IP Library Granted Patent US 9,887,307
Granted Patent B2
US 9,887,307 · App. 15/334,877 · Granted Feb 6, 2018

Diode barrier infrared detector devices and barrier superlattice structures

Inventor: Yajun Wei (Cincinnati, OH)
Assignee: L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORPORATION
H01L31/035236H01L31/02005H01L31/03046H01L31/101Y02E10/544
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Quick Facts
Patent No.
US 9,887,307
App. No.
15/334,877
Granted
Feb 6, 2018
Kind
B2
Abstract

Diode barrier infrared detector devices and superlattice barrier structures are disclosed. In one embodiment, a diode barrier infrared detector device includes a first contact layer, an absorber layer adjacent to the first contact layer, and a barrier layer adjacent to the absorber layer, and a second contact layer adjacent to the barrier layer. The barrier layer includes a diode structure formed by a p-n junction formed within the barrier layer. The barrier layer may be such that there is substantially no barrier to minority carrier holes. In another embodiment, a diode barrier infrared detector device includes a first contact layer, an absorber layer adjacent to the first contact layer, a barrier layer adjacent to the absorber layer, and a diode structure adjacent to the barrier layer. The diode structure includes a second contact layer.

Claims (13)

1. A diode barrier infrared detector device utilizing a p-type absorber comprising:

a first contact layer, wherein the first contact layer is doped p-type;

an absorber layer adjacent to the first contact layer, wherein the absorber layer is doped p-type;

a barrier layer adjacent to the absorber layer;

a p-type material layer adjacent to the barrier layer; and

a second contact layer adjacent to the p-type material layer, wherein the second contact layer is n-doped.

2. The diode barrier infrared detector device of claim 1 , wherein the p-type material layer and the second contact layer comprise a material having a wider bandgap than a material of the absorber layer.

3. The diode barrier infrared detector device of claim 1 , further comprising a nominally undoped i region disposed between the p-type material layer and the second contact layer.

4. The diode barrier infrared detector device of claim 1 , further comprising a nominally undoped graded gap section disposed between the p-type material layer and the second contact layer.

5. The diode barrier infrared detector device of claim 4 , wherein a bandgap of the undoped graded gap section is varied from a bandgap of the p-type material layer to a bandgap of the second contact layer.

6. The diode barrier infrared detector device of claim 1 , wherein the absorber layer is an InAs/InAsSb superlattice structure.

7. The diode barrier infrared detector device of claim 1 , wherein the p-type material layer and the second contact layer form a p-n junction.

8. The diode barrier infrared detector device of claim 7 , wherein a p-doping profile within the p-n junction region is such that a conduction band edge of the p-type material layer is higher than a conduction band edge of the absorber layer.

Assignments (3)
CHANGE OF NAME Recorded Dec 22, 2022
From: L3 CINCINNATI ELECTRONICS CORPORATION
To: L3HARRIS CINCINNATI ELECTRONICS CORPORATION
Reel/Frame 062206/0635 →
CHANGE OF NAME Recorded Feb 6, 2018
From: L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORPORATION
To: L3 CINCINNATI ELECTRONICS CORPORATION
Reel/Frame 045261/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2016
From: WEI, YAJUN
To: L-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORPORATION
Reel/Frame 040140/0875 →
Continuity (2)
Continuation 14271908 · May 7, 2014
Related Publication 20170047461A1 · Feb 16, 2017