Well-based vertical hall element with enhanced magnetic sensitivity
A vertical Hall element and method of fabricating are disclosed. The method includes forming a buried region having a first conductivity type in a substrate having a second conductivity type and implanting a dopant of the first conductivity type into a well region between the top surface of the substrate and the buried region. The buried region has a doping concentration increasing with an increasing depth from a top surface of the substrate and the well region has a doping concentration decreasing from the top surface of the substrate to the buried region. The method includes forming first through fifth contacts on the well region. First and second contacts define a conductive path and second and third contacts define another conductive path through the well region. The fourth contact is formed between first and second contacts and the fifth contact is formed between second and third contacts.
1. A method of fabricating a vertical Hall element, the method comprising:
forming a buried region having a first dopant of a first conductivity type in a substrate having a second conductivity type opposite the first conductivity type, the buried region having a first doping concentration increasing with an increasing depth extended from a top surface of the substrate;
implanting a second dopant of the first conductivity type into a well region between the top surface of the substrate and the buried region, the well region having a second doping concentration decreasing from the top surface of the substrate to the buried region;
forming first, second and third contacts on a top surface of the well region, the first and second contacts defining a first conductive path through the well region, the second and third contacts defining a second conductive path through the well region;
forming a fourth contact on the well region between the first and second contacts; and
forming a fifth contact on the well region between the second and third contacts.
2. A method of fabricating a vertical Hall element, the method comprising:
implanting a first dopant into a predefined region of the substrate to form a buried region having a first dopant of a first conductivity type in a substrate having a second conductivity type opposite the first conductivity type;
annealing the substrate and diffusing the implanted dopant, the buried region having a first doping concentration increasing with an increasing depth extended from a top surface of the substrate;
growing an epitaxial layer on the substrate and driving the implanted dopant into the epitaxial layer to form the buried region, the epitaxial layer having the second conductivity type;
implanting a second dopant of the first conductivity type into a well region between the top surface of the epitaxial layer and the buried region, the well region having a second doping concentration decreasing from the top surface of the epitaxial layer to the buried region;
forming first, second and third contacts on a top surface of the well region, the first and second contacts defining a first conductive path through the well region, the second and third contacts defining a second conductive path through the well region;
forming a fourth contact on the well region between the first and second contacts; and
forming a fifth contact on the well region between the second and third contacts.
3. The method as recited in claim 1 further comprising forming an isolation structure at the surface of the substrate, the isolation structure defining openings through which the first, second, third, fourth and fifth contacts and a plurality of contacts having the second conductivity type are formed.
4. The method as recited in claim 3 further comprising implanting a third dopant having the first conductivity type through openings in a first photoresist layer to form the first, second, third, fourth, and fifth contacts.
5. The method as recited in claim 4 further comprising implanting a fourth dopant having the second conductivity type through openings in a second photoresist layer to form the plurality of contacts around an outside perimeter of the well region.
6. The method as recited in claim 5 wherein the forming a buried region comprises implanting antimony at a dosage of between approximately 8×10 14 / cm 2 and approximately 5×10 15 /cm 2 and energy of between approximately 60 KeV and 150 KeV.
7. The method as recited in claim 5 wherein the forming a buried region comprises implanting antimony at a dosage of approximately 3×10 15 /cm 2 and energy of 60 KeV.
8. The method as recited in claim 5 further comprising, subsequent to implanting the first dopant, annealing the substrate at temperatures that range from approximately 550° C. to 1150° C. for a period totaling approximately 590 minutes.
9. The method as recited in claim 5 wherein implanting the second dopant comprises implanting phosphorus at a dosage of approximately 2×10 11 /cm 2 and energy of 2 MeV and implanting arsenic at a dosage of approximately 3×10 12 /cm 2 and energy of 160 KeV.
10. The method as recited in claim 9 further comprising, subsequent to implanting the second dopant, annealing the substrate at temperatures that range from approximately 750° C. to 1150° C. for a period totaling approximately 534 minutes.
11. The method as recited in claim 5 wherein implanting the third dopant comprises implanting arsenic at a dosage of 1×10 15 /cm 2 and energy of 50 KeV and implanting phosphorus at a dosage of 1×10 14 /cm 2 and energy of 70 KeV.
12. The method as recited in claim 5 wherein implanting the fourth dopant comprises implanting boron at a dosage of 2.3×10 15 /cm 2 and energy of 10 KeV.
13. The method as recited in claim 2 further comprising forming an isolation structure at the surface of the epitaxial layer, the isolation structure defining openings through which the first, second, third, fourth and fifth contacts and a plurality of contacts having the second conductivity type are formed.
14. The method as recited in claim 13 further comprising implanting a third dopant having the first conductivity type through openings in a first photoresist layer to form the first, second, third, fourth, and fifth contacts.
15. The method as recited in claim 14 further comprising implanting a fourth dopant having the second conductivity type through openings in a second photoresist layer to form the plurality of contacts around an outside perimeter of the well region.
16. The method as recited in claim 2 wherein the forming a buried region comprises implanting antimony at a dosage of between approximately 8×10 14 /cm 2 and approximately 5×10 15 /cm 2 and energy of between approximately 60 KeV and 150 KeV.
17. The method as recited in claim 2 wherein the forming a buried region comprises implanting antimony at a dosage of approximately 3×10 15 /cm 2 and energy of 60 KeV.
18. The method as recited in claim 2 further comprising, subsequent to implanting the first dopant, annealing the substrate at temperatures that range from approximately 550° C. to 1150° C. for a period totaling approximately 590 minutes.
19. The method as recited in claim 2 wherein implanting the second dopant comprises implanting phosphorus at a dosage of approximately 2×10 11 /cm 2 and energy of 2 MeV and implanting arsenic at a dosage of approximately 3×10 12 /cm 2 and energy of 160 KeV.
20. The method as recited in claim 2 further comprising, subsequent to implanting the second dopant, annealing the substrate at temperatures that range from approximately 750° C. to 1150° C. for a period totaling approximately 534 minutes.
21. The method as recited in claim 20 further comprising, subsequent to implanting the second dopant, annealing the substrate at temperatures that range from approximately 750° C. to 1150° C. for a period totaling approximately 534 minutes.
22. The method as recited in claim 14 wherein implanting the third dopant comprises implanting arsenic at a dosage of 1×10 15 /cm 2 and energy of 50 KeV and implanting phosphorus at a dosage of 1×10 14 /cm 2 and energy of 70 KeV.
23. The method as recited in claim 15 wherein implanting the fourth dopant comprises implanting boron at a dosage of 2.3×10 15 /cm 2 and energy of 10 KeV.
24. A method of fabricating a vertical Hall element, the method comprising:
forming a buried region having a first dopant of a first conductivity type in a substrate having a second conductivity type opposite the first conductivity type, the buried region having a first doping concentration increasing with an increasing depth extended from a top surface of the substrate;
implanting a second dopant of the first conductivity type into a well region in an epitaxial layer on top of the substrate, between a top surface of the epitaxial layer and the buried region, the well region having a second doping concentration decreasing from the top surface of the epitaxial layer to the buried region;
forming first, second and third contacts on a top surface of the well region, the first and second contacts defining a first conductive path through the well region, the second and third contacts defining a second conductive path through the well region;
forming a fourth contact on the well region between the first and second contacts; and
forming a fifth contact on the well region between the second and third contacts.
25. A vertical Hall element, comprising:
a buried region having a first dopant of a first conductivity type in a substrate having a second conductivity type opposite the first conductivity type, the buried region having a first doping concentration increasing with an increasing depth extended from a top surface of the substrate;
a well region, having a second dopant of the first conductivity type, between the top surface of the substrate and the buried region, the well region having a second doping concentration decreasing from the top surface of the substrate to the buried region;
first, second and third contacts on a top surface of the well region, the first and second contacts defining a first conductive path through the well region, the second and third contacts defining a second conductive path through the well region;
a fourth contact on the well region between the first and second contacts; and
a fifth contact on the well region between the second and third contacts.
26. A vertical Hall element, comprising:
a buried region having a first dopant of a first conductivity type in a substrate having a second conductivity type opposite the first conductivity type, the buried region having a first doping concentration increasing with an increasing depth extended from a top surface of the substrate;
an epitaxial layer on a top surface of the substrate, the epitaxial layer having the second conductivity type;
a well region between the top surface of the epitaxial layer and the buried region, the well region having a second doping concentration decreasing from the top surface of the epitaxial layer to the buried region;
first, second and third contacts on a top surface of the well region, the first and second contacts defining a first conductive path through the well region, the second and third contacts defining a second conductive path through the well region;
a fourth contact on the well region between the first and second contacts; and
a fifth contact on the well region between the second and third contacts.