing laminated film according to claim 4 , wherein the support is a porous body having an average pore diameter of 100 μm or less.
6. The hydrogen-releasing laminated film according to claim 4 , wherein a raw material of the support is at least one kind selected from the group consisting of polytetrafluoroethylene, polysulfone, polyimide, polyamide-imide, and aramid.
7. A safety valve for an electrochemical element, wherein the valve is provided with the hydrogen-releasing film according to claim 1 .
8. An electrochemical element, wherein the element is provided with the safety valve according to claim 7 .
9. The electrochemical element according to claim 8 , wherein the electrochemical element is an aluminum electrolytic capacitor or a lithium ion battery.
10. A hydrogen-releasing method comprising using the hydrogen-releasing film according to claim 1 .
11. The hydrogen-releasing method according to claim 10 , wherein hydrogen is released in an environment of 150° C. or less.