Colour ILED display on silicon
A method of fabricating an image generator for use in a display, the method comprising: fabricating a plurality of discrete ILED array chips comprising a plurality of ILED emitters configured to produce light having the same wavelength, and wherein each of the plurality of ILED array chips is configured to produce light having one of a plurality of wavelengths; positioning the plurality of discrete ILED array chips on a carrier substrate such that a plurality of ILED emitters from adjacent chips form a pixel of a display; and bonding a first surface of the plurality of ILED array chips to a driver backplane such that electrical contacts of the plurality of ILED array chips are in electrical communication with the driver backplane, wherein the driver backplane comprises electronics for driving the ILED array chips.
1. A method of fabricating an image generator for use in a display, the method comprising:
fabricating a plurality of inorganic light emitting diode (ILED) array chips, each ILED array chip including a plurality of ILED emitters configured to produce light having the same wavelength, each ILED array chip being a different piece of semiconductor material;
positioning the plurality of ILED array chips on a carrier substrate to form a pixel of the display by a plurality of ILED emitters from adjacent ILED array chips, the plurality of ILED emitters of the plurality of ILED array chips configured to collectively produce light of different wavelengths for the pixel; and
bonding a first surface of the plurality of ILED array chips that form the pixel to a driver backplane to electrically connect electrical contacts of the plurality of ILED array chips with the driver backplane, the driver backplane comprising a circuit for driving the plurality of ILED array chips.
2. The method of claim 1 , wherein ILED array chips configured to emit light having a first wavelength are positioned on the carrier substrate in a first micro-assembly process, and wherein ILED array chips configured to emit light having a second wavelength are positioned on the carrier substrate in a second micro-assembly process.
3. The method of claim 1 , wherein the driver backplane includes a silicon wafer, a TFT backplane or ILED driver electronics.
4. The method of claim 1 , further comprising removing the carrier substrate from the plurality of ILED array chips bonded to the driver backplane.
5. The method according to claim 1 , wherein the carrier substrate is substantially transparent, and wherein a light emitting surface of the ILED array chips is facing the carrier substrate, the electrical contacts of the ILED array chips being located on a side of the ILED array chips opposite the light emitting surface.
6. The method according to claim 5 , wherein the carrier substrate is a cover glass for the image generator.
7. The method according to claim 6 , wherein the carrier substrate comprises glass, plastic material, or a transparent material.
8. The method according to claim 1 , wherein the carrier substrate is either flexible or rigid.
9. The method according to claim 1 , wherein the carrier substrate comprises one or more optical components configured to manipulate light emitted from the image generator.
10. The method according to claim 1 , wherein the plurality of ILED array chips is bonded to the carrier substrate using a bonding material.
11. The method according to claim 1 , wherein the plurality of ILED array chips comprises at least one ILED array chip configured to produce each of red, green or blue light.
12. The method according to claim 1 , further comprising forming the plurality of ILED array chips as a geometric shape capable of tessellation.
13. The method according to claim 12 , further comprising forming the plurality of ILED emitters at the corners of the plurality of ILED array chips.
14. The method according to claim 12 , further comprising bonding at least one of the plurality of ILED array chips at a corner of the image generator.
15. The method according to claim 1 , wherein the ILED array chips are bonded to the driver backplane using direct bonding interconnect.
16. The method according to claim 1 , further comprising providing electrical communication to the circuit to define a plurality of addressable pixels, wherein each addressable pixel comprises at least one ILED emitter from a plurality of adjacent ILED array chips.
17. The method according to claim 1 , wherein the driver backplane comprises an active backplane.
18. The method according to claim 17 , wherein the active backplane is fabricated with amorphous silicon (a-Si) or low temperature poly silicon (LTPS) or Metal Oxide (MO-TFTs).
19. The method according to claim 1 , wherein the ILED emitters are micro ILED emitters.
20. An image generator for use in a display, comprising:
inorganic light emitting diode (ILED) array chips configured to produce light having different wavelengths, each ILED array chip including ILED emitters configured to produce light having the same wavelength, each ILED array chip being a different piece of semiconductor material; and
a driver backplane bonded to the ILED array chips, the driver backplane connected to the ILED array chips to form a pixel of the display with a plurality of ILED emitters from adjacent ILED array chips, the plurality of ILED emitters from the adjacent ILED array chips each producing light having a different wavelength.
21. The image generator of claim 20 , wherein the ILED emitters comprise micro ILED emitters.
22. The image generator of claim 20 , further comprising a carrier substrate facing light emitting surfaces of the plurality of ILED array chips, the light emitting surfaces located on a side opposite of electrical contacts on the plurality of ILED array chips that connect the driver backplane to the plurality of ILED array chips.
23. A display, comprising:
inorganic light emitting diode (ILED) array chips configured to produce light having different wavelengths, each ILED array chip including ILED emitters configured to produce light having the same wavelength, each ILED array chip being a different piece of semiconductor material; and
a driver backplane bonded to the ILED array chips, the driver backplane connected to the ILED array chips to form a pixel of the display with a plurality of ILED emitters from adjacent ILED array chips, the plurality of ILED emitters from the adjacent ILED array chips each producing light having a different wavelength.