IP Library › Granted Patent US 10,110,840
Granted Patent B2
US 10,110,840 · App. 15/333,407 · Granted Oct 23, 2018

Image sensor pixels with overflow capabilities

Inventor: Sergey Velichko (Boise, ID)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H04N5/378H01L27/14627H01L27/14641H01L27/14656H04N5/2253H04N5/2254H04N5/23245H04N5/3532H04N5/3559H04N5/35554H04N5/35581H04N5/37452H04N5/359
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Quick Facts
Patent No.
US 10,110,840
App. No.
15/333,407
Granted
Oct 23, 2018
Kind
B2
Abstract

An image sensor pixel may include multiple split photodiodes that are covered by a single microlens. The image sensor may include a charge overflow capacitor coupled to a pixel charge storage within the image sensor via a gain control transistor. The image sensor pixel may have phase detection capabilities in a first mode of operation enabled by comparing phase signals generated from the split photodiodes. The image sensor pixel also may generate and readout image signals simultaneously in both rolling shutter operations and global shutter operations in a second mode of operation. The image sensor pixel may also generate an image using a linear combination of at least two signals read out using the charge overflow capacitor and light flickering mitigation operations. The image may be a high dynamic range image that is generated from at least a low exposure signal and a high exposure signal.

Claims (42)

1. An image sensor pixel comprising:

first and second photodiodes covered by a single microlens, wherein the first photodiode is configured to generate a first signal in response to incident light, wherein the second photodiode is configured to generate a second signal in response to the incident light, and wherein the first signal generated by the first photodiode and the second signal generated by the second photodiode are combined to generate a third signal that is used to generate a high dynamic range image in a mode of operation;

a pixel charge storage region coupled to the first photodiode via a first transfer transistor and coupled to the second photodiode via a second transfer transistor;

a capacitor coupled to the pixel charge storage region via a control transistor; and

a shutter transistor that couples the first photodiode to a voltage source, wherein the first signal is generated using light flickering mitigation operations that alternatingly enable the shutter transistor and the first transfer transistor.

2. The image sensor pixel defined in claim 1 , wherein the first signal generated by the first photodiode and the second signal generated by the second photodiode comprise phase signals in an additional mode of operation.

3. The image sensor pixel defined in claim 1 , wherein the first signal generated by the first photodiode is generated in global shutter operations and the second signal generated by the second photodiode is generated in rolling shutter operations in an additional mode of operation.

4. The image sensor pixel defined in claim 1 , further comprising:

an additional shutter transistor that couples the second photodiode to the voltage source, wherein the second signal is generated using light flickering mitigation operations that alternatingly enable the second shutter transistor and the second transfer transistor.

5. The image sensor pixel defined in claim 1 , wherein the control transistor is asserted when at least one of the first and second transfer transistors is asserted.

6. The image sensor pixel defined in claim 1 , wherein the first signal generated by the first photodiode is summed with the second signal generated by the second photodiode at the pixel charge storage region by simultaneously asserting the first and second transfer transistors.

7. The image sensor pixel defined in claim 6 , wherein the first and second signals are generated while an overflow signal is read out during a correlated readout operation.

8. The image sensor pixel defined in claim 7 , wherein the overflow signal is generated by the first and second photodiodes using light flickering mitigation operations.

9. The image sensor pixel defined in claim 1 , further comprising:

an additional capacitor that is coupled to the pixel charge storage region via an additional control transistor, wherein the first signal generated by the first photodiode is stored at the capacitor, and wherein the second signal generated by the second photodiode is stored at the additional capacitor.

10. The image sensor pixel defined in claim 1 , wherein the pixel charge storage region is a floating diffusion region.

11. The image sensor pixel defined in claim 1 , wherein the pixel charge storage region is a pinned storage diode.

12. The image sensor pixel defined in claim 1 , wherein the pixel charge storage region is a storage gate.

13. A method of operating an image pixel that includes a photosensitive region, a microlens formed over the photosensitive region, a charge storage region coupled to the photosensitive region via a transfer transistor, and a capacitor coupled to the charge storage region via a control transistor, the method comprising:

with the photosensitive region, accumulating charge in response to incident light; and

using the transfer transistor, transferring an overflow portion of the charge accumulated with the photosensitive region to the charge storage region and the capacitor by simultaneously asserting the transfer transistor and the control transistor, wherein transferring the overflow portion of the charge accumulated with the photosensitive region to the charge storage region and the capacitor comprises leaving a leftover portion of the charge accumulated with the photosensitive region at the photosensitive region.

14. The method defined in claim 13 , wherein the image pixel further includes a shutter transistor, the method further comprising:

asserting the shutter transistor before simultaneously asserting the transfer transistor and the control transistor.

15. The method defined in claim 13 , further comprising:

generating a high exposure signal based on the overflow portion of the charge accumulated with the photosensitive region.

16. The method defined in claim 15 , further comprising:

generating a low exposure signal based on the leftover portion of the charge accumulated with the photosensitive region.

17. The method defined in claim 16 , wherein the image pixel further includes an additional photosensitive region, the microlens formed over the additional photosensitive regions, and an additional transfer transistor that couples the charge storage region to the additional photosensitive region, the method further comprising:

asserting the additional transfer transistor while the transfer transistor is not asserted; and

asserting the control transistor while asserting the additional transfer transistor.

18. A system, comprising:

a central processing unit;

memory;

a lens;

input-output circuitry; and

an image pixel that generates phase signals in a first mode of operation and image signals in a second mode of operation, wherein the image pixel comprises:

a first photosensitive region that generates charge in response to light, wherein a microlens is formed over the first photosensitive region;

a second photosensitive region that generates charge in response to light, wherein the microlens is formed over the second photosensitive region;

a pixel charge storage region;

a capacitor that extends a storage capacity of the pixel charge storage region when a control transistor is asserted; and

readout circuitry that performs readout operations based on the charge generated by the first photosensitive region and the charge generated by the second photosensitive region, wherein the charge generated by the first photosensitive region occurs during a first integration period, wherein the charge generated by the second photosensitive region occurs during a second integration period that only partially overlaps the first integration period, and wherein the readout circuitry is configured to sequentially perform readout operations for the charge generated by the first photosensitive region and the charge generated by the second photosensitive region in a mode of readout operation.

19. The system defined in claim 18 , wherein the readout circuitry is configured to simultaneously perform readout operations for the charge generated by the first photodiode and the charge generated by the second photodiode in an additional mode of readout operation.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 054090, FRAME 0617 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →
SECURITY INTEREST Recorded Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2016
From: VELICHKO, SERGEY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 040117/0205 →
Continuity (1)
Related Publication 20180115730A1 · Apr 26, 2018
Cited By (5)
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