Heat radiation adhesive, heat radiation sheet using same, and electronic device having same

1. An electronic apparatus comprising:

a bracket;

a display panel mounted on the bracket;

a flexible printed circuit board (FPCB) on which AP (Application Processor) IC and PM (Power Management) IC are mounted;

a removable back cover;

an inner cover for covering the bracket and the FPCB, in which the inner cover is positioned between the FPCB and the back cover;

a case provided with a universal subscriber identity module (USIM) chip and a micro memory that are provided in the inner cover; and

a heat-radiating sheet mounted on at least one of an area of a cushion layer opposite to the bracket, an area between the FPCB and the inner cover, an area of the case in which the USIM chip and the micro memory are mounted, and an area of the back cover, to thereby spread and radiate the heat generated from the heat-generating component,

wherein the heat-radiating sheet comprising: a first heat-radiating adhesive member; and a heat-radiating layer that is adhered onto the heat-radiating adhesive member, and spreads and radiates the heat generated from the heat-generating component of the electronic apparatus, and

wherein the first heat-radiating adhesive member comprising: an adhesive layer formed of a web state adhesive sheet having a plurality of pores, wherein the web state adhesive sheet is formed of thermally adhered and accumulated fibers; first thermally conductive fillers having a plate-shape and dispersed inside the adhesive layer in a horizontal direction thereof, wherein the first thermally conductive fillers are arranged in a plurality of layers spaced apart from each other, the horizontal direction being a direction perpendicular to a thickness of the adhesive layer; and second thermally conductive fillers having a spherical shape and dispersed inside the adhesive layer, wherein the second thermally conductive fillers are disposed between neighboring layers of the first thermally conductive fillers in such a way that heat generated from a heat-generating component of an electronic apparatus is transferred to the first thermally conductive fillers via the second thermally conductive filler and spread in the horizontal direction of the adhesive layer.

2. The electronic apparatus according to claim 1 , wherein the first thermally conductive fillers are made of at least one of GNF (Graphite Nano Fiber), CNT (Carbon Nano Fiber), metal fiber, AlN, and BN.

3. The electronic apparatus according to claim 1 , wherein the second thermally conductive fillers are made of at least one of MgO, Al 2 O 3 , SiC, and diamond.

4. The electronic apparatus according to claim 1 , wherein the first thermally conductive fillers have the plate-shape having an aspect ratio of 1:100.

5. The electronic apparatus according to claim 1 , wherein the first and second thermally conductive fillers are 5 wt % 15 wt % of the adhesive layer.

6. The electronic apparatus according to claim 1 , wherein the web state adhesive sheet is made of one of an acrylic-based, epoxy-based, aramid-based, urethane-based, polyamide-based, polyethylene-based, EVA-based, polyester-based, and PVC-based material.

7. The electronic apparatus according to claim 1 , wherein the heat-radiating sheet further comprises: a color cover layer having diverse colors, the color cover layer being laminated on the heat-radiating adhesive member.

8. The electronic apparatus according to claim 7 , wherein the heat-radiating sheet further comprises: a second heat-radiating adhesive member that is interposed between the heat-radiating layer and the color cover layer.

9. The electronic apparatus according to claim 1 , wherein the heat-radiating layer is adhered on one surface of the heat-radiating adhesive member, and further comprises: a tape base material on the other surface of the heat-radiating adhesive member.