Method and system for forming perforations
The embodiments disclosed herein relate to methods, systems, and system components for creating and arranging small (micron and smaller) defects or perforations in transparent materials in a particular manner, and, more particularly, to the arrangement of these defects, each of which has an average crack length, in a predetermined spaced-apart relation (each defect separated from an adjacent defect by a predetermined distance) defining a contour in a transparent material to lower the relative interface fracture toughness for subsequent planned induced separation.
1. A system for forming a plurality of defects defining a contour in a workpiece, said workpiece comprising a glass substrate comprising at least one layer and having a normalized pre-defect formation fracture toughness rating of 1.0, the system comprising:
a laser assembly configured to provide a plurality of laser pulse emissions, each laser pulse emission of the plurality of laser pulse emissions having predetermined characteristics selected from the group consisting of wavelength, power level, pulse duration, and a laser pulse emission rate;
an optical assembly coupled to the laser assembly, the optical assembly being configured and moveable to focus each laser pulse emission to a different focal line at a different position within said workpiece, wherein:
each said different focal line is separated from an adjacent different focal line by a predetermined distance,
a corresponding defect with an average crack length is formed in said workpiece along each different focal line to form a plurality of defects defining a contour in said workpiece, and
each of said defects being substantially generated by induced absorption;
a workpiece holder configured to hold said workpiece at a position relative to the optical assembly, said workpiece holder or the optical assembly being configured to provide a relative motion between said workpiece and the optical assembly; and
a controller coupled to the laser assembly, the optical assembly or said workpiece holder, the controller being configured to execute instructions for a predetermined design, including selecting the predetermined characteristics of the laser assembly, the different positions of the focal lines, or the relative motion between said workpiece and the optical assembly, and wherein the controller is configured to execute instructions based on programmable inputs including the predetermined distances between defects, size of the defects including stress field and crack length, and the average crack lengths for the defects such that a ratio of an average of the predetermined distances between the defects to an average of the averaged crack lengths results in said workpiece having a post-defect formation fracture toughness rating along the contour of less than the normalized pre-defect formation fracture toughness rating.
2. The system of claim 1 , wherein said ratio of an average of the predetermined distances to an average of the averaged crack lengths results in said workpiece having a post-defect formation fracture toughness rating along the contour of substantially in a range between about 0.2 and 0.8 relative to the normalized pre-defect formation fracture toughness rating.
3. The system of claim 1 , wherein said ratio of an average of the predetermined distances to an average of the averaged crack lengths results in said workpiece having a post-defect formation fracture toughness rating along the contour of substantially in a range between about 0.4 and 0.6 relative to the normalized pre-defect formation fracture toughness rating.
4. The system of claim 1 , wherein said ratio is less than or equal to 12.
5. The system of claim 1 , wherein said ratio is between 2 and 8.
6. The system of claim 1 , wherein said ratio is substantially in a range between about:
6 and 8 wherein when said glass substrate is a low strength glass substrate;
4 and 6 wherein when said glass substrate is an intermediate strength substrate; and
2.5 and 4 wherein when said glass substrate is a high strength glass substrate.
7. The system of claim 1 , wherein said ratio is about:
7 wherein when said glass substrate is a low strength glass substrate;
5 wherein when said glass substrate is an intermediate strength substrate; and
3.5 wherein when said glass substrate is a high strength glass substrate.
8. The system according to claim 1 , wherein the average of the predetermined distances is substantially in a range between about 2 and 350 microns, and an average of the averaged crack lengths is substantially in a range between about 1 and 40 microns.
9. The system according to claim 1 , wherein said optical assembly further comprises a reflective coating configured to block a portion of each laser pulse emission such that each of said different positions is disposed only in a compressive stress layer of said workpiece.
10. The system according to claim 1 , wherein each laser pulse emission of the plurality of laser pulse emissions has a pulse duration substantially within a range between about 1 picosecond and about 100 picoseconds.
11. The system of claim 10 , wherein the pulse duration is substantially within a range between about 5 picoseconds and about 20 picoseconds.
12. The system according claim 1 , wherein the wavelength is selected such that at least a portion of said workpiece is substantially transparent to the laser pulse emission.
13. The system according to claim 1 , wherein each defect of the plurality of defects is implemented with a predetermined defect modality wherein the predetermined defect modality is selected from a group of modalities consisting of a crack, a perforation or a channel within said workpiece.
14. The system according to claim 1 , wherein said workpiece is further comprised of a material selected from a group of materials consisting of glass, plastic, polymer, rubber, semiconductor, softboard material, ceramic, metallic materials, piezoelectric materials, gaseous materials, liquid crystal materials, indium tin oxide material or electrochromic glass.
15. The system according to claim 1 , further comprising a separation mechanism configured to divide said workpiece into workpiece subcomponents along the contour in accordance with the plurality of defects to implement the predetermined design.
16. The system of claim 15 , wherein the separation mechanism is selected from the group consisting of an external force applying mechanism and a scoring mechanism.
17. The system of claim 1 , wherein said ratio is less than or equal to:
12 wherein when said glass substrate is a low strength glass substrate;
6 wherein when said glass substrate is an intermediate strength substrate; and
6 wherein when said glass substrate is a high strength glass substrate.
18. The system of claim 1 , wherein said ratio is substantially in a range between about:
2 and 8 wherein when said glass substrate is a low strength glass substrate;
2 and 6 wherein when said glass substrate is an intermediate strength substrate; and
1 and 4 wherein when said glass substrate is a high strength glass substrate.