Crystalline semiconductor film, plate-like body and semiconductor device
A semiconductor film, a sheet like object, and a semiconductor device are provided that have inhibited semiconductor properties, particularly leakage current, and excellent withstand voltage and heat dissipation. A crystalline semiconductor film or a sheet like object includes a corundum structured oxide semiconductor as a major component, wherein the film has a film thickness of 1 μm or more. Particularly, the semiconductor film or the object includes a semiconductor component of oxide of one or more selected from gallium, indium, and aluminum as a major component. A semiconductor device has a semiconductor structure including the semiconductor film or the object.
1. A semiconductor device, comprising:
a crystalline semiconductor film comprising a corundum structured oxide semiconductor with gallium and/or indium as a major component,
the crystalline semiconductor film with 1 μm or more in thickness,
a first electrode arranged on a front side of the crystalline semiconductor film, and
a second electrode arranged on a rear side of the crystalline semiconductor film.
2. The semiconductor device of claim 1 , wherein the thickness of the crystalline semiconductor film is 7.6 μm or more.
3. The semiconductor device of claim 1 , wherein
the corundum structured oxide semiconductor further comprises a metal selected from among Al, Fe, Cr, V, Ti, Rh, Ni and Co.
4. The semiconductor device of claim 1 , wherein the semiconductor device is a vertical device.
5. The semiconductor device of claim 1 , wherein the semiconductor device is a power device.
6. The semiconductor device of claim 1 , wherein the semiconductor device is a Schottky barrier diode (SBD), a metal semiconductor field effect transistor (MESFET), a high electron mobility transistor (HEMT), a metal oxide semiconductor field effect transistor (MOSFET), a static induction transistor (SIT), a junction field effect transistor (JFET), an insulated gate bipolar transistor (IGBT), or a light emitting diode (LED).
7. The semiconductor device of claim 1 , wherein the crystalline semiconductor film further comprises a halogen.
8. The semiconductor device of claim 1 , wherein the crystalline semiconductor film comprises an n-type dopant selected from among tin, germanium, silicon, titanium, zirconium, vanadium, niobium, and a compound thereof.
9. A semiconductor device, comprising:
a multilayer film comprising a first crystalline semiconductor film comprising a corundum structured oxide semiconductor of gallium and/or indium as a major component;
the multilayer film comprising a second crystalline semiconductor film comprising a corundum structured oxide semiconductor of gallium and/or indium as a major component,
a first electrode arranged on the first crystalline semiconductor film; and
a second electrode arranged on the second crystalline semiconductor film,
the first crystalline semiconductor film arranged on the second crystalline semiconductor film being an n − -type semiconductor film, and
the second crystalline semiconductor film being an n + -type semiconductor film.
10. The semiconductor device of claim 9 , wherein the first crystalline semiconductor film and/or the second crystalline semiconductor film comprises an n-type dopant that is selected from among tin, germanium, silicon, titanium, zirconium, vanadium, and niobium.
11. The semiconductor device of claim 9 , wherein
the first crystalline semiconductor film comprises an n-type dopant comprising germanium, silicon, titanium, zirconium, vanadium, or niobium, and
the n-type dopant with a dopant concentration that is from 1×10 13 to 5×10 17 /cm 3 .
12. The semiconductor device of claim 9 , wherein
the second crystalline semiconductor film comprises an n-type dopant comprising germanium, silicon, titanium, zirconium, vanadium, or niobium, and
the n-type dopant with a dopant concentration that is from 1×10 20 /cm 3 to 1×10 23 /cm 3 .
13. The semiconductor device of claim 9 , wherein the first crystalline semiconductor film that is the n − -type semiconductor film with 1 μm or more in thickness.
14. The semiconductor device of claim 9 , wherein the corundum structured oxide semiconductor comprised in the first crystalline semiconductor film further comprises a metal selected from among Al, Fe, Cr, V, Ti, Rh, Ni and Co.
15. The semiconductor device of claim 9 , wherein the second crystalline semiconductor film is the n + -type semiconductor film with 1 μm or more in thickness.
16. The semiconductor device of claim 9 , wherein the corundum structured oxide semiconductor comprised in the second crystalline semiconductor film further comprises a metal selected from among Al, Fe, Cr, V, Ti, Rh, Ni and Co.
17. The semiconductor device of claim 9 , wherein the first crystalline semiconductor film and/or the second crystalline semiconductor film further comprises a halogen.
18. The semiconductor device of claim 9 , wherein the corundum structured oxide semiconductor of the first crystalline semiconductor film comprising gallium and/or indium as the major component accounts for 50% or more at atomic ratio of entire components contained in the crystalline semiconductor film.
19. The semiconductor device of claim 9 , wherein the multilayer film is 10 μm or more in thickness.
20. The semiconductor device of claim 9 , wherein the semiconductor device is a power device.
21. The semiconductor device of claim 9 , wherein the first electrode is a Schottky electrode, and the second electrode is an ohmic electrode.